Issued Patents All Time
Showing 25 most recent of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12392970 | Photonic integrated circuit packaging architectures | Omkar G. Karhade, Xiaoqian Li, Nitin A. Deshpande, Srinivas V. Pietambaram, Bharat P. Penmecha +1 more | 2025-08-19 |
| 12366713 | Heat dissipation structures for optical communication devices | Omkar G. Karhade, Tolga Acikalin, Sushrutha Gujjula, Kelly Lofgreen, Chia-Pin Chiu | 2025-07-22 |
| 12347783 | Interconnect architecture with silicon interposer and EMIB | MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Debendra Mallik +7 more | 2025-07-01 |
| 12272656 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Robert L. Sankman, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha | 2025-04-08 |
| 12243806 | Nested architectures for enhanced heterogeneous integration | Debendra Mallik, Sujit Sharan, Digvijay A. Raorane | 2025-03-04 |
| 12238892 | Immersion cooling for integrated circuit devices | Raanan Sover, James D. Williams, Bradley H. Smith, Nir Peled, Paul C. GEORGE +9 more | 2025-02-25 |
| 12224103 | Angled inductor with small form factor | Brandon C. Marin, Jeremy Ecton, Suddhasattwa Nad, Matthew Tingey, Srinivas V. Pietambaram | 2025-02-11 |
| 12218040 | Nested interposer with through-silicon via bridge die | Srinivas V. Pietambaram, Debendra Mallik, Kristof Darmawikarta, Rahul N. Manepalli | 2025-02-04 |
| 12206410 | Programmable logic device with fine-grained disaggregation | Dheeraj Subbareddy, MD Altaf Hossain, Ankireddy Nalamalpu, Robert Sankman, Gregg William Baeckler | 2025-01-21 |
| 12199048 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Robert L. Sankman, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha | 2025-01-14 |
| 12183649 | IC package including multi-chip unit with bonded integrated heat spreader | Debendra Mallik, Digvijay A. Raorane | 2024-12-31 |
| 12181710 | Photonic integrated circuit packaging architecture | Omkar G. Karhade, Xiaoqian Li, Tarek A. Ibrahim, Nitin A. Deshpande | 2024-12-31 |
| 12159813 | Embedded bridge die with through-silicon vias | Aditya S. Vaidya, Digvijay A. Raorane, Paul R. Start | 2024-12-03 |
| 12148742 | Active bridge enabled co-packaged photonic transceiver | Thomas Liljeberg, Andrew C. Alduino, Ling Liao, Kenneth M. Brown, James E. Jaussi +2 more | 2024-11-19 |
| 12142568 | Multi-die ultrafine pitch patch architecture of interconnect bridge over glass layer and method of making | Sanka Ganesan, Kevin Thomas McCarthy, Leigh M. TRIBOLET, Debendra Mallik, Robert L. Sankman | 2024-11-12 |
| 12142545 | Nested architectures for enhanced heterogeneous integration | Debendra Mallik, Sujit Sharan, Digvijay A. Raorane | 2024-11-12 |
| 12074102 | Structural elements for application specific electronic device packages | Suddhasattwa Nad, Brandon C. Marin, Jeremy Ecton, Mohammad Mamunur Rahman | 2024-08-27 |
| 12061371 | Patch on interposer architecture for low cost optical co-packaging | Xiaoqian Li, Nitin A. Deshpande, Omkar G. Karhade | 2024-08-13 |
| 12048123 | Heat dissipation device having shielding/containment extensions | Aastha Uppal, Je-Young Chang | 2024-07-23 |
| 11901299 | Interconnect architecture with silicon interposer and EMIB | MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Debendra Mallik +7 more | 2024-02-13 |
| 11894359 | Distributed semiconductor die and package architecture | Wilfred Gomes, Mark Bohr, Rajesh Kumar, Robert L. Sankman, Wesley McCullough | 2024-02-06 |
| 11832419 | Full package vapor chamber with IHS | Nicholas Neal, Nicholas S. Haehn, Je-Young Chang, Kyle Arrington, Aaron McCann +4 more | 2023-11-28 |
| 11830863 | Dual-sided co-packaged optics for high bandwidth networking applications | Suresh Pothukuchi, Andrew C. Alduino, Srikant Nekkanty, Ling Liao, Harinadh POTLURI +5 more | 2023-11-28 |
| 11824018 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Robert L. Sankman, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha | 2023-11-21 |
| 11804418 | Direct liquid micro jet (DLMJ) structures for addressing thermal performance at limited flow rate conditions | Nicholas Neal, Je-Young Chang, Jae Whan Kim | 2023-10-31 |