Issued Patents All Time
Showing 1–25 of 79 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10678005 | Optically aligned hybrid semiconductor device and method | David Henry Kinghorn, Ari Novack, Holger N. Klein, Nathan A. Nuttall, Daniel J. Blumenthal +2 more | 2020-06-09 |
| 10319673 | Low CTE interposer | Belgacem Haba | 2019-06-11 |
| 10222565 | Optically aligned hybrid semiconductor device and method | David Henry Kinghorn, Ari Novack, Holger N. Klein, Nathan A. Nuttall, Daniel J. Blumenthal +2 more | 2019-03-05 |
| 9875955 | Low cost hybrid high density package | Qwai H. Low, Chok J. Chia, Charles G. Woychik, Huailiang Wei | 2018-01-23 |
| 9837344 | Low CTE interposer | Belgacem Haba | 2017-12-05 |
| 9817197 | Optically aligned hybrid semiconductor device and method | David Henry Kinghorn, Ari Novack, Holger N. Klein, Nathan A. Nuttall, Daniel J. Blumenthal +2 more | 2017-11-14 |
| 9575266 | Molded glass lid for wafer level packaging of opto-electronic assemblies | Ravinder Kachru, Vipulkumar Patel, Bipin Dama, Kalpendu Shastri, Soham Pathak | 2017-02-21 |
| 9557499 | Coupling light from a waveguide array to single mode fiber array | Ravinder Kachru, Chris Togami | 2017-01-31 |
| 9508687 | Low cost hybrid high density package | Qwai H. Low, Chok J. Chia, Charles G. Woychik, Huailiang Wei | 2016-11-29 |
| 9435965 | Single mode fiber array connector for opto-electronic transceivers | Chris Togami, Soham Pathak, Kalpendu Shastri, Bipin Dama, Vipulkumar Patel +1 more | 2016-09-06 |
| 9433100 | Low-stress TSV design using conductive particles | Charles G. Woychik, Ilyas Mohammed, Terrence Caskey | 2016-08-30 |
| 9417412 | Arrangement for placement and alignment of opto-electronic components | Kalpendu Shastri, Ravinder Kachru | 2016-08-16 |
| 9401288 | Low CTE interposer | Belgacem Haba | 2016-07-26 |
| 9349669 | Reduced stress TSV and interposer structures | Cyprian Emeka Uzoh, Charles G. Woychik, Terrence Caskey, Huailiang Wei, Craig Mitchell +1 more | 2016-05-24 |
| 9343450 | Wafer scale packaging platform for transceivers | Kalpendu Shastri, Vipulkumar Patel, Mark A. Webster, Prakash Gothoskar, Ravinder Kachru +5 more | 2016-05-17 |
| 9274290 | Coupling light from a waveguide array to single mode fiber array | Ravinder Kachru, Chris Togami | 2016-03-01 |
| 9235019 | Self-aligning optical connector assembly | Kalpendu Shastri, Soham Pathak, Utpal Kumar Chakrabarti, Vipulkumar Patel, Bipin Dama +1 more | 2016-01-12 |
| 9213152 | Releasable fiber connector for opto-electronic assemblies | Kalpendu Shastri, Soham Pathak, John Fangman, Vipulkumar Patel, Ravinder Kachru | 2015-12-15 |
| 9196581 | Flow underfill for microelectronic packages | Belgacem Haba, Ilyas Mohammed, Ellis Chau, Sang Il Lee | 2015-11-24 |
| 9151950 | Lid design to seal optical components of a transceiver module | Ravinder Kachru, Soham Pathak, Utpal Kumar Chakrabarti | 2015-10-06 |
| 9052445 | Molded glass lid for wafer level packaging of opto-electronic assemblies | Ravinder Kachru, Vipulkumar Patel, Bipin Dama, Kalpendu Shastri, Soham Pathak | 2015-06-09 |
| 9031107 | Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic components | Kalpendu Shastri, Soham Pathak, Vipulkumar Patel, Bipin Dama | 2015-05-12 |
| 9000600 | Reduced stress TSV and interposer structures | Cyprian Emeka Uzoh, Charles G. Woychik, Terrence Caskey, Huailiang Wei, Craig Mitchell +1 more | 2015-04-07 |
| 8963310 | Low cost hybrid high density package | Qwai H. Low, Chok J. Chia, Charles G. Woychik, Huailiang Wei | 2015-02-24 |
| 8905632 | Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic components | Kalpendu Shastri, Soham Pathak, Vipulkumar Patel, Bipin Dama | 2014-12-09 |