Issued Patents All Time
Showing 25 most recent of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12426342 | Low germanium, high boron silicon rich capping layer for PMOS contact resistance thermal stability | Debaleena Nandi, Cory Bomberger, Gilbert Dewey, Anand S. Murthy, Rushabh SHAH +6 more | 2025-09-23 |
| 12419085 | Integrated circuit structures having backside gate tie-down | Leonard P. GULER, Mohit K. HARAN, Marni Nabors, Tahir Ghani, Charles H. Wallace +2 more | 2025-09-16 |
| 12400997 | Hybrid manufacturing with modified via-last process | Abhishek A. Sharma, Wilfred Gomes, Doug B. Ingerly, Van H. Le | 2025-08-26 |
| 12394716 | Integrated circuit interconnect structures with graphene cap | Carl Naylor, Jasmeet S. Chawla, Matthew V. Metz, Sean King, Ramanan V. Chebiam +5 more | 2025-08-19 |
| 12342574 | Contact resistance reduction in transistor devices with metallization on both sides | Koustav Ganguly, Ryan Keech, Subrina RAFIQUE, Glenn A. Glass, Anand S. Murthy +2 more | 2025-06-24 |
| 12334392 | Multi-height interconnect trenches for resistance and capacitance optimization | Kevin Lin, Mark A. Anders, Himanshu Kaul, Ram Krishnamurthy | 2025-06-17 |
| 12327809 | Vertically stacked and bonded memory arrays | Abhishek A. Sharma, Wilfred Gomes | 2025-06-10 |
| 12315794 | Skip level vias in metallization layers for integrated circuit devices | Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan, Gerald Pasdast, Sathya Narasimman Tiagaraj | 2025-05-27 |
| 12288746 | Skip level vias in metallization layers for integrated circuit devices | Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan, Gerald Pasdast, Sathya Narasimman Tiagaraj | 2025-04-29 |
| 12278229 | Hybrid manufacturing for integrated circuit devices and assemblies | Wilfred Gomes, Abhishek A. Sharma, Doug B. Ingerly | 2025-04-15 |
| 12230717 | Integrated circuit structures having partitioned source or drain contact structures | Stephanie A. Bojarski, Babita Dhayal, Biswajeet Guha, Tahir Ghani | 2025-02-18 |
| 12230721 | Gate-all-around integrated circuit structures having asymmetric source and drain contact structures | Biswajeet Guha, Tahir Ghani | 2025-02-18 |
| 12211794 | Integrated circuits and methods for forming thin film crystal layers | Carl Naylor, Ashish Agrawal, Kevin Lin, Abhishek A. Sharma, Christopher J. Jezewski +1 more | 2025-01-28 |
| 12199143 | Gate-all-around integrated circuit structures having removed substrate | Biswajeet Guha, Patrick Morrow, Oleg Golonzka, Tahir Ghani | 2025-01-14 |
| 12170273 | Integrated circuit assemblies with direct chip attach to circuit boards | Wilfred Gomes, Sanka Ganesan, Abhishek A. Sharma, Doug B. Ingerly, Kevin J. Fischer | 2024-12-17 |
| 12148751 | Use of a placeholder for backside contact formation for transistor arrangements | Andy Wei, Anand S. Murthy, Guillaume Bouche | 2024-11-19 |
| 12147083 | Hybrid manufacturing for integrating photonic and electronic components | Abhishek A. Sharma, Wilfred Gomes | 2024-11-19 |
| 12114479 | Three-dimensional memory arrays with layer selector transistors | Wilfred Gomes, Abhishek A. Sharma, Rajesh Kumar, Kinyip Phoa, Elliot N. Tan +2 more | 2024-10-08 |
| 12107170 | Transistor channel passivation with 2D crystalline material | Carl Naylor, Abhishek A. Sharma, Christopher J. Jezewski, Urusa Alaan, Justin R. Weber | 2024-10-01 |
| 12100705 | Deep trench via for three-dimensional integrated circuit | Yih Wang, Rishabh Mehandru, Tahir Ghani, Mark Bohr, Marni Nabors | 2024-09-24 |
| 12058849 | Three-dimensional nanoribbon-based dynamic random-access memory | Wilfred Gomes, Kinyip Phoa, Tahir Ghani, Uygar E. Avci, Rajesh Kumar | 2024-08-06 |
| 11996362 | Integrated circuit device with crenellated metal trace layout | Patrick Morrow, Mark Bohr, Tahir Ghani, Rishabh Mehandru, Ranjith Kumar | 2024-05-28 |
| 11985909 | Fabrication of stackable embedded eDRAM using a binary alloy based on antimony | Elijah V. Karpov | 2024-05-14 |
| 11948874 | Vertically spaced intra-level interconnect line metallization for integrated circuit devices | Kevin Lin, Sukru YEMENICIOGLU, Patrick Morrow, Richard E. Schenker | 2024-04-02 |
| 11901347 | Microelectronic package with three-dimensional (3D) monolithic memory die | Wilfred Gomes, Doug B. Ingerly, Tahir Ghani | 2024-02-13 |