| 11037896 |
Method and apparatus for forming backside die planar devices and saw filter |
Kevin J. Lee, Ruchir Saraswat, Nicholas P. Cowley, Richard J. Goldman |
2021-06-15 |
| 10455308 |
Die with integrated microphone device using through-silicon vias (TSVs) |
Kevin J. Lee, Ruchir Saraswat, Valluri Rao, Tor Lund-Larsen, Nicholas P. Cowley |
2019-10-22 |
| 10403511 |
Backside redistribution layer patch antenna |
Ruchir Saraswat, Nicholas P. Cowley |
2019-09-03 |
| 10290598 |
Method and apparatus for forming backside die planar devices and saw filter |
Kevin J. Lee, Ruchir Saraswat, Nicholas P. Cowley, Richard J. Goldman |
2019-05-14 |
| 10256286 |
Integrated inductor for integrated circuit devices |
Andreas Duevel, Telesphor Kamgaing, Valluri Rao |
2019-04-09 |
| 10079489 |
Power management in multi-die assemblies |
Guido Droege, Andre Schaefer |
2018-09-18 |
| 9921640 |
Integrated voltage regulators with magnetically enhanced inductors |
Andre Schaefer, Ruchir Saraswat, Telesphor Kamgaing, Paul B. Fischer, Guido Droege |
2018-03-20 |
| 9911689 |
Through-body-via isolated coaxial capacitor and techniques for forming same |
Kevin J. Lee, Ruchir Saraswat, Nicholas P. Cowley, Andre Schaefer, Rinkle Jain +1 more |
2018-03-06 |
| 9881990 |
Integrated inductor for integrated circuit devices |
Andreas Duevel, Telesphor Kamgaing, Valluri Rao |
2018-01-30 |
| 9673268 |
Integrated inductor for integrated circuit devices |
Andreas Duevel, Telesphor Kamgaing, Valluri Rao |
2017-06-06 |
| 9391453 |
Power management in multi-die assemblies |
Guido Droege, Andre Schaefer |
2016-07-12 |
| 9287196 |
Resonant clocking for three-dimensional stacked devices |
Ruchir Saraswat, Andre Schaefer, Tor Lund-Larsen |
2016-03-15 |