Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354883 | Omni directional interconnect with magnetic fillers in mold matrix | Bohan Shan, Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng, Gang Duan +9 more | 2025-07-08 |
| 12341117 | Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates | Kyle McElhinny, Hongxia Feng, Xiaoying Guo, Steve Cho, Jung Kyu Han +4 more | 2025-06-24 |
| 12230564 | Package substrate z-disaggregation with liquid metal interconnects | Brandon C. Marin, Tarek A. Ibrahim, Karumbu Meyyappan, Valery Ouvarov-Bancalero | 2025-02-18 |
| 12230563 | Method to enable 30 microns pitch EMIB or below | Hongxia Feng, Sheng Li, Matthew Tingey, Meizi Jiao, Chung Kwang Christopher Tan | 2025-02-18 |
| 12068222 | Dummy die structures of a packaged integrated circuit device | Mitul Modi, Joseph Van Nausdle, Omkar G. Karhade, Edvin Cetegen, Nicholas S. Haehn +4 more | 2024-08-20 |
| 12033930 | Selectively roughened copper architectures for low insertion loss conductive features | Jieying Kong, Yiyang Zhou, Suddhasattwa Nad, Jeremy Ecton, Hongxia Feng +9 more | 2024-07-09 |
| 11923312 | Patternable die attach materials and processes for patterning | Bai Nie, Gang Duan, Srinivas V. Pietambaram, Jesse C. Jones, Yosuke Kanaoka +10 more | 2024-03-05 |
| 11676891 | Method to enable 30 microns pitch EMIB or below | Hongxia Feng, Sheng Li, Matthew Tingey, Meizi Jiao, Chung Kwang Christopher Tan | 2023-06-13 |
| 11340258 | Probe pins with etched tips for electrical die test | Joseph D. Stanford, David Craig, Todd P. Albertson, Mohit Mamodia | 2022-05-24 |
| 11088062 | Method to enable 30 microns pitch EMIB or below | Hongxia Feng, Sheng Li, Matthew Tingey, Meizi Jiao, Chung Kwang Christopher Tan | 2021-08-10 |
| 10598696 | Probe pins with etched tips for electrical die test | Joseph D. Stanford, David Craig, Todd P. Albertson, Mohit Mamodia | 2020-03-24 |
| 10499461 | Thermal head with a thermal barrier for integrated circuit die processing | Mohit Mamodia, Kyle Yazzie, Kuang Liu, Paul Diglio, Pramod Malatkar | 2019-12-03 |
| 10168357 | Coated probe tips for plunger pins of an integrated circuit package test system | Wen Yin, Anna M. Prakash, Teag R. Haughan, Joaquin Aguilar-Santillan | 2019-01-01 |
| 9941652 | Space transformer with perforated metallic plate for electrical die test | Nachiket R. Raravikar, James C. Matayabas, Jr., Akshay Mathkar | 2018-04-10 |
| 9793151 | Stiffener tape for electronic assembly | Xavier Francois Brun, Arjun Krishnan, Mohit Mamodia | 2017-10-17 |
| 9659889 | Solder-on-die using water-soluble resist system and method | Mihir A. Oka, Xavier Francois Brun, Edward R. Prack, Kabirkumar Mirpuri, Saikumar Jayaraman | 2017-05-23 |
| 9543197 | Package with dielectric or anisotropic conductive (ACF) buildup layer | Chuan Hu, Yoshihiro Tomita | 2017-01-10 |
| 9472517 | Dry-removable protective coatings | Mihir A. Oka, Edward R. Prack, Saikumar Jayaraman | 2016-10-18 |
| 9458283 | Flexible underfill compositions for enhanced reliability | Nisha Ananthakrishnan, Hong Dong, Rahul N. Manepalli, Nachiket R. Raravikar, Gregory S. Constable | 2016-10-04 |
| 9068067 | Flexible underfill compositions for enhanced reliability | Nisha Ananthakrishnan, Hong Dong, Rahul N. Manepalli, Nachiket R. Raravikar, Gregory S. Constable | 2015-06-30 |
| 8569108 | Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die | Leonel Arana, Nachiket R. Raravikar, Mohit Mamodia, Rajasekaran Swaminathan, Rahul N. Manepalli | 2013-10-29 |
| 8466559 | Forming die backside coating structures with coreless packages | Rahul N. Manepalli, Mohit Mamodia, Javier Soto Gonzalez, Edward R. Prack | 2013-06-18 |
| 8304065 | Treatment for a microelectronic device and method of resisting damage to a microelectronic device using same | Leonel Arana, Vijay Wakharkar, Wen Feng, Nirupama Chakrapani, Shankar Ganapathysubramanian +2 more | 2012-11-06 |
| 8287996 | Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die | Leonel Arana, Nachiket R. Raravikar, Mohit Mamodia, Rajasekaran Swaminathan, Rahul N. Manepalli | 2012-10-16 |
| 7851342 | In-situ formation of conductive filling material in through-silicon via | Amram Eitan | 2010-12-14 |