Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417958 | Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone | Elizabeth Nofen, Shripad Gokhale, Nick Ross, Nisha Ananthakrishnan, Robert M. Nickerson +4 more | 2025-09-16 |
| 12347743 | Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone | Elizabeth Nofen, Shripad Gokhale, Nick Ross, Nisha Ananthakrishnan, Robert M. Nickerson +4 more | 2025-07-01 |
| 12341117 | Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates | Kyle McElhinny, Hongxia Feng, Xiaoying Guo, Steve Cho, Jung Kyu Han +4 more | 2025-06-24 |
| 12315777 | Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone | Elizabeth Nofen, Shripad Gokhale, Nick Ross, Nisha Ananthakrishnan, Robert M. Nickerson +4 more | 2025-05-27 |
| 11676900 | Electronic assembly that includes a bridge | Eric J. Li, Nitin A. Deshpande, Shawna M. Liff, Omkar G. Karhade, Timothy A. Gosselin | 2023-06-13 |
| 11075166 | Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate | Eric J. Li, Timothy A. Gosselin, Yoshihiro Tomita, Shawna M. Liff, Mark Saltas | 2021-07-27 |
| 10790231 | Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate | Eric J. Li, Timothy A. Gosselin, Yoshihiro Tomita, Shawna M. Liff, Mark Saltas | 2020-09-29 |
| 10475715 | Two material high K thermal encapsulant system | Venmathy McMahan, Sivakumar Nagarajan, Elah Bozorg-Grayeli, Amrita Mallik, Kuang-Han Chu +3 more | 2019-11-12 |
| 10418329 | Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate | Eric J. Li, Timothy A. Gosselin, Yoshihiro Tomita, Shawna M. Liff, Mark Saltas | 2019-09-17 |
| 9786517 | Ablation method and recipe for wafer level underfill material patterning and removal | Rajendra C. Dias, Lars D. Skoglund, Anil R. Indluru, Edward R. Prack, Danish Faruqui +2 more | 2017-10-10 |
| 9748199 | Thermal compression bonding process cooling manifold | Hemanth K. Dhavaleswarapu, Zhihua Li, Joseph B. Petrini, Steven B. Roach, Shankar Devasenathipathy +1 more | 2017-08-29 |
| 9653411 | Electronic package that includes fine powder coating | Donglai Lu, Zhaozhi Li, Matthew T. Magnavita, Peng-Jen Chen | 2017-05-16 |
| 9282650 | Thermal compression bonding process cooling manifold | Hemanth K. Dhavaleswarapu, Zhihua Li, Joseph B. Petrini, Steven B. Roach, Shankar Devasenathipathy +1 more | 2016-03-08 |
| 7851342 | In-situ formation of conductive filling material in through-silicon via | Dingying Xu | 2010-12-14 |
| 7727814 | Microelectronic package interconnect and method of fabrication thereof | Daewoong Suh, Yongki Min | 2010-06-01 |
| 7557036 | Method, system, and apparatus for filling vias | Dingying Xu | 2009-07-07 |
| 7402909 | Microelectronic package interconnect and method of fabrication thereof | Daewoong Suh, Yongki Min | 2008-07-22 |