Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538790 | Extended HBM offsets in 2.5D interposers | Mohamed Anwar Ali, Thinh Tran | 2022-12-27 |
| 8115321 | Separate probe and bond regions of an integrated circuit | Anwar Ali, Kalyan Doddapaneni, Gokulnath Sulur, Wilson Wai Sing Leung | 2012-02-14 |
| 7863716 | Method and apparatus of power ring positioning to minimize crosstalk | Anwar Ali, Kalyan Doddapaneni | 2011-01-04 |
| 7737564 | Power configuration method for structured ASICs | Anwar Ali, Kalyan Doddapaneni | 2010-06-15 |
| 7569472 | Method and apparatus of power ring positioning to minimize crosstalk | Anwar Ali, Kalyan Doddapaneni | 2009-08-04 |
| 7328417 | Cell-based method for creating slotted metal in semiconductor designs | Anwar Ali, Kalyan Doddapaneni | 2008-02-05 |
| 6998638 | Test structure for detecting bonding-induced cracks | Qwai H. Low, Ramaswamy Ranganathan, Anwar Ali | 2006-02-14 |
| 6963138 | Dielectric stack | Qwai H. Low, Chok J. Chia, Ramaswamy Ranganathan | 2005-11-08 |
| 6836026 | Integrated circuit design for both input output limited and core limited integrated circuits | Anwar Ali, Max M. Young | 2004-12-28 |
| 6798069 | Integrated circuit having adaptable core and input/output regions with multi-layer pad trace conductors | Anwar Ali, Kalyan Doddapaneni | 2004-09-28 |
| 6784102 | Laterally interconnecting structures | Max M. Yeung, Anwar Ali | 2004-08-31 |
| 6781150 | Test structure for detecting bonding-induced cracks | Qwai H. Low, Ramaswamy Ranganathan, Anwar Ali | 2004-08-24 |
| 6768142 | Circuit component placement | Anwar Ali, Max M. Yeung, Ken Nguyen, Wei-Ming Huang | 2004-07-27 |
| 6683476 | Contact ring architecture | Anwar Ali, Max M. Yeung | 2004-01-27 |