Issued Patents All Time
Showing 1–25 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11929337 | 3D-interconnect | Chok J. Chia, Patrick Variot | 2024-03-12 |
| 11031362 | 3D-interconnect | Chok J. Chia, Patrick Variot | 2021-06-08 |
| 10181447 | 3D-interconnect | Chok J. Chia, Patrick Variot | 2019-01-15 |
| 9875955 | Low cost hybrid high density package | Kishor Desai, Chok J. Chia, Charles G. Woychik, Huailiang Wei | 2018-01-23 |
| 9508687 | Low cost hybrid high density package | Kishor Desai, Chok J. Chia, Charles G. Woychik, Huailiang Wei | 2016-11-29 |
| 8963310 | Low cost hybrid high density package | Kishor Desai, Chok J. Chia, Charles G. Woychik, Huailiang Wei | 2015-02-24 |
| 8869389 | Method of manufacturing an electronic device package | Larry Golick, John W. Osenbach, Matthew E. Stahley | 2014-10-28 |
| 8525309 | Flip-chip QFN structure using etched lead frame | Chok J. Chia, Kishor Desai, Charles G. Woychik | 2013-09-03 |
| 8525312 | Area array quad flat no-lead (QFN) package | Chok J. Chia, Kishor Desai, Charles G. Woychik, Huailiang Wei | 2013-09-03 |
| 8384205 | Electronic device package and method of manufacture | Patrick Variot | 2013-02-26 |
| 8350379 | Package with power and ground through via | Chengyu Guo | 2013-01-08 |
| 8334467 | Lead frame design to improve reliability | Larry Golick, John W. Osenbach, Matthew E. Stahley | 2012-12-18 |
| 8134232 | Heat dissipation for integrated circuit | Mitchel E. Lohr | 2012-03-13 |
| 8125091 | Wire bonding over active circuits | — | 2012-02-28 |
| 7993981 | Electronic device package and method of manufacture | Patrick Variot | 2011-08-09 |
| 7531442 | Eliminate IMC cracking in post wirebonded dies: macro level stress reduction by modifying dielectric/metal film stack in be layers during Cu/Low-K processing | Jayanthi Pallinti, Dilip Vijay, Hemanshu Bhatt, Sey-Shing Sun, Hong Ying +3 more | 2009-05-12 |
| 7420809 | Heat spreader in integrated circuit package | Hong T. Lim, Maurice Othieno | 2008-09-02 |
| 7235889 | Integrated heatspreader for use in wire bonded ball grid array semiconductor packages | Maurice Othieno, Hong T. Lim | 2007-06-26 |
| 6998638 | Test structure for detecting bonding-induced cracks | Ramaswamy Ranganathan, Anwar Ali, Tauman T. Lau | 2006-02-14 |
| 6963138 | Dielectric stack | Chok J. Chia, Ramaswamy Ranganathan, Tauman T. Lau | 2005-11-08 |
| 6861343 | Buffer metal layer | Chok J. Chia, Ramaswamy Ranganathan | 2005-03-01 |
| 6861748 | Test structure | Ramaswamy Ranganathan, Rey Torcuato | 2005-03-01 |
| 6825563 | Slotted bonding pad | Ramaswamy Ranganathan, Maurice Othieno | 2004-11-30 |
| 6798035 | Bonding pad for low k dielectric | Ramaswamy Ranganathan, Edwin M. Fulcher | 2004-09-28 |
| 6781150 | Test structure for detecting bonding-induced cracks | Ramaswamy Ranganathan, Anwar Ali, Tauman T. Lau | 2004-08-24 |