Issued Patents All Time
Showing 25 most recent of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406962 | Power delivery through capacitor-dies in a multi-layered microelectronic assembly | Adel A. Elsherbini, Krishna Bharath, Shawna M. Liff, Nicolas Butzen, Georgios Dogiamis +4 more | 2025-09-02 |
| 12347782 | Microelectronic assemblies with direct attach to circuit boards | Sanka Ganesan, Bharat P. Penmecha, Xavier Francois Brun | 2025-07-01 |
| 12308362 | Packaging architecture for disaggregated integrated voltage regulators | Kaladhar Radhakrishnan, Krishna Bharath, Adel A. Elsherbini, Sriram Srinivasan, Christopher Schaef | 2025-05-20 |
| 12288750 | Conformal power delivery structure for direct chip attach architectures | Beomseok Choi, Krishna Bharath, Kaladhar Radhakrishnan, Adel A. Elsherbini | 2025-04-29 |
| 12255382 | Antenna modules and communication devices | Sidharth Dalmia, Jonathan Jensen, Ozgur Inac, Trang Thai, Benjamin Jann | 2025-03-18 |
| 12242290 | Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures | Beomseok Choi, Krishna Bharath, Kaladhar Radhakrishnan, Adel A. Elsherbini, Henning Braunisch +3 more | 2025-03-04 |
| 12224252 | Magnetic core inductors in interposer | Krishna Bharath, Haifa Hariri, Siddharth Kulasekaran, Mathew J. Manusharow, Anne Augustine | 2025-02-11 |
| 12200855 | Radio frequency front-end structures | Sidharth Dalmia, Zhenguo Jiang, Kirthika Nahalingam, Swathi Vijayakumar | 2025-01-14 |
| 12170244 | High-throughput additively manufactured power delivery vias and traces | Adel A. Elsherbini, Feras Eid, Georgios Dogiamis, Henning Braunisch, Beomseok Choi +3 more | 2024-12-17 |
| 12154710 | Package embedded magnetic power transformers for SMPS | Anuj Modi, Huong Do, Krishna Bharath, Harish Krishnamurthy | 2024-11-26 |
| 12132015 | Package embedded magnetic inductor structures and manufacturing techniques for 5-50 MHZ SMPS operations | Sri Chaitra Jyotsna Chavali | 2024-10-29 |
| 12087682 | Power delivery structures | Adel A. Elsherbini, Feras Eid, Georgios Dogiamis, Beomseok Choi, Henning Braunisch +2 more | 2024-09-10 |
| 12068684 | Multi-phase switching regulators with hybrid inductors and per phase frequency control | Krishna Bharath, Christopher Schaef, Kaladhar Radhakrishnan | 2024-08-20 |
| 12002745 | High performance integrated RF passives using dual lithography process | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Robert L. Sankman, Aleksandar Aleksov +6 more | 2024-06-04 |
| 11937367 | Radio frequency front-end structures | Sidharth Dalmia, Zhenguo Jiang, Kirthika Nahalingam, Swathi Vijayakumar | 2024-03-19 |
| 11870132 | Antenna modules and communication devices | Sidharth Dalmia, Jonathan Jensen, Ozgur Inac, Trang Thai, Benjamin Jann | 2024-01-09 |
| 11870163 | Antenna package using ball attach array to connect antenna and base substrates | Jimin Yao, Robert L. Sankman, Shawna M. Liff, Sri Chaitra Jyotsna Chavali, Zhichao Zhang | 2024-01-09 |
| 11804426 | Integrated circuit structures in package substrates | Sanka Ganesan, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael J. Hill +1 more | 2023-10-31 |
| 11804456 | Wirebond and leadframe magnetic inductors | Omkar G. Karhade, Martin Rodriguez, Gregorio R. Murtagian | 2023-10-31 |
| 11729902 | Radio frequency front-end structures | Sidharth Dalmia, Zhenguo Jiang, Kirthika Nahalingam, Swathi Vijayakumar | 2023-08-15 |
| 11699630 | Thermals for packages with inductors | — | 2023-07-11 |
| 11676950 | Via-in-via structure for high density package integrated inductor | Krishna Bharath, Sriram Srinivasan, Amruthavalli Pallavi Alur, Kaladhar Radhakrishnan, Huong Do | 2023-06-13 |
| 11664596 | Antenna modules and communication devices | Sidharth Dalmia, Trang Thai, Zhichao Zhang, Jiwei Sun | 2023-05-30 |
| 11616283 | 5G mmWave antenna architecture with thermal management | Omkar G. Karhade, Xiaoqian Li, Sidharth Dalmia | 2023-03-28 |
| 11611164 | Wideband multi-pin edge connector for radio frequency front end module | Zhenguo Jiang, Omkar G. Karhade, Sri Chaitra Jyotsna Chavali, Zhichao Zhang, Mitul Modi | 2023-03-21 |