| 12388019 |
Pitch translation architecture for semiconductor package including embedded interconnect bridge |
Andrew Collins, Bharat P. Penmecha, Rajasekaran Swaminathan |
2025-08-12 |
|
| 12347783 |
Interconnect architecture with silicon interposer and EMIB |
MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan +7 more |
2025-07-01 |
|
| 12283535 |
IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects |
Debendra Mallik, Je-Young Chang, Elah Bozorg-Grayeli, Ahmad Al Mohammad |
2025-04-22 |
|
| 12261150 |
Mold shelf package design and process flow for advanced package architectures |
Wei Li, Edvin Cetegen, Nicholas S. Haehn, Nicholas Neal, Mitul Modi |
2025-03-25 |
|
| 12176292 |
Microelectronic component having molded regions with through-mold vias |
Sanka Ganesan, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more |
2024-12-24 |
$17,261,000 |
| 12087731 |
No mold shelf package design and process flow for advanced package architectures |
Wei Li, Edvin Cetegen, Nicholas S. Haehn, Nicholas Neal, Mitul Modi |
2024-09-10 |
$16,964,000 |
| 12051647 |
Pitch translation architecture for semiconductor package including embedded interconnect bridge |
Andrew Collins, Bharat P. Penmecha, Rajasekaran Swaminathan |
2024-07-30 |
$27,313,000 |
| 11984377 |
IC die and heat spreaders with solderable thermal interface structures for assemblies including solder array thermal interconnects |
Debendra Mallik, Je-Young Chang, Elah Bozorg-Grayeli, Ahmad Al Mohammad |
2024-05-14 |
$33,809,000 |
| 11935808 |
IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects |
Debendra Mallik, Je-Young Chang, Elah Bozorg-Grayeli, Ahmad Al Mohammad |
2024-03-19 |
$28,784,000 |
| 11923267 |
IC die with solderable thermal interface structures for assemblies including solder array thermal interconnects |
Debendra Mallik, Je-Young Chang, Elah Bozorg-Grayeli, Ahmad Al Mohammad |
2024-03-05 |
$29,696,000 |
| 11901333 |
No mold shelf package design and process flow for advanced package architectures |
Wei Li, Edvin Cetegen, Nicholas S. Haehn, Nicholas Neal, Mitul Modi |
2024-02-13 |
$18,546,000 |
| 11901299 |
Interconnect architecture with silicon interposer and EMIB |
MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan +7 more |
2024-02-13 |
$18,546,000 |
| 11817390 |
Microelectronic component having molded regions with through-mold vias |
Sanka Ganesan, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more |
2023-11-14 |
$31,444,000 |
| 11705398 |
Pitch translation architecture for semiconductor package including embedded interconnect bridge |
Andrew Collins, Bharat P. Penmecha, Rajasekaran Swaminathan |
2023-07-18 |
$21,060,000 |
| 11640942 |
Microelectronic component having molded regions with through-mold vias |
Sanka Ganesan, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more |
2023-05-02 |
$21,235,000 |
| 11574851 |
Coupled cooling fins in ultra-small systems |
Aastha Uppal, Omkar G. Karhade, Je-Young Chang, Weihua Tang, Nitin A. Deshpande +6 more |
2023-02-07 |
$11,877,000 |
| 11557541 |
Interconnect architecture with silicon interposer and EMIB |
MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan +7 more |
2023-01-17 |
$13,997,000 |
| 11545407 |
Thermal management solutions for integrated circuit packages |
Kumar Abhishek Singh, Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Edvin Cetegen +8 more |
2023-01-03 |
$15,575,000 |
| 11302643 |
Microelectronic component having molded regions with through-mold vias |
Sanka Ganesan, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more |
2022-04-12 |
$16,909,000 |
| 11270942 |
Pitch translation architecture for semiconductor package including embedded interconnect bridge |
Andrew Collins, Bharat P. Penmecha, Rajasekaran Swaminathan |
2022-03-08 |
$16,017,000 |
| 10784204 |
Rlink—die to die channel interconnect configurations to improve signaling |
Kemal Aygun, Richard J. Dischler, Jeff C. Morriss, Zhiguo Qian, Wilfred Gomes +7 more |
2020-09-22 |
$34,575,000 |
| 10643945 |
Pitch translation architecture for semiconductor package including embedded interconnect bridge |
Andrew Collins, Bharat P. Penmecha, Rajasekaran Swaminathan |
2020-05-05 |
$29,615,000 |
| 10424561 |
Integrated circuit structures with recessed conductive contacts for package on package |
Kyu Oh Lee, Islam A. Salama, Robert L. Sankman, Babak Sabi, Sri Chaitra Jyotsna Chavali |
2019-09-24 |
$28,939,000 |
| 10187996 |
Printed circuit board with a recess to accommodate discrete components in a package |
Rajasekaran Swaminathan |
2019-01-22 |
$27,645,000 |
| 9865568 |
Integrated circuit structures with recessed conductive contacts for package on package |
Kyu Oh Lee, Islam A. Salama, Robert L. Sankman, Babak Sabi, Sri Chaitra Jyotsna Chavali |
2018-01-09 |
$14,051,000 |
