Issued Patents All Time
Showing 25 most recent of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12422615 | Nested glass packaging architecture for hybrid electrical and optical communication devices | Srinivas V. Pietambaram, Brandon C. Marin, Debendra Mallik, Tarek A. Ibrahim, Jeremy Ecton +5 more | 2025-09-23 |
| 12412842 | Microelectronic structures including bridges | Omkar G. Karhade, Mohit Bhatia, Debendra Mallik | 2025-09-09 |
| 12406893 | Edge-aligned template structure for integrated circuit packages | Debendra Mallik, Omkar G. Karhade | 2025-09-02 |
| 12399334 | Photonic integrated circuit packaging architectures | Omkar G. Karhade, Xiaoqian Li | 2025-08-26 |
| 12392970 | Photonic integrated circuit packaging architectures | Omkar G. Karhade, Xiaoqian Li, Ravindranath V. Mahajan, Srinivas V. Pietambaram, Bharat P. Penmecha +1 more | 2025-08-19 |
| 12386127 | Micro-lens array optically coupled with a photonics die | Xiaoqian Li, Omkar G. Karhade | 2025-08-12 |
| 12353032 | Enabling passive alignment for lens attach | Xiaoqian Li, Wesley B. Morgan, Divya Pratap | 2025-07-08 |
| 12272650 | Microelectronic package with substrate cavity for bridge-attach | Omkar G. Karhade, Debendra Mallik, Amruthavalli Pallavi Alur | 2025-04-08 |
| 12243792 | Microelectronic structures including bridges | Omkar G. Karhade, Xiaoxuan Sun, Sairam Agraharam | 2025-03-04 |
| 12183596 | Low cost package warpage solution | Omkar G. Karhade, Debendra Mallik, Bassam M. Ziadeh, Yoshihiro Tomita | 2024-12-31 |
| 12181710 | Photonic integrated circuit packaging architecture | Omkar G. Karhade, Xiaoqian Li, Tarek A. Ibrahim, Ravindranath V. Mahajan | 2024-12-31 |
| 12174436 | Package expanded beam connector for on-package optics | Wesley B. Morgan, Srikant Nekkanty, Todd Coons, Gregorio R. Murtagian, Xiaoqian Li +1 more | 2024-12-24 |
| 12176268 | Open cavity bridge co-planar placement architectures and processes | Omkar G. Karhade, Digvijay A. Raorane, Sairam Agraharam, Mitul Modi, Manish Dubey +1 more | 2024-12-24 |
| 12148742 | Active bridge enabled co-packaged photonic transceiver | Thomas Liljeberg, Andrew C. Alduino, Ravindranath V. Mahajan, Ling Liao, Kenneth M. Brown +2 more | 2024-11-19 |
| 12113023 | Microelectronic structures including bridges | Omkar G. Karhade | 2024-10-08 |
| 12061371 | Patch on interposer architecture for low cost optical co-packaging | Xiaoqian Li, Omkar G. Karhade, Ravindranath V. Mahajan | 2024-08-13 |
| 12044888 | Silicon groove architectures and manufacturing processes for passive alignment in a photonics die | Omkar G. Karhade, Xiaoqian Li, Sujit Sharan | 2024-07-23 |
| 12027448 | Open cavity bridge power delivery architectures and processes | Omkar G. Karhade, Mitul Modi, Sairam Agraharam, Digvijay A. Raorane | 2024-07-02 |
| 11923307 | Microelectronic structures including bridges | Bai Nie, Gang Duan, Omkar G. Karhade, Yikang Deng, Wei-Lun Kane Jen +6 more | 2024-03-05 |
| 11887962 | Microelectronic structures including bridges | Omkar G. Karhade, Mohit Bhatia, Sairam Agraharam, Edvin Cetegen, Anurag Tripathi +6 more | 2024-01-30 |
| 11854945 | Underfill material flow control for reduced die-to-die spacing in semiconductor packages | Omkar G. Karhade, Rajendra C. Dias, Edvin Cetegen, Lars D. Skoglund | 2023-12-26 |
| 11804441 | Microelectronic structures including bridges | Omkar G. Karhade, Mohit Bhatia, Debendra Mallik | 2023-10-31 |
| 11791274 | Multichip semiconductor package including a bridge die disposed in a cavity having non-planar interconnects | Manish Dubey, Omkar G. Karhade, Jinhe Liu, Sairam Agraharam, Mohit Bhatia +1 more | 2023-10-17 |
| 11764080 | Low cost package warpage solution | Omkar G. Karhade, Debendra Mallik, Bassam M. Ziadeh, Yoshihiro Tomita | 2023-09-19 |
| 11735558 | Microelectronic structures including bridges | Omkar G. Karhade, Mohit Bhatia, Anurag Tripathi, Takeshi Nakazawa, Steve Cho | 2023-08-22 |