Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12283535 | IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects | Debendra Mallik, Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli | 2025-04-22 |
| 11984377 | IC die and heat spreaders with solderable thermal interface structures for assemblies including solder array thermal interconnects | Debendra Mallik, Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli | 2024-05-14 |
| 11935808 | IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects | Debendra Mallik, Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli | 2024-03-19 |
| 11923267 | IC die with solderable thermal interface structures for assemblies including solder array thermal interconnects | Debendra Mallik, Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli | 2024-03-05 |