Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417958 | Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone | Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Robert M. Nickerson +4 more | 2025-09-16 |
| 12347743 | Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone | Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Robert M. Nickerson +4 more | 2025-07-01 |
| 12315777 | Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone | Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Robert M. Nickerson +4 more | 2025-05-27 |
| 11804470 | Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control | Xavier Francois Brun, Kaizad Mistry, Paul R. Start, Yawei Liang, Jigneshkumar P. Patel +2 more | 2023-10-31 |
| 11776821 | Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap | Ziyin Lin, Vipul V. Mehta, Edvin Cetegen, Yuying Wei, Sushrutha Gujjula +1 more | 2023-10-03 |
| 11282717 | Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap | Ziyin Lin, Vipul V. Mehta, Edvin Cetegen, Yuying Wei, Sushrutha Gujjula +1 more | 2022-03-22 |
| 10475715 | Two material high K thermal encapsulant system | Venmathy McMahan, Sivakumar Nagarajan, Elah Bozorg-Grayeli, Amrita Mallik, Kuang-Han Chu +3 more | 2019-11-12 |
| 10115606 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Yiqun Bai, Yuying Wei, Arjun Krishnan, Suriyakala Ramalingam, Yonghao Xiu +3 more | 2018-10-30 |
| 9704767 | Mold compound with reinforced fibers | Suriyakala Ramalingam, Yiqun Bai, Arjun Krishnan | 2017-07-11 |
| 9640415 | Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials | Randall D. Lowe, Jr., Suriyakala Ramalingam, James C. Matayabas, Jr., Arjun Krishnan, Hitesh Arora | 2017-05-02 |
| 9631065 | Methods of forming wafer level underfill materials and structures formed thereby | Anna M. Prakash, James C. Matayabas, Jr., Arjun Krishnan | 2017-04-25 |
| 9611372 | Narrow-gap flip chip underfill composition | Yonghao Xiu, Yiqun Bai, Arjun Krishnan | 2017-04-04 |
| 9504168 | Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process | Sivakumar Nagarajan, Sandeep Razdan, Craig J. Weinman, Kabirkumar Mirpuri | 2016-11-22 |
| 9458283 | Flexible underfill compositions for enhanced reliability | Dingying Xu, Hong Dong, Rahul N. Manepalli, Nachiket R. Raravikar, Gregory S. Constable | 2016-10-04 |
| 9431274 | Method for reducing underfill filler settling in integrated circuit packages | Suriyakala Ramalingam, Manish Dubey, Hsin-Yu Li, Michelle S. Phen, Hitesh Arora +3 more | 2016-08-30 |
| 9330993 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Yiqun Bai, Yuying Wei, Arjun Krishnan, Suriyakala Ramalingam, Yonghao Xiu +3 more | 2016-05-03 |
| 9269596 | Narrow-gap flip chip underfill composition | Yonghao Xiu, Yiqun Bai, Arjun Krishnan | 2016-02-23 |
| 9068067 | Flexible underfill compositions for enhanced reliability | Dingying Xu, Hong Dong, Rahul N. Manepalli, Nachiket R. Raravikar, Gregory S. Constable | 2015-06-30 |
| 8916981 | Epoxy-amine underfill materials for semiconductor packages | Yonghao Xiu, Yiqun Bai, Nachiket R. Raravikar | 2014-12-23 |
| 8900919 | Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials | Randall D. Lowe, Jr., Suriyakala Ramalingam, James C. Matayabas, Jr., Arjun Krishnan, Hitesh Arora | 2014-12-02 |
| 8895365 | Techniques and configurations for surface treatment of an integrated circuit substrate | Suriyakala Ramalingam, Rajen S. Sidhu, Sivakumar Nagarajan, Wei Tan, Sandeep Razdan +1 more | 2014-11-25 |
| 7759780 | Microelectronic package with wear resistant coating | Nirupama Chakrapani, Vijay Wakharkar, Janet Feng, Shankar Ganapathysubramanian, Gregory S. Constable | 2010-07-20 |