Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12412868 | Microelectronic assemblies including interconnects with different solder materials | Jeremy Ecton, Jason M. Gamba, Brandon C. Marin, Srinivas V. Pietambaram, Xiaoxuan Sun +6 more | 2025-09-09 | |
| 12354883 | Omni directional interconnect with magnetic fillers in mold matrix | Dingying Xu, Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng, Gang Duan +9 more | 2025-07-08 | |
| 12119326 | Microelectronic structures including bridges | Omkar G. Karhade | 2024-10-15 | $19,078,000 |
| 12033930 | Selectively roughened copper architectures for low insertion loss conductive features | Jieying Kong, Yiyang Zhou, Suddhasattwa Nad, Jeremy Ecton, Hongxia Feng +9 more | 2024-07-09 | $24,938,000 |
| 11753731 | Two-dimensional metal-organic framework alloy photocatalysts | Bin Mu, Sefaattin Tongay, Yuxia Shen, Joseph Winarta | 2023-09-12 | |
| 9716239 | Phototunable metal-organic framework compositions, and methods of synthesis thereof | Bin Mu | 2017-07-25 |