| 12506109 |
Die bonding tool with tiltable bond head for improved bonding and methods for performing the same |
Huang-Hsiang Lin, Chien-Huan Chen, Chia-Wei Chiu, Kai Jun Zhan |
2025-12-23 |
|
| 12417958 |
Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone |
Elizabeth Nofen, Shripad Gokhale, Nick Ross, Nisha Ananthakrishnan, Robert M. Nickerson +4 more |
2025-09-16 |
|
| 12347743 |
Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone |
Elizabeth Nofen, Shripad Gokhale, Nick Ross, Nisha Ananthakrishnan, Robert M. Nickerson +4 more |
2025-07-01 |
|
| 12341117 |
Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates |
Kyle McElhinny, Hongxia Feng, Xiaoying Guo, Steve Cho, Jung Kyu Han +4 more |
2025-06-24 |
|
| 12315777 |
Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone |
Elizabeth Nofen, Shripad Gokhale, Nick Ross, Nisha Ananthakrishnan, Robert M. Nickerson +4 more |
2025-05-27 |
|
| 11676900 |
Electronic assembly that includes a bridge |
Eric J. Li, Nitin A. Deshpande, Shawna M. Liff, Omkar G. Karhade, Timothy A. Gosselin |
2023-06-13 |
$22,204,000 |
| 11075166 |
Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate |
Eric J. Li, Timothy A. Gosselin, Yoshihiro Tomita, Shawna M. Liff, Mark Saltas |
2021-07-27 |
$27,337,000 |
| 10790231 |
Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate |
Eric J. Li, Timothy A. Gosselin, Yoshihiro Tomita, Shawna M. Liff, Mark Saltas |
2020-09-29 |
$31,444,000 |
| 10475715 |
Two material high K thermal encapsulant system |
Venmathy McMahan, Sivakumar Nagarajan, Elah Bozorg-Grayeli, Amrita Mallik, Kuang-Han Chu +3 more |
2019-11-12 |
$21,873,000 |
| 10418329 |
Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate |
Eric J. Li, Timothy A. Gosselin, Yoshihiro Tomita, Shawna M. Liff, Mark Saltas |
2019-09-17 |
$19,673,000 |
| 9786517 |
Ablation method and recipe for wafer level underfill material patterning and removal |
Rajendra C. Dias, Lars D. Skoglund, Anil R. Indluru, Edward R. Prack, Danish Faruqui +2 more |
2017-10-10 |
$9,084,000 |
| 9748199 |
Thermal compression bonding process cooling manifold |
Hemanth K. Dhavaleswarapu, Zhihua Li, Joseph B. Petrini, Steven B. Roach, Shankar Devasenathipathy +1 more |
2017-08-29 |
$8,286,000 |
| 9653411 |
Electronic package that includes fine powder coating |
Donglai Lu, Zhaozhi Li, Matthew T. Magnavita, Peng-Jen Chen |
2017-05-16 |
$8,597,000 |
| 9282650 |
Thermal compression bonding process cooling manifold |
Hemanth K. Dhavaleswarapu, Zhihua Li, Joseph B. Petrini, Steven B. Roach, Shankar Devasenathipathy +1 more |
2016-03-08 |
$14,558,000 |
| 7851342 |
In-situ formation of conductive filling material in through-silicon via |
Dingying Xu |
2010-12-14 |
$13,117,000 |
| 7727814 |
Microelectronic package interconnect and method of fabrication thereof |
Daewoong Suh, Yongki Min |
2010-06-01 |
$13,475,000 |
| 7557036 |
Method, system, and apparatus for filling vias |
Dingying Xu |
2009-07-07 |
$37,451,000 |
| 7402909 |
Microelectronic package interconnect and method of fabrication thereof |
Daewoong Suh, Yongki Min |
2008-07-22 |
$18,979,000 |
