| 12494441 |
BGA stiffener attachment with low Eolife adhesive strength at high solder joint stress area generated from enabling load |
Phil Geng, Patrick Nardi, Ravindranath V. Mahajan, Praveen Raghavan, John Harper +2 more |
2025-12-09 |
|
| 12354883 |
Omni directional interconnect with magnetic fillers in mold matrix |
Bohan Shan, Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng, Gang Duan +9 more |
2025-07-08 |
|
| 12341117 |
Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates |
Kyle McElhinny, Hongxia Feng, Xiaoying Guo, Steve Cho, Jung Kyu Han +4 more |
2025-06-24 |
|
| 12230563 |
Method to enable 30 microns pitch EMIB or below |
Hongxia Feng, Sheng Li, Matthew Tingey, Meizi Jiao, Chung Kwang Christopher Tan |
2025-02-18 |
|
| 12230564 |
Package substrate z-disaggregation with liquid metal interconnects |
Brandon C. Marin, Tarek A. Ibrahim, Karumbu Meyyappan, Valery Ouvarov-Bancalero |
2025-02-18 |
|
| 12068222 |
Dummy die structures of a packaged integrated circuit device |
Mitul Modi, Joseph Van Nausdle, Omkar G. Karhade, Edvin Cetegen, Nicholas S. Haehn +4 more |
2024-08-20 |
$20,163,000 |
| 12033930 |
Selectively roughened copper architectures for low insertion loss conductive features |
Jieying Kong, Yiyang Zhou, Suddhasattwa Nad, Jeremy Ecton, Hongxia Feng +9 more |
2024-07-09 |
$24,938,000 |
| 11923312 |
Patternable die attach materials and processes for patterning |
Bai Nie, Gang Duan, Srinivas V. Pietambaram, Jesse C. Jones, Yosuke Kanaoka +10 more |
2024-03-05 |
$29,696,000 |
| 11676891 |
Method to enable 30 microns pitch EMIB or below |
Hongxia Feng, Sheng Li, Matthew Tingey, Meizi Jiao, Chung Kwang Christopher Tan |
2023-06-13 |
$22,204,000 |
| 11340258 |
Probe pins with etched tips for electrical die test |
Joseph D. Stanford, David Craig, Todd P. Albertson, Mohit Mamodia |
2022-05-24 |
$18,289,000 |
| 11088062 |
Method to enable 30 microns pitch EMIB or below |
Hongxia Feng, Sheng Li, Matthew Tingey, Meizi Jiao, Chung Kwang Christopher Tan |
2021-08-10 |
$36,027,000 |
| 10598696 |
Probe pins with etched tips for electrical die test |
Joseph D. Stanford, David Craig, Todd P. Albertson, Mohit Mamodia |
2020-03-24 |
$21,125,000 |
| 10499461 |
Thermal head with a thermal barrier for integrated circuit die processing |
Mohit Mamodia, Kyle Yazzie, Kuang Liu, Paul Diglio, Pramod Malatkar |
2019-12-03 |
$19,496,000 |
| 10168357 |
Coated probe tips for plunger pins of an integrated circuit package test system |
Wen Yin, Anna M. Prakash, Teag R. Haughan, Joaquin Aguilar-Santillan |
2019-01-01 |
|
| 9941652 |
Space transformer with perforated metallic plate for electrical die test |
Nachiket R. Raravikar, James C. Matayabas, Jr., Akshay Mathkar |
2018-04-10 |
$20,820,000 |
| 9793151 |
Stiffener tape for electronic assembly |
Xavier Francois Brun, Arjun Krishnan, Mohit Mamodia |
2017-10-17 |
$9,876,000 |
| 9659889 |
Solder-on-die using water-soluble resist system and method |
Mihir A. Oka, Xavier Francois Brun, Edward R. Prack, Kabirkumar Mirpuri, Saikumar Jayaraman |
2017-05-23 |
$7,972,000 |
| 9543197 |
Package with dielectric or anisotropic conductive (ACF) buildup layer |
Chuan Hu, Yoshihiro Tomita |
2017-01-10 |
$11,357,000 |
| 9472517 |
Dry-removable protective coatings |
Mihir A. Oka, Edward R. Prack, Saikumar Jayaraman |
2016-10-18 |
$9,528,000 |
| 9458283 |
Flexible underfill compositions for enhanced reliability |
Nisha Ananthakrishnan, Hong Dong, Rahul N. Manepalli, Nachiket R. Raravikar, Gregory S. Constable |
2016-10-04 |
$11,494,000 |
| 9068067 |
Flexible underfill compositions for enhanced reliability |
Nisha Ananthakrishnan, Hong Dong, Rahul N. Manepalli, Nachiket R. Raravikar, Gregory S. Constable |
2015-06-30 |
$18,547,000 |
| 8569108 |
Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die |
Leonel Arana, Nachiket R. Raravikar, Mohit Mamodia, Rajasekaran Swaminathan, Rahul N. Manepalli |
2013-10-29 |
$22,754,000 |
| 8466559 |
Forming die backside coating structures with coreless packages |
Rahul N. Manepalli, Mohit Mamodia, Javier Soto Gonzalez, Edward R. Prack |
2013-06-18 |
$21,688,000 |
| 8304065 |
Treatment for a microelectronic device and method of resisting damage to a microelectronic device using same |
Leonel Arana, Vijay Wakharkar, Wen Feng, Nirupama Chakrapani, Shankar Ganapathysubramanian +2 more |
2012-11-06 |
|
| 8287996 |
Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die |
Leonel Arana, Nachiket R. Raravikar, Mohit Mamodia, Rajasekaran Swaminathan, Rahul N. Manepalli |
2012-10-16 |
$11,593,000 |
