| 12494453 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hisashi Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Chieh Wang +6 more |
2025-12-09 |
|
| 12488508 |
Compressive sensing based image processing |
— |
2025-12-02 |
|
| 12401010 |
3D processor having stacked integrated circuit die |
Steven Teig, Kenneth Duong, Javier A. Delacruz |
2025-08-26 |
|
| 12381119 |
Seal for microelectronic assembly |
Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao |
2025-08-05 |
|
| 12353340 |
Systems for high-speed computing using an optical interchange |
Horia Alexandru Toma, Zuowei Shen, William Frank Edwards, Gurushankar Rajamani, Hong Liu |
2025-07-08 |
|
| 12322667 |
Seal for microelectronic assembly |
Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao |
2025-06-03 |
|
| 12293993 |
3D chip sharing data bus |
Javier A. Delacruz, Steven Teig |
2025-05-06 |
|
| 12278215 |
Integrated voltage regulator and passive components |
Javier A. Delacruz, Don Draper, Belgacem Haba |
2025-04-15 |
|
| 12270970 |
Direct-bonded lamination for improved image clarity in optical devices |
Belgacem Haba, Rajesh Katkar |
2025-04-08 |
|
| 12218059 |
Stacked IC structure with orthogonal interconnect layers |
Steven Teig, Javier A. Delacruz |
2025-02-04 |
|
| RE50272 |
Remote optical engine for virtual reality or augmented reality headsets |
Belgacem Haba, Rajesh Katkar |
2025-01-14 |
|
| 12191267 |
Nanowire bonding interconnect for fine-pitch microelectronics |
Belgacem Haba |
2025-01-07 |
|
| 12142528 |
3D chip with shared clock distribution network |
Javier A. Delacruz, Steven Teig, Eric Nequist |
2024-11-12 |
|
| 12136605 |
Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same |
Guilian Gao, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi, Rajesh Katkar, Cyprian Emeka Uzoh |
2024-11-05 |
|
| 12124035 |
Stretchable film assembly with conductive traces |
Belgacem Haba, Gabriel Z. Guevara, Min Tao |
2024-10-22 |
|
| 12057383 |
Bonded structures with integrated passive component |
Belgacem Haba, Rajesh Katkar, Gabriel Z. Guevara, Javier A. Delacruz, Shaowu Huang +1 more |
2024-08-06 |
|
| 11914148 |
Stacked optical waveguides |
Rajesh Katkar, Belgacem Haba |
2024-02-27 |
|
| 11894345 |
Integrated voltage regulator and passive components |
Javier A. Delacruz, Don Draper, Belgacem Haba |
2024-02-06 |
|
| 11881454 |
Stacked IC structure with orthogonal interconnect layers |
Steven Teig, Javier A. Delacruz |
2024-01-23 |
|
| 11862604 |
Systems and methods for releveled bump planes for chiplets |
Javier A. Delacruz, Belgacem Haba, Cyprian Emeka Uzoh, Rajesh Katkar |
2024-01-02 |
|
| 11830845 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2023-11-28 |
$9,095,000 |
| 11830804 |
Over and under interconnects |
Belgacem Haba, Stephen L. Morein, Rajesh Katkar, Javier A. Delacruz |
2023-11-28 |
|
| 11824042 |
3D chip sharing data bus |
Javier A. Delacruz, Steven Teig |
2023-11-21 |
|
| 11817409 |
Directly bonded structures without intervening adhesive and methods for forming the same |
Belgacem Haba, Rajesh Katkar, Javier A. Delacruz |
2023-11-14 |
|
| 11626363 |
Bonded structures with integrated passive component |
Belgacem Haba, Rajesh Katkar, Gabriel Z. Guevara, Javier A. Delacruz, Shaowu Huang +1 more |
2023-04-11 |
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