| 12512365 |
Integrated circuit interconnect structures with a metal chalcogenide liner |
Abhishek Sharma, Pushkar Ranade |
2025-12-30 |
|
| 12506128 |
Package architecture of scalable compute wall having compute bricks with vertically stacked dies |
Sagar Suthram, Debendra Mallik, Pushkar Ranade, Nitin A. Deshpande, Omkar G. Karhade +2 more |
2025-12-23 |
|
| 12506127 |
Package architecture of photonic system with vertically stacked dies having planarized edges |
Sagar Suthram, Ravindranath V. Mahajan, Debendra Mallik, Omkar G. Karhade, Pushkar Ranade +4 more |
2025-12-23 |
|
| 12498876 |
Performing distributed processing using distributed memory |
Abhishek Sharma, Pushkar Ranade, Sagar Suthram, Rajabali M. Koduri |
2025-12-16 |
|
| 12488832 |
Embedded dynamic random-access memory (eDRAM) to operate based on data access characteristics |
Abhishek Sharma, Pushkar Ranade, Rajabali M. Koduri |
2025-12-02 |
|
| 12469767 |
Integrated planar transistors and memory cell array architectures |
Abhishek Sharma |
2025-11-11 |
|
| 12471288 |
Three-dimensional nanoribbon-based hysteretic memory |
Uygar E. Avci, Abhishek Sharma |
2025-11-11 |
|
| 12471334 |
Integrated circuit devices with angled transistors formed based on angled wafers |
Abhishek Sharma, Tahir Ghani, Anand S. Murthy, Sagar Suthram |
2025-11-11 |
|
| 12471362 |
Integrated circuit structures having ultra-high conductivity global routing |
Abhishek Sharma, Tahir Ghani, Anand S. Murthy, Sagar Suthram, Pushkar Ranade +2 more |
2025-11-11 |
|
| 12453123 |
Transistor with front-side and back-side contacts and routing |
Abhishek Sharma, Mauro J. Kobrinsky |
2025-10-21 |
|
| 12436711 |
Providing fine grain access to package memory |
Abhishek Sharma, Rajabali M. Koduri, Pushkar Ranade |
2025-10-07 |
|
| 12432897 |
Cooling approaches for stitched dies |
Abhishek A. Sharma, Christopher M. Pelto, Mark C. Phillips, Swaminathan Sivakumar |
2025-09-30 |
|
| 12412835 |
Back-side power delivery with glass support at the front |
Abhishek A. Sharma, Telesphor Kamgaing |
2025-09-09 |
|
| 12406956 |
Bilayer memory stacking with computer logic circuits shared between bottom and top memory layers |
Abhishek A. Sharma, Van H. Le, Kimin Jun, Hui Jae Yoo |
2025-09-02 |
|
| 12400997 |
Hybrid manufacturing with modified via-last process |
Abhishek A. Sharma, Mauro J. Kobrinsky, Doug B. Ingerly, Van H. Le |
2025-08-26 |
|
| 12396155 |
Backend memory with air gaps in upper metal layers |
Abhishek A. Sharma, Albert Chen, Fatih Hamzaoglu, Travis W. Lajoie, Van H. Le +3 more |
2025-08-19 |
|
| 12381193 |
Integrated circuit assemblies |
Abhishek A. Sharma, Van H. Le, Doug B. Ingerly |
2025-08-05 |
|
| 12355002 |
Hyperchip |
Mark Bohr, Rajesh Kumar, Pooya Tadayon, Doug B. Ingerly |
2025-07-08 |
|
| 12327809 |
Vertically stacked and bonded memory arrays |
Abhishek A. Sharma, Mauro J. Kobrinsky |
2025-06-10 |
|
| 12327581 |
Embedded memory IC's with power supply droop circuitry coupled to ferroelectric capacitors |
Abhishek A. Sharma, Uygar E. Avci |
2025-06-10 |
|
| 12310032 |
Stacked backend memory with resistive switching devices |
Abhishek A. Sharma, Van H. Le, Hui Jae Yoo |
2025-05-20 |
|
| 12310001 |
Decoupling capacitors and methods of fabrication |
Juan G. Alzate-Vinasco, Travis W. Lajoie, Fatih Hamzaoglu, Pulkit Jain, James Waldemer +4 more |
2025-05-20 |
|
| 12278229 |
Hybrid manufacturing for integrated circuit devices and assemblies |
Abhishek A. Sharma, Mauro J. Kobrinsky, Doug B. Ingerly |
2025-04-15 |
|
| 12271306 |
Integrated three-dimensional (3D) DRAM cache |
Adrian C. Moga, Abhishek A. Sharma |
2025-04-08 |
|
| 12197007 |
Multi-layered optical integrated circuit assembly with a monocrystalline waveguide and lower crystallinity bonding layer |
Abhishek A. Sharma |
2025-01-14 |
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