Issued Patents All Time
Showing 25 most recent of 133 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12422615 | Nested glass packaging architecture for hybrid electrical and optical communication devices | Brandon C. Marin, Debendra Mallik, Tarek A. Ibrahim, Jeremy Ecton, Omkar G. Karhade +5 more | 2025-09-23 |
| 12412868 | Microelectronic assemblies including interconnects with different solder materials | Jeremy Ecton, Jason M. Gamba, Brandon C. Marin, Xiaoxuan Sun, Omkar G. Karhade +6 more | 2025-09-09 |
| 12392970 | Photonic integrated circuit packaging architectures | Omkar G. Karhade, Xiaoqian Li, Nitin A. Deshpande, Ravindranath V. Mahajan, Bharat P. Penmecha +1 more | 2025-08-19 |
| 12394719 | Methods and apparatus to increase glass core thickness | Jeremy Ecton, Brandon C. Marin, Bai Nie | 2025-08-19 |
| 12374482 | Carrier chuck comprising a plurality of magnets and methods of forming and using thereof | Yosef KORNBLUTH, Whitney Bryks, Ravindranadh Eluri, Aaditya Anand CANDADAI | 2025-07-29 |
| 12354883 | Omni directional interconnect with magnetic fillers in mold matrix | Bohan Shan, Dingying Xu, Kristof Darmawikarta, Hongxia Feng, Gang Duan +9 more | 2025-07-08 |
| 12353070 | Glass interposer optical switching device and method | Hiroki Tanaka, Brandon C. Marin, Kristof Darmawikarta, Jeremy Ecton, Hari Mahalingam +1 more | 2025-07-08 |
| 12354931 | Optimization for raster scanning | Vinith BEJUGAM, Kristof Darmawikarta, Yonggang Li, Samuel T. George | 2025-07-08 |
| 12345931 | Optical circuit with optical port in sidewall | Eric J. M. Moret, Tarek A. Ibrahim | 2025-07-01 |
| 12349282 | Capacitors in through glass vias | Benjamin Duong, Aleksandar Aleksov, Helme A. CASTRO DE LA TORRE, Kristof Darmawikarta, Darko Grujicic +5 more | 2025-07-01 |
| 12347788 | Glass substrates having signal shielding for use with semiconductor packages and related methods | Kristof Darmawikarta, Kemal Aygun, Telesphor Kamgaing, Zhiguo Qian, Jiwei Sun | 2025-07-01 |
| 12345932 | Die last and waveguide last architecture for silicon photonic packaging | Bai Nie, Pooya Tadayon, Leonel Arana, Yonggang Li, Changhua Liu +4 more | 2025-07-01 |
| 12336197 | In-plane inductors in IC packages | Brandon C. Marin, Tarek A. Ibrahim, Prithwish Chatterjee, Haifa Hariri, Yikang Deng +1 more | 2025-06-17 |
| 12334422 | Methods and apparatus to reduce defects in interconnects between semicondcutor dies and package substrates | Kyle McElhinny, Onur Ozkan, Ali Lehaf, Xiaoying Guo, Steve Cho +4 more | 2025-06-17 |
| 12327797 | Microelectronic structures including glass cores | Tarek A. Ibrahim, Gang Duan, Sai Vadlamani, Bharat P. Penmecha | 2025-06-10 |
| 12308329 | Chiplet first architecture for die tiling applications | Gang Duan, Deepak Kulkarni, Rahul N. Manepalli, Xiaoying Guo | 2025-05-20 |
| 12306480 | Glass interposer optical resonator device and method | Hiroki Tanaka, Brandon C. Marin, Kristof Darmawikarta, Jeremy Ecton, Rajeev Ranjan | 2025-05-20 |
| 12300620 | Inorganic-based embedded-die layers for modular semiconductive devices | Tarek A. Ibrahim, Kristof Darmawikarta, Rahul N. Manepalli, Debendra Mallik, Robert L. Sankman | 2025-05-13 |
| 12272484 | Coreless electronic substrates having embedded inductors | Pooya Tadayon, Kristof Darmawikarta, Tarek A. Ibrahim, Prithwish Chatterjee | 2025-04-08 |
| 12272656 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman, Shawna M. Liff, Bharat P. Penmecha | 2025-04-08 |
| 12255147 | Electronic substrate having an embedded etch stop to control cavity depth in glass layers therein | Jeremy Ecton, Brandon C. Marin, Suddhasattwa Nad | 2025-03-18 |
| 12249584 | Microelectronic assemblies having integrated magnetic core inductors | Kristof Darmawikarta, Benjamin Duong, Tarek A. Ibrahim | 2025-03-11 |
| 12243825 | Hybrid conductive vias for electronic substrates | Rahul N. Manepalli | 2025-03-04 |
| 12230430 | Substrate embedded magnetic core inductors and method of making | Kristof Darmawikarta, Gang Duan, Yonggang Li, Sameer Paital | 2025-02-18 |
| 12224103 | Angled inductor with small form factor | Brandon C. Marin, Jeremy Ecton, Suddhasattwa Nad, Matthew Tingey, Ravindranath V. Mahajan | 2025-02-11 |