| 12308284 |
Plug and trench architectures for integrated circuits and methods of manufacture |
Charles H. Wallace, Marvin Young Paik, Hyunsoo Park, Mohit K. HARAN, Alexander F. Kaplan |
2025-05-20 |
|
| 11764219 |
Metal space centered standard cell architecture to enable higher cell density |
Harshitha Vishwanath, Renukprasad HIREMATH, Sukru YEMENICIOGLU, Ranjith Kumar |
2023-09-19 |
$20,015,000 |
| 11723188 |
Replacement metal COB integration process for embedded DRAM |
Uygar E. Avci, Ian A. Young, Daniel H. Morris, Seiyon Kim, Yih Wang |
2023-08-08 |
$22,376,000 |
| 11652045 |
Via contact patterning method to increase edge placement error margin |
Mohit K. HARAN, Daniel James Bahr, Deepak S. Rao, Marvin Young Paik, Seungdo An +6 more |
2023-05-16 |
$11,130,000 |
| 11417567 |
Conductive cap-based approaches for conductive via fabrication and structures resulting therefrom |
Florian Gstrein, Eungnak Han, Rami Hourani, Paul A. Nyhus, Manish Chandhok +2 more |
2022-08-16 |
$17,788,000 |
| 11322504 |
Ferroelectric-capacitor integration using novel multi-metal-level interconnect with replaced dielectric for ultra-dense embedded SRAM in state-of-the-art CMOS technology |
Uygar E. Avci, Daniel H. Morris, Seiyon Kim, Yih Wang, Ian A. Young |
2022-05-03 |
$16,346,000 |
| 11211324 |
Via contact patterning method to increase edge placement error margin |
Mohit K. HARAN, Daniel James Bahr, Deepak S. Rao, Marvin Young Paik, Seungdo An +6 more |
2021-12-28 |
$27,770,000 |
| 11171043 |
Plug and trench architectures for integrated circuits and methods of manufacture |
Charles H. Wallace, Marvin Young Paik, Hyunsoo Park, Mohit K. HARAN, Alexander F. Kaplan |
2021-11-09 |
$28,241,000 |
| 11145541 |
Conductive via and metal line end fabrication and structures resulting therefrom |
Charles H. Wallace, Reken Patel, Hyunsoo Park, Mohit K. HARAN, Debashish Basu +1 more |
2021-10-12 |
$32,982,000 |
| 11068640 |
Power shared cell architecture |
Ranjith Kumar, Mark Bohr, Marni Nabors, Tai-Hsuan Wu, Sourav Chakravarty |
2021-07-20 |
$44,320,000 |
| 10943817 |
Etch-stop layer topography for advanced integrated circuit structure fabrication |
Andrew W. Yeoh, Michael L. Hattendorf, Christopher P. Auth |
2021-03-09 |
$45,039,000 |
| 10903114 |
Decoupled via fill |
Yuriy V. Shusterman, Flavio Griggio, Tejaswi K. Indukuri |
2021-01-26 |
$50,999,000 |
| 10811595 |
Techniques for forming logic including integrated spin-transfer torque magnetoresistive random-access memory |
Kevin J. Lee, Oleg Golonzka, Tahir Ghani, Yih Wang |
2020-10-20 |
$43,271,000 |
| 10796951 |
Etch-stop layer topography for advanced integrated circuit structure fabrication |
Andrew W. Yeoh, Michael L. Hattendorf, Christopher P. Auth |
2020-10-06 |
$29,609,000 |
| 10672650 |
Via blocking layer |
Rami Hourani, Marie Krysak, Florian Gstrein, Mark Bohr |
2020-06-02 |
$32,838,000 |
| 10593626 |
AVD hardmask for damascene patterning |
Kevin J. Fischer, Michael A. Childs |
2020-03-17 |
$21,927,000 |
| 10535601 |
Via blocking layer |
Rami Hourani, Marie Krysak, Florian Gstrein, Mark Bohr, Manish Chandhok |
2020-01-14 |
$30,813,000 |
| 10468298 |
Decoupled via fill |
Yuriy V. Shusterman, Flavio Griggio, Tejaswi K. Indukuri |
2019-11-05 |
$22,190,000 |
| 10211098 |
Decoupled via fill |
Yuriy V. Shusterman, Flavio Griggio, Tejaswi K. Indukuri |
2019-02-19 |
$27,334,000 |
| 10032643 |
Method and structure to contact tight pitch conductive layers with guided vias using alternating hardmasks and encapsulating etchstop liner scheme |
Jasmeet S. Chawla, Richard E. Schenker, Kanwal Jit Singh, Alan M. Myers |
2018-07-24 |
$23,531,000 |
| 10032857 |
Etchstop layers and capacitors |
— |
2018-07-24 |
$23,531,000 |
| 10026649 |
Decoupled via fill |
Yuriy V. Shusterman, Flavio Griggio, Tejaswi K. Indukuri |
2018-07-17 |
$22,904,000 |
| 9899255 |
Via blocking layer |
Rami Hourani, Marie Krysak, Florian Gstrein, Mark Bohr |
2018-02-20 |
$17,556,000 |
| 9780038 |
AVD hardmask for damascene patterning |
Kevin J. Fischer, Michael A. Childs |
2017-10-03 |
$11,313,000 |
| 9607992 |
Etchstop layers and capacitors |
— |
2017-03-28 |
$8,391,000 |
