| 10455308 |
Die with integrated microphone device using through-silicon vias (TSVs) |
Kevin J. Lee, Ruchir Saraswat, Uwe Zillmann, Valluri Rao, Nicholas P. Cowley |
2019-10-22 |
| 9335944 |
In-place change between transient and persistent state for data structures on non-volatile memory |
Matthias Gries, Marcelo Cintra, Thomas Lehnig, Sebastian Steibl |
2016-05-10 |
| 9287196 |
Resonant clocking for three-dimensional stacked devices |
Ruchir Saraswat, Uwe Zillmann, Andre Schaefer |
2016-03-15 |
| 9128824 |
In-place change between transient and persistent state for data structures on non-volatile memory |
Matthias Gries, Marcelo Cintra, Thomas Lehnig, Sebastian Steibl |
2015-09-08 |
| D473220 |
Digital subscriber line gateway |
Todd L. Smith, Michael P. Colombo, Craig Jahne, Stephen Brown, Philip White +3 more |
2003-04-15 |