| 12512396 |
Flexible die to floor planning with bump pitch scale through glass core via pitch |
Andrew Collins, Srinivas V. Pietambaram, Tarek A. Ibrahim, Aleksandar Aleksov |
2025-12-30 |
|
| 12489189 |
Contactless communication using a waveguide extending through a substrate core |
Neelam Prabhu Gaunkar, Georgios Dogiamis, Johanna M. Swan |
2025-12-02 |
|
| 12444619 |
Physical vapor deposition seeding for high aspect ratio vias in glass core technology |
Veronica Strong, Aleksandar Aleksov, Georgios Dogiamis, Neelam Prabhu Gaunkar |
2025-10-14 |
|
| 12424719 |
Compact surface transmission line waveguides with vertical ground planes |
Neelam Prabhu Gaunkar, Georgios Dogiamis, Veronica Strong, Aleksandar Aleksov |
2025-09-23 |
|
| 12424716 |
RF filters and multiplexers manufactured in the core of a package substrate using glass core technology |
Aleksandar Aleksov, Neelam Prabhu Gaunkar, Veronica Strong, Georgios Dogiamis |
2025-09-23 |
|
| 12412835 |
Back-side power delivery with glass support at the front |
Abhishek A. Sharma, Wilfred Gomes |
2025-09-09 |
|
| 12400934 |
Dielectric film coating for through glass vias and plane surface roughness mitigation |
Veronica Strong, Robert Jordan |
2025-08-26 |
|
| 12368091 |
Package substrate with glass core having vertical power planes for improved power delivery |
Aleksandar Aleksov, Veronica Strong, Georgios Dogiamis, Neelam Prabhu Gaunkar |
2025-07-22 |
|
| 12362297 |
Semiconductor packages with antennas |
Adel A. Elsherbini, Sasha N. Oster |
2025-07-15 |
|
| 12347788 |
Glass substrates having signal shielding for use with semiconductor packages and related methods |
Kristof Darmawikarta, Srinivas V. Pietambaram, Kemal Aygun, Zhiguo Qian, Jiwei Sun |
2025-07-01 |
|
| 12347761 |
Magnetic planar spiral and high aspect ratio inductors for power delivery in the glass-core of a package substrate |
Aleksandar Aleksov, Neelam Prabhu Gaunkar, Georgios Dogiamis, Veronica Strong, Johanna M. Swan |
2025-07-01 |
|
| 12327794 |
Die coupling using a substrate with a glass core |
Johanna M. Swan |
2025-06-10 |
|
| 12261097 |
Thermal management in integrated circuit packages |
Feras Eid, Georgios Dogiamis, Aleksandar Aleksov, Johanna M. Swan |
2025-03-25 |
|
| 12255158 |
Components for millimeter-wave communication |
Neelam Prabhu Gaunkar, Georgios Dogiamis, Diego Correas-Serrano, Henning Braunisch |
2025-03-18 |
|
| 12205908 |
Die to die high-speed communication without discrete amplifiers between a mixer and transmission line |
— |
2025-01-21 |
|
| 12183961 |
Methods for conductively coating millimeter waveguides |
Aleksandar Aleksov, Georgios Dogiamis, Sasha N. Oster, Adel A. Elsherbini, Shawna M. Liff +3 more |
2024-12-31 |
$16,542,000 |
| 12165994 |
Radio frequency antennas and waveguides for communication between integrated circuit devices |
Aleksandar Aleksov, Kristof Darmawikarta, Benjamin Duong, Miranda Ngan, Srinivas V. Pietambaram |
2024-12-10 |
$13,394,000 |
| 12166261 |
Components for millimeter-wave communication |
Diego Correas-Serrano, Georgios Dogiamis, Henning Braunisch, Neelam Prabhu Gaunkar |
2024-12-10 |
$13,394,000 |
| 12155133 |
Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems |
Feras Eid, Sasha N. Oster, Georgios Dogiamis, Aleksandar Aleksov |
2024-11-26 |
$26,820,000 |
| 12155372 |
Multi-filter die |
Georgios Dogiamis, Aleksandar Aleksov, Feras Eid, Johanna M. Swan |
2024-11-26 |
$26,820,000 |
| 12150271 |
Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device |
Johanna M. Swan, Georgios Dogiamis, Henning Braunisch, Adel A. Elsherbini, Aleksandar Aleksov +1 more |
2024-11-19 |
$25,575,000 |
| 12126068 |
Millimeter-wave dielectric waveguide bundle including first and second adjacent dielectric waveguides having different core and/or cladding materials |
Diego Correas-Serrano, Georgios Dogiamis, Henning Braunisch, Neelam Prabhu Gaunkar |
2024-10-22 |
$18,859,000 |
| 12126067 |
Millimeter-wave dielectric waveguide including an opening of varying cross-section enclosed within a first material and the first material surrounded by a second material |
Diego Correas-Serrano, Georgios Dogiamis, Henning Braunisch, Neelam Prabhu Gaunkar |
2024-10-22 |
$18,859,000 |
| 12107314 |
Microelectronic support for millimeter-wave communication including a transmission line trace and via pad spaced apart from a respective anti-trace and anti-pad |
Neelam Prabhu Gaunkar, Georgios Dogiamis, Henning Braunisch, Diego Correas-Serrano |
2024-10-01 |
$20,560,000 |
| 12088360 |
Dispersive waveguide crosstalk mitigation |
Henning Braunisch, Georgios Dogiamis, Diego Correas-Serrano, Neelam Prabhu Gaunkar, Cooper S. Levy +2 more |
2024-09-10 |
$16,964,000 |
