| 12394158 |
Content playback based on a path |
Allessandra E. McGinnis, Connor A. Smith, Jack R. Dashwood, Luis R. Deliz Centeno |
2025-08-19 |
|
| 12113948 |
Systems and methods of managing spatial groups in multi-user communication sessions |
Connor A. Smith, Willem MATTELAER, Joseph P. Cerra |
2024-10-08 |
$261,024,000 |
| 12099695 |
Systems and methods of managing spatial groups in multi-user communication sessions |
Connor A. Smith, Willem MATTELAER, Joseph P. Cerra |
2024-09-24 |
$301,193,000 |
| 12101197 |
Temporarily suspending spatial constraints |
Connor A. Smith, Luis R. Deliz Centeno |
2024-09-24 |
$301,193,000 |
| 11989404 |
Time-based visualization of content anchored in time |
Allessandra E. McGinnis, Luis R. Deliz Centeno |
2024-05-21 |
$215,899,000 |
| 11620653 |
Systems and methods for configuring and implementing a malicious account testing machine learning model in a machine learning-based digital threat mitigation platform |
Wei Liu, Hui Wang, Rishabh Kothari, Helen Marushchenko |
2023-04-04 |
|
| 11469268 |
Damascene-based approaches for embedding spin hall MTJ devices into a logic processor and the resulting structures |
Yih Wang |
2022-10-11 |
$16,542,000 |
| 11429974 |
Systems and methods for configuring and implementing a card testing machine learning model in a machine learning-based digital threat mitigation platform |
Wei Liu, Hui Wang, Rishabh Kothari, Helen Marushchenko |
2022-08-30 |
|
| 11393873 |
Approaches for embedding spin hall MTJ devices into a logic processor and the resulting structures |
Yih Wang |
2022-07-19 |
$11,394,000 |
| 11037896 |
Method and apparatus for forming backside die planar devices and saw filter |
Ruchir Saraswat, Uwe Zillmann, Nicholas P. Cowley, Richard J. Goldman |
2021-06-15 |
$33,380,000 |
| 10811595 |
Techniques for forming logic including integrated spin-transfer torque magnetoresistive random-access memory |
Oleg Golonzka, Tahir Ghani, Ruth A. Brain, Yih Wang |
2020-10-20 |
$43,271,000 |
| 10790263 |
Integrated circuit die having backside passive components and methods associated therewith |
— |
2020-09-29 |
$31,444,000 |
| 10644064 |
Logic chip including embedded magnetic tunnel junctions |
Tahir Ghani, Joseph M. Steigerwald, John H. Epple, Yih Wang |
2020-05-05 |
$29,615,000 |
| 10455308 |
Die with integrated microphone device using through-silicon vias (TSVs) |
Ruchir Saraswat, Uwe Zillmann, Valluri Rao, Tor Lund-Larsen, Nicholas P. Cowley |
2019-10-22 |
$16,310,000 |
| 10290598 |
Method and apparatus for forming backside die planar devices and saw filter |
Ruchir Saraswat, Uwe Zillmann, Nicholas P. Cowley, Richard J. Goldman |
2019-05-14 |
$24,469,000 |
| 10224309 |
Integrated circuit die having backside passive components and methods associated therewith |
— |
2019-03-05 |
$19,977,000 |
| 9997563 |
Logic chip including embedded magnetic tunnel junctions |
Tahir Ghani, Joseph M. Steigerwald, John H. Epple, Yih Wang |
2018-06-12 |
$21,622,000 |
| 9911689 |
Through-body-via isolated coaxial capacitor and techniques for forming same |
Ruchir Saraswat, Uwe Zillmann, Nicholas P. Cowley, Andre Schaefer, Rinkle Jain +1 more |
2018-03-06 |
$18,859,000 |
| 9852964 |
Through-body via formation techniques |
— |
2017-12-26 |
$14,594,000 |
| 9721886 |
Preservation of fine pitch redistribution lines |
Hiten Kothari, Wayne M. Lytle |
2017-08-01 |
$11,137,000 |
| 9716066 |
Interconnect structure comprising fine pitch backside metal redistribution lines combined with vias |
James Jeong, Hsiao-Kang Chang, John Muirhead, Adwait Telang, Puneesh Puri +2 more |
2017-07-25 |
$17,281,000 |
| 9660181 |
Logic chip including embedded magnetic tunnel junctions |
Tahir Ghani, Joseph M. Steigerwald, John H. Epple, Yih Wang |
2017-05-23 |
$7,972,000 |
| 9530740 |
3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach |
Mark Bohr, Andrew W. Yeoh, Christopher M. Pelto, Hiten Kothari, Seshu V. Sattiraju +1 more |
2016-12-27 |
$11,980,000 |
| 9489354 |
Masking content while preserving layout of a webpage |
Michael W. Nail, Homan Lee |
2016-11-08 |
$53,719,000 |
| 9449913 |
3D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias |
Mark Bohr, Andrew W. Yeoh, Christopher M. Pelto, Hiten Kothari, Seshu V. Sattiraju +1 more |
2016-09-20 |
$10,814,000 |
