Issued Patents All Time
Showing 25 most recent of 278 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12401010 | 3D processor having stacked integrated circuit die | Steven Teig, Kenneth Duong, Javier A. Delacruz | 2025-08-26 |
| 12381119 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao | 2025-08-05 |
| 12353340 | Systems for high-speed computing using an optical interchange | Horia Alexandru Toma, Zuowei Shen, William Frank Edwards, Gurushankar Rajamani, Hong Liu | 2025-07-08 |
| 12322667 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao | 2025-06-03 |
| 12293993 | 3D chip sharing data bus | Javier A. Delacruz, Steven Teig | 2025-05-06 |
| 12278215 | Integrated voltage regulator and passive components | Javier A. Delacruz, Don Draper, Belgacem Haba | 2025-04-15 |
| 12270970 | Direct-bonded lamination for improved image clarity in optical devices | Belgacem Haba, Rajesh Katkar | 2025-04-08 |
| 12218059 | Stacked IC structure with orthogonal interconnect layers | Steven Teig, Javier A. Delacruz | 2025-02-04 |
| RE50272 | Remote optical engine for virtual reality or augmented reality headsets | Belgacem Haba, Rajesh Katkar | 2025-01-14 |
| 12191267 | Nanowire bonding interconnect for fine-pitch microelectronics | Belgacem Haba | 2025-01-07 |
| 12142528 | 3D chip with shared clock distribution network | Javier A. Delacruz, Steven Teig, Eric Nequist | 2024-11-12 |
| 12136605 | Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same | Guilian Gao, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi, Rajesh Katkar, Cyprian Emeka Uzoh | 2024-11-05 |
| 12124035 | Stretchable film assembly with conductive traces | Belgacem Haba, Gabriel Z. Guevara, Min Tao | 2024-10-22 |
| 12057383 | Bonded structures with integrated passive component | Belgacem Haba, Rajesh Katkar, Gabriel Z. Guevara, Javier A. Delacruz, Shaowu Huang +1 more | 2024-08-06 |
| 11914148 | Stacked optical waveguides | Rajesh Katkar, Belgacem Haba | 2024-02-27 |
| 11894345 | Integrated voltage regulator and passive components | Javier A. Delacruz, Don Draper, Belgacem Haba | 2024-02-06 |
| 11881454 | Stacked IC structure with orthogonal interconnect layers | Steven Teig, Javier A. Delacruz | 2024-01-23 |
| 11862604 | Systems and methods for releveled bump planes for chiplets | Javier A. Delacruz, Belgacem Haba, Cyprian Emeka Uzoh, Rajesh Katkar | 2024-01-02 |
| 11830845 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2023-11-28 |
| 11830804 | Over and under interconnects | Belgacem Haba, Stephen L. Morein, Rajesh Katkar, Javier A. Delacruz | 2023-11-28 |
| 11824042 | 3D chip sharing data bus | Javier A. Delacruz, Steven Teig | 2023-11-21 |
| 11817409 | Directly bonded structures without intervening adhesive and methods for forming the same | Belgacem Haba, Rajesh Katkar, Javier A. Delacruz | 2023-11-14 |
| 11626363 | Bonded structures with integrated passive component | Belgacem Haba, Rajesh Katkar, Gabriel Z. Guevara, Javier A. Delacruz, Shaowu Huang +1 more | 2023-04-11 |
| 11557516 | 3D chip with shared clock distribution network | Javier A. Delacruz, Steven Teig, Eric Nequist | 2023-01-17 |
| 11515291 | Integrated voltage regulator and passive components | Javier A. Delacruz, Don Draper, Belgacem Haba | 2022-11-29 |