| 12438087 |
High throughput additive manufacturing for integrated circuit components containing traces with feature size and grain boundaries |
Adel A. Elsherbini, Aleksandar Aleksov, Feras Eid, Weiyi Li, Yoshihiro Tomita |
2025-10-07 |
|
| 12431430 |
Technologies for high throughput additive manufacturing for integrated circuit components |
Yoshihiro Tomita, Aleksandar Aleksov, Feras Eid, Adel A. Elsherbini, Wenhao Li |
2025-09-30 |
|
| 12374625 |
Microelectronic assemblies having topside power delivery structures |
Bernd Waidhas, Carlton Hanna, Lizabeth Keser, Georg Seidemann |
2025-07-29 |
|
| 12242290 |
Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures |
Beomseok Choi, William J. Lambert, Krishna Bharath, Kaladhar Radhakrishnan, Adel A. Elsherbini +3 more |
2025-03-04 |
|
| 12243828 |
Microelectronic assemblies having topside power delivery structures |
Bernd Waidhas, Carlton Hanna, Lizabeth Keser, Georg Seidemann |
2025-03-04 |
|
| 12211796 |
Microelectronic assemblies having topside power delivery structures |
Bernd Waidhas, Carlton Hanna, Lizabeth Keser, Georg Seidemann |
2025-01-28 |
|
| 12199012 |
Modular microchannel thermal solutions for integrated circuit devices |
Adel A. Elsherbini, Feras Eid, Georgios Dogiamis |
2025-01-14 |
|
| 12170244 |
High-throughput additively manufactured power delivery vias and traces |
Adel A. Elsherbini, Feras Eid, Georgios Dogiamis, Henning Braunisch, Beomseok Choi +3 more |
2024-12-17 |
$33,648,000 |
| 12170268 |
Embedded metal lines |
— |
2024-12-17 |
|
| 11978724 |
Diffused bitline replacement in memory |
— |
2024-05-07 |
|
| 11830804 |
Over and under interconnects |
Belgacem Haba, Ilyas Mohammed, Rajesh Katkar, Javier A. Delacruz |
2023-11-28 |
|
| 11710209 |
Multi-thread graphics processing system |
Laurent Lefebvre, Andrew Evan Gruber |
2023-07-25 |
|
| 11693462 |
Central receiver for performing capacitive sensing |
Joseph Kurth Reynolds |
2023-07-04 |
|
| 11621246 |
Diffused bitline replacement in stacked wafer memory |
— |
2023-04-04 |
|
| 11605149 |
Graphics processing architecture employing a unified shader |
Laurent Lefebvre, Andrew Evan Gruber, Andi Skende |
2023-03-14 |
|
| 11545366 |
Process monitor for wafer thinning |
— |
2023-01-03 |
$20,785,000 |
| 11469214 |
Stacked architecture for three-dimensional NAND |
Javier A. Delacruz, Xu Chang, Belgacem Haba, Rajesh Katkar |
2022-10-11 |
|
| 11361399 |
Multi-thread graphics processing system |
Laurent Lefebvre, Andrew Evan Gruber |
2022-06-14 |
|
| 11328382 |
Graphics processing architecture employing a unified shader |
Laurent Lefebvre, Andrew Evan Gruber, Andi Skende |
2022-05-10 |
|
| 11315518 |
Dynamic overdrive for liquid crystal displays |
— |
2022-04-26 |
$62,291,000 |
| 11289045 |
Display rescan |
— |
2022-03-29 |
$37,753,000 |
| 11145277 |
Display interface with foveal compression |
— |
2021-10-12 |
$14,471,000 |
| 11139283 |
Abstracted NAND logic in stacks |
Javier A. Delacruz |
2021-10-05 |
|
| 11056351 |
Process monitor for wafer thinning |
— |
2021-07-06 |
$15,703,000 |
| 11030960 |
Host content adaptive backlight control (CABC) and local dimming |
— |
2021-06-08 |
$8,651,000 |
