| 12506127 |
Package architecture of photonic system with vertically stacked dies having planarized edges |
Sagar Suthram, Ravindranath V. Mahajan, Omkar G. Karhade, Wilfred Gomes, Pushkar Ranade +4 more |
2025-12-23 |
|
| 12506128 |
Package architecture of scalable compute wall having compute bricks with vertically stacked dies |
Sagar Suthram, Wilfred Gomes, Pushkar Ranade, Nitin A. Deshpande, Omkar G. Karhade +2 more |
2025-12-23 |
|
| 12476174 |
Ultra-thin, hyper-density semiconductor packages |
Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan, Rajasekaran Swaminathan +4 more |
2025-11-18 |
|
| 12469801 |
Moisture seal coating of hybrid bonded stacked die package assembly |
Mohammad Enamul Kabir, Nitin A. Deshpande, Omkar G. Karhade, Arnab Sarkar, Sairam Agraharam +3 more |
2025-11-11 |
|
| 12422615 |
Nested glass packaging architecture for hybrid electrical and optical communication devices |
Srinivas V. Pietambaram, Brandon C. Marin, Tarek A. Ibrahim, Jeremy Ecton, Omkar G. Karhade +5 more |
2025-09-23 |
|
| 12412842 |
Microelectronic structures including bridges |
Omkar G. Karhade, Nitin A. Deshpande, Mohit Bhatia |
2025-09-09 |
|
| 12406893 |
Edge-aligned template structure for integrated circuit packages |
Omkar G. Karhade, Nitin A. Deshpande |
2025-09-02 |
|
| 12406914 |
Ultra-thin, hyper-density semiconductor packages |
Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan, Rajasekaran Swaminathan +4 more |
2025-09-02 |
|
| 12400952 |
Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge |
Jiun Hann Sir, Poh Boon Khoo, Eng Huat Goh, Amruthavalli Pallavi Alur |
2025-08-26 |
|
| 12347783 |
Interconnect architecture with silicon interposer and EMIB |
MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan +7 more |
2025-07-01 |
|
| 12347807 |
Inorganic fill material for stacked die assembly |
Mohammad Enamul Kabir |
2025-07-01 |
|
| 12341281 |
Micro socket electrical couplings for dies |
Srikant Nekkanty, Joe Walczyk, Saikumar Jayaraman, Feroz Mohammad |
2025-06-24 |
|
| 12341129 |
Substrateless double-sided embedded multi-die interconnect bridge |
Biancun Xie, Jianyong Xie, Sujit Sharan, Robert L. Sankman |
2025-06-24 |
|
| 12300620 |
Inorganic-based embedded-die layers for modular semiconductive devices |
Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Rahul N. Manepalli, Robert L. Sankman |
2025-05-13 |
|
| 12283535 |
IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects |
Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad |
2025-04-22 |
|
| 12272656 |
Heterogeneous nested interposer package for IC chips |
Ravindranath V. Mahajan, Robert L. Sankman, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha |
2025-04-08 |
|
| 12272650 |
Microelectronic package with substrate cavity for bridge-attach |
Omkar G. Karhade, Nitin A. Deshpande, Amruthavalli Pallavi Alur |
2025-04-08 |
|
| 12243806 |
Nested architectures for enhanced heterogeneous integration |
Ravindranath V. Mahajan, Sujit Sharan, Digvijay A. Raorane |
2025-03-04 |
|
| 12218040 |
Nested interposer with through-silicon via bridge die |
Srinivas V. Pietambaram, Kristof Darmawikarta, Ravindranath V. Mahajan, Rahul N. Manepalli |
2025-02-04 |
|
| 12205915 |
Microelectronic package with solder array thermal interface material (SA-TIM) |
Sergio Antonio Chan Arguedas, Jimin Yao, Chandra Mohan Jha |
2025-01-21 |
|
| 12199048 |
Heterogeneous nested interposer package for IC chips |
Ravindranath V. Mahajan, Robert L. Sankman, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha |
2025-01-14 |
|
| 12183649 |
IC package including multi-chip unit with bonded integrated heat spreader |
Ravindranath V. Mahajan, Digvijay A. Raorane |
2024-12-31 |
$16,542,000 |
| 12183596 |
Low cost package warpage solution |
Omkar G. Karhade, Nitin A. Deshpande, Bassam M. Ziadeh, Yoshihiro Tomita |
2024-12-31 |
$16,542,000 |
| 12142545 |
Nested architectures for enhanced heterogeneous integration |
Ravindranath V. Mahajan, Sujit Sharan, Digvijay A. Raorane |
2024-11-12 |
$28,491,000 |
| 12142567 |
Coreless architecture and processing strategy for EMIB-based substrates with high accuracy and high density |
Xiao Di SUN ZHOU, Xiaoying Guo |
2024-11-12 |
$28,491,000 |
