| 12406962 |
Power delivery through capacitor-dies in a multi-layered microelectronic assembly |
Adel A. Elsherbini, Krishna Bharath, Shawna M. Liff, Nicolas Butzen, Georgios Dogiamis +4 more |
2025-09-02 |
|
| 12347782 |
Microelectronic assemblies with direct attach to circuit boards |
Sanka Ganesan, Bharat P. Penmecha, Xavier Francois Brun |
2025-07-01 |
|
| 12308362 |
Packaging architecture for disaggregated integrated voltage regulators |
Kaladhar Radhakrishnan, Krishna Bharath, Adel A. Elsherbini, Sriram Srinivasan, Christopher Schaef |
2025-05-20 |
|
| 12288750 |
Conformal power delivery structure for direct chip attach architectures |
Beomseok Choi, Krishna Bharath, Kaladhar Radhakrishnan, Adel A. Elsherbini |
2025-04-29 |
|
| 12255382 |
Antenna modules and communication devices |
Sidharth Dalmia, Jonathan Jensen, Ozgur Inac, Trang Thai, Benjamin Jann |
2025-03-18 |
|
| 12242290 |
Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures |
Beomseok Choi, Krishna Bharath, Kaladhar Radhakrishnan, Adel A. Elsherbini, Henning Braunisch +3 more |
2025-03-04 |
|
| 12224252 |
Magnetic core inductors in interposer |
Krishna Bharath, Haifa Hariri, Siddharth Kulasekaran, Mathew J. Manusharow, Anne Augustine |
2025-02-11 |
|
| 12200855 |
Radio frequency front-end structures |
Sidharth Dalmia, Zhenguo Jiang, Kirthika Nahalingam, Swathi Vijayakumar |
2025-01-14 |
|
| 12170244 |
High-throughput additively manufactured power delivery vias and traces |
Adel A. Elsherbini, Feras Eid, Georgios Dogiamis, Henning Braunisch, Beomseok Choi +3 more |
2024-12-17 |
$33,648,000 |
| 12154710 |
Package embedded magnetic power transformers for SMPS |
Anuj Modi, Huong Do, Krishna Bharath, Harish Krishnamurthy |
2024-11-26 |
$26,820,000 |
| 12132015 |
Package embedded magnetic inductor structures and manufacturing techniques for 5-50 MHZ SMPS operations |
Sri Chaitra Jyotsna Chavali |
2024-10-29 |
$18,861,000 |
| 12087682 |
Power delivery structures |
Adel A. Elsherbini, Feras Eid, Georgios Dogiamis, Beomseok Choi, Henning Braunisch +2 more |
2024-09-10 |
$16,964,000 |
| 12068684 |
Multi-phase switching regulators with hybrid inductors and per phase frequency control |
Krishna Bharath, Christopher Schaef, Kaladhar Radhakrishnan |
2024-08-20 |
$20,163,000 |
| 12002745 |
High performance integrated RF passives using dual lithography process |
Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Robert L. Sankman, Aleksandar Aleksov +6 more |
2024-06-04 |
$24,500,000 |
| 11937367 |
Radio frequency front-end structures |
Sidharth Dalmia, Zhenguo Jiang, Kirthika Nahalingam, Swathi Vijayakumar |
2024-03-19 |
$28,784,000 |
| 11870163 |
Antenna package using ball attach array to connect antenna and base substrates |
Jimin Yao, Robert L. Sankman, Shawna M. Liff, Sri Chaitra Jyotsna Chavali, Zhichao Zhang |
2024-01-09 |
$30,329,000 |
| 11870132 |
Antenna modules and communication devices |
Sidharth Dalmia, Jonathan Jensen, Ozgur Inac, Trang Thai, Benjamin Jann |
2024-01-09 |
$30,329,000 |
| 11804426 |
Integrated circuit structures in package substrates |
Sanka Ganesan, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael J. Hill +1 more |
2023-10-31 |
$30,374,000 |
| 11804456 |
Wirebond and leadframe magnetic inductors |
Omkar G. Karhade, Martin Rodriguez, Gregorio R. Murtagian |
2023-10-31 |
$30,374,000 |
| 11729902 |
Radio frequency front-end structures |
Sidharth Dalmia, Zhenguo Jiang, Kirthika Nahalingam, Swathi Vijayakumar |
2023-08-15 |
$18,845,000 |
| 11699630 |
Thermals for packages with inductors |
— |
2023-07-11 |
$21,736,000 |
| 11676950 |
Via-in-via structure for high density package integrated inductor |
Krishna Bharath, Sriram Srinivasan, Amruthavalli Pallavi Alur, Kaladhar Radhakrishnan, Huong Do |
2023-06-13 |
$22,204,000 |
| 11664596 |
Antenna modules and communication devices |
Sidharth Dalmia, Trang Thai, Zhichao Zhang, Jiwei Sun |
2023-05-30 |
$16,378,000 |
| 11616283 |
5G mmWave antenna architecture with thermal management |
Omkar G. Karhade, Xiaoqian Li, Sidharth Dalmia |
2023-03-28 |
$20,940,000 |
| 11611164 |
Wideband multi-pin edge connector for radio frequency front end module |
Zhenguo Jiang, Omkar G. Karhade, Sri Chaitra Jyotsna Chavali, Zhichao Zhang, Mitul Modi |
2023-03-21 |
$20,076,000 |
