Issued Patents All Time
Showing 25 most recent of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388019 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Andrew Collins, Bharat P. Penmecha, Rajasekaran Swaminathan | 2025-08-12 |
| 12347783 | Interconnect architecture with silicon interposer and EMIB | MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan +7 more | 2025-07-01 |
| 12283535 | IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects | Debendra Mallik, Je-Young Chang, Elah Bozorg-Grayeli, Ahmad Al Mohammad | 2025-04-22 |
| 12261150 | Mold shelf package design and process flow for advanced package architectures | Wei Li, Edvin Cetegen, Nicholas S. Haehn, Nicholas Neal, Mitul Modi | 2025-03-25 |
| 12176292 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more | 2024-12-24 |
| 12087731 | No mold shelf package design and process flow for advanced package architectures | Wei Li, Edvin Cetegen, Nicholas S. Haehn, Nicholas Neal, Mitul Modi | 2024-09-10 |
| 12051647 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Andrew Collins, Bharat P. Penmecha, Rajasekaran Swaminathan | 2024-07-30 |
| 11984377 | IC die and heat spreaders with solderable thermal interface structures for assemblies including solder array thermal interconnects | Debendra Mallik, Je-Young Chang, Elah Bozorg-Grayeli, Ahmad Al Mohammad | 2024-05-14 |
| 11935808 | IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects | Debendra Mallik, Je-Young Chang, Elah Bozorg-Grayeli, Ahmad Al Mohammad | 2024-03-19 |
| 11923267 | IC die with solderable thermal interface structures for assemblies including solder array thermal interconnects | Debendra Mallik, Je-Young Chang, Elah Bozorg-Grayeli, Ahmad Al Mohammad | 2024-03-05 |
| 11901299 | Interconnect architecture with silicon interposer and EMIB | MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan +7 more | 2024-02-13 |
| 11901333 | No mold shelf package design and process flow for advanced package architectures | Wei Li, Edvin Cetegen, Nicholas S. Haehn, Nicholas Neal, Mitul Modi | 2024-02-13 |
| 11817390 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more | 2023-11-14 |
| 11705398 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Andrew Collins, Bharat P. Penmecha, Rajasekaran Swaminathan | 2023-07-18 |
| 11640942 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more | 2023-05-02 |
| 11574851 | Coupled cooling fins in ultra-small systems | Aastha Uppal, Omkar G. Karhade, Je-Young Chang, Weihua Tang, Nitin A. Deshpande +6 more | 2023-02-07 |
| 11557541 | Interconnect architecture with silicon interposer and EMIB | MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan +7 more | 2023-01-17 |
| 11545407 | Thermal management solutions for integrated circuit packages | Kumar Abhishek Singh, Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Edvin Cetegen +8 more | 2023-01-03 |
| 11302643 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more | 2022-04-12 |
| 11270942 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Andrew Collins, Bharat P. Penmecha, Rajasekaran Swaminathan | 2022-03-08 |
| 10784204 | Rlink—die to die channel interconnect configurations to improve signaling | Kemal Aygun, Richard J. Dischler, Jeff C. Morriss, Zhiguo Qian, Wilfred Gomes +7 more | 2020-09-22 |
| 10643945 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Andrew Collins, Bharat P. Penmecha, Rajasekaran Swaminathan | 2020-05-05 |
| 10424561 | Integrated circuit structures with recessed conductive contacts for package on package | Kyu Oh Lee, Islam A. Salama, Robert L. Sankman, Babak Sabi, Sri Chaitra Jyotsna Chavali | 2019-09-24 |
| 10187996 | Printed circuit board with a recess to accommodate discrete components in a package | Rajasekaran Swaminathan | 2019-01-22 |
| 9865568 | Integrated circuit structures with recessed conductive contacts for package on package | Kyu Oh Lee, Islam A. Salama, Robert L. Sankman, Babak Sabi, Sri Chaitra Jyotsna Chavali | 2018-01-09 |