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Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket |
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Saikumar Jayaraman |
2019-12-31 |
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Zhichao Zhang |
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2019-06-11 |
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Surface-mount inductor structures for forming one or more inductors with substrate traces |
Robert L. Sankman, Brent Stone, Kaladhar Radhakrishnan, Joshua D. Heppner |
2018-08-21 |
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Universal linear edge connector |
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Solder contacts for socket assemblies |
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2018-01-02 |
| 9832876 |
CPU package substrates with removable memory mechanical interfaces |
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Srikant Nekkanty, Donald T. Tran |
2017-06-27 |
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Bhanu Jaiswal, Sriram Srinivasan, Michael J. Hill |
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| 9118143 |
Mechanism for facilitating and employing a magnetic grid array |
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2015-08-25 |