| 12417958 |
Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone |
Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Robert M. Nickerson +4 more |
2025-09-16 |
|
| 12347743 |
Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone |
Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Robert M. Nickerson +4 more |
2025-07-01 |
|
| 12315777 |
Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone |
Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Robert M. Nickerson +4 more |
2025-05-27 |
|
| 11804470 |
Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control |
Xavier Francois Brun, Kaizad Mistry, Paul R. Start, Yawei Liang, Jigneshkumar P. Patel +2 more |
2023-10-31 |
$30,374,000 |
| 11776821 |
Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap |
Ziyin Lin, Vipul V. Mehta, Edvin Cetegen, Yuying Wei, Sushrutha Gujjula +1 more |
2023-10-03 |
$24,984,000 |
| 11282717 |
Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap |
Ziyin Lin, Vipul V. Mehta, Edvin Cetegen, Yuying Wei, Sushrutha Gujjula +1 more |
2022-03-22 |
$16,833,000 |
| 10475715 |
Two material high K thermal encapsulant system |
Venmathy McMahan, Sivakumar Nagarajan, Elah Bozorg-Grayeli, Amrita Mallik, Kuang-Han Chu +3 more |
2019-11-12 |
$21,873,000 |
| 10115606 |
Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby |
Yiqun Bai, Yuying Wei, Arjun Krishnan, Suriyakala Ramalingam, Yonghao Xiu +3 more |
2018-10-30 |
$31,457,000 |
| 9704767 |
Mold compound with reinforced fibers |
Suriyakala Ramalingam, Yiqun Bai, Arjun Krishnan |
2017-07-11 |
$8,311,000 |
| 9640415 |
Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials |
Randall D. Lowe, Jr., Suriyakala Ramalingam, James C. Matayabas, Jr., Arjun Krishnan, Hitesh Arora |
2017-05-02 |
$12,076,000 |
| 9631065 |
Methods of forming wafer level underfill materials and structures formed thereby |
Anna M. Prakash, James C. Matayabas, Jr., Arjun Krishnan |
2017-04-25 |
$8,972,000 |
| 9611372 |
Narrow-gap flip chip underfill composition |
Yonghao Xiu, Yiqun Bai, Arjun Krishnan |
2017-04-04 |
$8,141,000 |
| 9504168 |
Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process |
Sivakumar Nagarajan, Sandeep Razdan, Craig J. Weinman, Kabirkumar Mirpuri |
2016-11-22 |
$9,157,000 |
| 9458283 |
Flexible underfill compositions for enhanced reliability |
Dingying Xu, Hong Dong, Rahul N. Manepalli, Nachiket R. Raravikar, Gregory S. Constable |
2016-10-04 |
$11,494,000 |
| 9431274 |
Method for reducing underfill filler settling in integrated circuit packages |
Suriyakala Ramalingam, Manish Dubey, Hsin-Yu Li, Michelle S. Phen, Hitesh Arora +3 more |
2016-08-30 |
$15,019,000 |
| 9330993 |
Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby |
Yiqun Bai, Yuying Wei, Arjun Krishnan, Suriyakala Ramalingam, Yonghao Xiu +3 more |
2016-05-03 |
$11,131,000 |
| 9269596 |
Narrow-gap flip chip underfill composition |
Yonghao Xiu, Yiqun Bai, Arjun Krishnan |
2016-02-23 |
$10,383,000 |
| 9068067 |
Flexible underfill compositions for enhanced reliability |
Dingying Xu, Hong Dong, Rahul N. Manepalli, Nachiket R. Raravikar, Gregory S. Constable |
2015-06-30 |
$18,547,000 |
| 8916981 |
Epoxy-amine underfill materials for semiconductor packages |
Yonghao Xiu, Yiqun Bai, Nachiket R. Raravikar |
2014-12-23 |
$45,760,000 |
| 8900919 |
Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials |
Randall D. Lowe, Jr., Suriyakala Ramalingam, James C. Matayabas, Jr., Arjun Krishnan, Hitesh Arora |
2014-12-02 |
$19,830,000 |
| 8895365 |
Techniques and configurations for surface treatment of an integrated circuit substrate |
Suriyakala Ramalingam, Rajen S. Sidhu, Sivakumar Nagarajan, Wei Tan, Sandeep Razdan +1 more |
2014-11-25 |
$33,083,000 |
| 7759780 |
Microelectronic package with wear resistant coating |
Nirupama Chakrapani, Vijay Wakharkar, Janet Feng, Shankar Ganapathysubramanian, Gregory S. Constable |
2010-07-20 |
$9,455,000 |
