Issued Patents All Time
Showing 1–25 of 124 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302616 | Integrated interposer solutions for 2D and 3D IC packaging | Hong Shen, Arkalgud R. Sitaram, Guilian Gao | 2022-04-12 |
| 11205600 | Integrated circuits protected by substrates with cavities, and methods of manufacture | Hong Shen, Sitaram Arkalgud | 2021-12-21 |
| 10586785 | Embedded graphite heat spreader for 3DIC | Guilian Gao, Cyprian Emeka Uzoh, Liang Wang | 2020-03-10 |
| 10522457 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun, Liang Wang +1 more | 2019-12-31 |
| 10475733 | Method and structures for heat dissipating interposers | Cyprian Emeka Uzoh, Pezhman Monadgemi, Terrence Caskey, Fatima Lina Ayatollahi, Belgacem Haba +1 more | 2019-11-12 |
| 10446456 | Integrated circuits protected by substrates with cavities, and methods of manufacture | Hong Shen, Arkalgud R. Sitaram | 2019-10-15 |
| 10440822 | Interposers with electrically conductive features having different porosities | Bong-Sub Lee, Cyprian Emeka Uzoh, Liang Wang, Laura Wills Mirkarimi, Arkalgud R. Sitaram | 2019-10-08 |
| 10396114 | Method of fabricating low CTE interposer without TSV structure | Cyprian Emeka Uzoh, Michael Newman, Terrence Caskey | 2019-08-27 |
| 10381326 | Structure and method for integrated circuits packaging with increased density | Arkalgud R. Sitaram, Andrew Cao, Bong-Sub Lee | 2019-08-13 |
| 10325880 | Hybrid 3D/2.5D interposer | Cyprian Emeka Uzoh, Sangil Lee, Liang Wang, Guilian Gao | 2019-06-18 |
| 10297582 | BVA interposer | Terrence Caskey, Ilyas Mohammed, Cyprian Emeka Uzoh, Michael Newman, Pezhman Monadgemi +3 more | 2019-05-21 |
| 10256177 | Integrated interposer solutions for 2D and 3D IC packaging | Hong Shen, Arkalgud R. Sitaram, Guilian Gao | 2019-04-09 |
| 10181411 | Method for fabricating a carrier-less silicon interposer | Michael Newman, Cyprian Emeka Uzoh, Pezhman Monadgemi, Terrence Caskey | 2019-01-15 |
| 10177114 | Hybrid 3D/2.5D interposer | Cyprian Emeka Uzoh, Sangil Lee, Liang Wang, Guilian Gao | 2019-01-08 |
| 10177086 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun, Liang Wang +1 more | 2019-01-08 |
| 10103094 | Method and structures for heat dissipating interposers | Cyprian Emeka Uzoh, Pezhman Monadgemi, Terrence Caskey, Fatima Lina Ayatollahi, Belgacem Haba +1 more | 2018-10-16 |
| 9991231 | Stacked die integrated circuit | Cyprian Emeka Uzoh, Ron Zhang, Daniel Buckminster, Guilian Gao | 2018-06-05 |
| 9953957 | Embedded graphite heat spreader for 3DIC | Guilian Gao, Cyprian Emeka Uzoh, Liang Wang | 2018-04-24 |
| 9953910 | Demountable interconnect structure | Raymond Albert Fillion | 2018-04-24 |
| 9947618 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun, Liang Wang +1 more | 2018-04-17 |
| 9905507 | Circuit assemblies with multiple interposer substrates, and methods of fabrication | Hong Shen, Zhuowen Sun, Arkalgud R. Sitaram | 2018-02-27 |
| 9899281 | Integrated circuits protected by substrates with cavities, and methods of manufacture | Hong Shen, Arkalgud R. Sitaram | 2018-02-20 |
| 9893030 | Reliable device assembly | Cyprian Emeka Uzoh, Belgacem Haba, Michael Newman, Terrence Caskey | 2018-02-13 |
| 9887166 | Integrated circuit assemblies with reinforcement frames, and methods of manufacture | Rajesh Katkar, Laura Wills Mirkarimi, Arkalgud R. Sitaram | 2018-02-06 |
| 9875955 | Low cost hybrid high density package | Kishor Desai, Qwai H. Low, Chok J. Chia, Huailiang Wei | 2018-01-23 |