Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12419085 | Integrated circuit structures having backside gate tie-down | Leonard P. GULER, Mauro J. Kobrinsky, Mohit K. HARAN, Marni Nabors, Tahir Ghani +2 more | 2025-09-16 |
| 12051692 | Integrated circuit structure with front side signal lines and backside power delivery | Quan Shi, Marni Nabors, Nikolay RYZHENKO, Xinning Wang, Sivakumar Venkataraman | 2024-07-30 |
| 11948874 | Vertically spaced intra-level interconnect line metallization for integrated circuit devices | Kevin Lin, Patrick Morrow, Richard E. Schenker, Mauro J. Kobrinsky | 2024-04-02 |
| 11764219 | Metal space centered standard cell architecture to enable higher cell density | Harshitha Vishwanath, Renukprasad HIREMATH, Ranjith Kumar, Ruth A. Brain | 2023-09-19 |