| 12506085 |
HBI die architecture with fiducial in street for no metal depopulation in active die |
Omkar G. Karhade |
2025-12-23 |
|
| 12506128 |
Package architecture of scalable compute wall having compute bricks with vertically stacked dies |
Sagar Suthram, Debendra Mallik, Wilfred Gomes, Pushkar Ranade, Omkar G. Karhade +2 more |
2025-12-23 |
|
| 12506127 |
Package architecture of photonic system with vertically stacked dies having planarized edges |
Sagar Suthram, Ravindranath V. Mahajan, Debendra Mallik, Omkar G. Karhade, Wilfred Gomes +4 more |
2025-12-23 |
|
| 12500132 |
Formation of a reconstituted circuit device using flow of a material by capillary action |
Omkar G. Karhade |
2025-12-16 |
|
| 12481108 |
Faraday rotator interconnect as a through-via configuration in a patch architecture |
Brandon C. Marin, Divya Pratap, Hisato Tanaka, Omkar G. Karhade, Robert A. May +5 more |
2025-11-25 |
|
| 12469801 |
Moisture seal coating of hybrid bonded stacked die package assembly |
Debendra Mallik, Mohammad Enamul Kabir, Omkar G. Karhade, Arnab Sarkar, Sairam Agraharam +3 more |
2025-11-11 |
|
| 12438093 |
Microelectronic structures including bridges |
Omkar G. Karhade |
2025-10-07 |
|
| 12422615 |
Nested glass packaging architecture for hybrid electrical and optical communication devices |
Srinivas V. Pietambaram, Brandon C. Marin, Debendra Mallik, Tarek A. Ibrahim, Jeremy Ecton +5 more |
2025-09-23 |
|
| 12412842 |
Microelectronic structures including bridges |
Omkar G. Karhade, Mohit Bhatia, Debendra Mallik |
2025-09-09 |
|
| 12406893 |
Edge-aligned template structure for integrated circuit packages |
Debendra Mallik, Omkar G. Karhade |
2025-09-02 |
|
| 12399334 |
Photonic integrated circuit packaging architectures |
Omkar G. Karhade, Xiaoqian Li |
2025-08-26 |
|
| 12392970 |
Photonic integrated circuit packaging architectures |
Omkar G. Karhade, Xiaoqian Li, Ravindranath V. Mahajan, Srinivas V. Pietambaram, Bharat P. Penmecha +1 more |
2025-08-19 |
|
| 12386127 |
Micro-lens array optically coupled with a photonics die |
Xiaoqian Li, Omkar G. Karhade |
2025-08-12 |
|
| 12353032 |
Enabling passive alignment for lens attach |
Xiaoqian Li, Wesley B. Morgan, Divya Pratap |
2025-07-08 |
|
| 12272650 |
Microelectronic package with substrate cavity for bridge-attach |
Omkar G. Karhade, Debendra Mallik, Amruthavalli Pallavi Alur |
2025-04-08 |
|
| 12243792 |
Microelectronic structures including bridges |
Omkar G. Karhade, Xiaoxuan Sun, Sairam Agraharam |
2025-03-04 |
|
| 12183596 |
Low cost package warpage solution |
Omkar G. Karhade, Debendra Mallik, Bassam M. Ziadeh, Yoshihiro Tomita |
2024-12-31 |
$16,542,000 |
| 12181710 |
Photonic integrated circuit packaging architecture |
Omkar G. Karhade, Xiaoqian Li, Tarek A. Ibrahim, Ravindranath V. Mahajan |
2024-12-31 |
$16,542,000 |
| 12176268 |
Open cavity bridge co-planar placement architectures and processes |
Omkar G. Karhade, Digvijay A. Raorane, Sairam Agraharam, Mitul Modi, Manish Dubey +1 more |
2024-12-24 |
$17,261,000 |
| 12174436 |
Package expanded beam connector for on-package optics |
Wesley B. Morgan, Srikant Nekkanty, Todd Coons, Gregorio R. Murtagian, Xiaoqian Li +1 more |
2024-12-24 |
$17,261,000 |
| 12148742 |
Active bridge enabled co-packaged photonic transceiver |
Thomas Liljeberg, Andrew C. Alduino, Ravindranath V. Mahajan, Ling Liao, Kenneth M. Brown +2 more |
2024-11-19 |
$25,575,000 |
| 12113023 |
Microelectronic structures including bridges |
Omkar G. Karhade |
2024-10-08 |
$19,971,000 |
| 12061371 |
Patch on interposer architecture for low cost optical co-packaging |
Xiaoqian Li, Omkar G. Karhade, Ravindranath V. Mahajan |
2024-08-13 |
$26,861,000 |
| 12044888 |
Silicon groove architectures and manufacturing processes for passive alignment in a photonics die |
Omkar G. Karhade, Xiaoqian Li, Sujit Sharan |
2024-07-23 |
$20,446,000 |
| 12027448 |
Open cavity bridge power delivery architectures and processes |
Omkar G. Karhade, Mitul Modi, Sairam Agraharam, Digvijay A. Raorane |
2024-07-02 |
$27,114,000 |
