| 8350375 |
Flipchip bump patterns for efficient I-mesh power distribution schemes |
Kalyan Doddapaneni, Wilson Wai Sing Leung |
2013-01-08 |
| 8151237 |
Disabling unused IO resources in platform-based integrated circuits |
Julie Beatty, Kalyan Doddapaneni |
2012-04-03 |
| 8115321 |
Separate probe and bond regions of an integrated circuit |
Kalyan Doddapaneni, Gokulnath Sulur, Wilson Wai Sing Leung, Tauman T. Lau |
2012-02-14 |
| 7863716 |
Method and apparatus of power ring positioning to minimize crosstalk |
Tauman T. Lau, Kalyan Doddapaneni |
2011-01-04 |
| 7737564 |
Power configuration method for structured ASICs |
Tauman T. Lau, Kalyan Doddapaneni |
2010-06-15 |
| 7569472 |
Method and apparatus of power ring positioning to minimize crosstalk |
Tauman T. Lau, Kalyan Doddapaneni |
2009-08-04 |
| 7554133 |
Pad current splitting |
Nenad Miladinovic, Kalyan Doddapaneni |
2009-06-30 |
| 7430730 |
Disabling unused IO resources in platform-based integrated circuits |
Julie Beatty, Kalyan Doddapaneni |
2008-09-30 |
| 7328417 |
Cell-based method for creating slotted metal in semiconductor designs |
Tauman T. Lau, Kalyan Doddapaneni |
2008-02-05 |
| 7117467 |
Methods for optimizing package and silicon co-design of integrated circuit |
Stan Mihelcic, James G. Monthie |
2006-10-03 |
| 7107561 |
Method of sizing via arrays and interconnects to reduce routing congestion in flip chip integrated circuits |
Wei-Ming Huang |
2006-09-12 |
| 7075179 |
System for implementing a configurable integrated circuit |
Julie Beatty, Kalyan Doddapaneni |
2006-07-11 |
| 6998638 |
Test structure for detecting bonding-induced cracks |
Qwai H. Low, Ramaswamy Ranganathan, Tauman T. Lau |
2006-02-14 |
| 6836026 |
Integrated circuit design for both input output limited and core limited integrated circuits |
Tauman T. Lau, Max M. Young |
2004-12-28 |
| 6815812 |
Direct alignment of contacts |
Ken Nguyen, Max M. Yeung |
2004-11-09 |
| 6798069 |
Integrated circuit having adaptable core and input/output regions with multi-layer pad trace conductors |
Tauman T. Lau, Kalyan Doddapaneni |
2004-09-28 |
| 6784102 |
Laterally interconnecting structures |
Max M. Yeung, Tauman T. Lau |
2004-08-31 |
| 6781228 |
Donut power mesh scheme for flip chip package |
Hiroshi Ishikawa, Thomas Antisseril, Radoslav Ratchkov, Bo Shen, Prasad Subbarao +2 more |
2004-08-24 |
| 6781150 |
Test structure for detecting bonding-induced cracks |
Qwai H. Low, Ramaswamy Ranganathan, Tauman T. Lau |
2004-08-24 |
| 6768142 |
Circuit component placement |
Tauman T. Lau, Max M. Yeung, Ken Nguyen, Wei-Ming Huang |
2004-07-27 |
| 6704918 |
Integrated circuit routing |
Virendra Patel |
2004-03-09 |
| 6683476 |
Contact ring architecture |
Tauman T. Lau, Max M. Yeung |
2004-01-27 |
| 6671865 |
High density input output |
Farshad Ghahghahi, Edwin M. Fulcher |
2003-12-30 |
| 6657870 |
Die power distribution system |
Benjamin Mbouombouo, Max M. Yeung |
2003-12-02 |
| 6591410 |
Six-to-one signal/power ratio bump and trace pattern for flip chip design |
Mike Liang, Bing-Wei Yi |
2003-07-08 |
