Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354883 | Omni directional interconnect with magnetic fillers in mold matrix | Bohan Shan, Dingying Xu, Kristof Darmawikarta, Srinivas V. Pietambaram, Gang Duan +9 more | 2025-07-08 |
| 12341117 | Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates | Kyle McElhinny, Xiaoying Guo, Steve Cho, Jung Kyu Han, Changhua Liu +4 more | 2025-06-24 |
| 12255130 | Airgap structures for high speed signal integrity | Jeremy Ecton, Aleksandar Aleksov, Haobo Chen, Xiaoying Guo, Brandon C. Marin +4 more | 2025-03-18 |
| 12230563 | Method to enable 30 microns pitch EMIB or below | Dingying Xu, Sheng Li, Matthew Tingey, Meizi Jiao, Chung Kwang Christopher Tan | 2025-02-18 |
| 12033930 | Selectively roughened copper architectures for low insertion loss conductive features | Jieying Kong, Yiyang Zhou, Suddhasattwa Nad, Jeremy Ecton, Tarek A. Ibrahim +9 more | 2024-07-09 |
| 11955448 | Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches | Jung Kyu Han, Xiaoying Guo, Rahul N. Manepalli | 2024-04-09 |
| 11948898 | Etch barrier for microelectronic packaging conductive structures | Kristof Darmawikarta, Srinivas V. Pietambaram, Xiaoying Guo, Benjamin Duong | 2024-04-02 |
| 11923312 | Patternable die attach materials and processes for patterning | Bai Nie, Gang Duan, Srinivas V. Pietambaram, Jesse C. Jones, Yosuke Kanaoka +10 more | 2024-03-05 |
| 11676891 | Method to enable 30 microns pitch EMIB or below | Dingying Xu, Sheng Li, Matthew Tingey, Meizi Jiao, Chung Kwang Christopher Tan | 2023-06-13 |
| 11640934 | Lithographically defined vertical interconnect access (VIA) in dielectric pockets in a package substrate | Meizi Jiao, Chong Zhang, Kevin Thomas McCarthy | 2023-05-02 |
| 11088062 | Method to enable 30 microns pitch EMIB or below | Dingying Xu, Sheng Li, Matthew Tingey, Meizi Jiao, Chung Kwang Christopher Tan | 2021-08-10 |