Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362250 | Protruding SN substrate features for epoxy flow control | Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Rahul Jain +5 more | 2025-07-15 |
| 12354992 | First layer interconnect first on carrier approach for EMIB patch | Changhua Liu, Xiaoying Guo, Aleksandar Aleksov, Leonel Arana, Robert Alan May +1 more | 2025-07-08 |
| 12341117 | Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates | Kyle McElhinny, Hongxia Feng, Xiaoying Guo, Jung Kyu Han, Changhua Liu +4 more | 2025-06-24 |
| 12334422 | Methods and apparatus to reduce defects in interconnects between semicondcutor dies and package substrates | Kyle McElhinny, Onur Ozkan, Ali Lehaf, Xiaoying Guo, Leonel Arana +4 more | 2025-06-17 |
| 12334453 | Soldered metallic reservoirs for enhanced transient and steady-state thermal performance | Nicholas Neal, Nicholas S. Haehn, Sergio Antonio Chan Arguedas, Edvin Cetegen, Jacob VEHONSKY +4 more | 2025-06-17 |
| 12068172 | Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB packages | Tarek A. Ibrahim, Rahul N. Manepalli, Wei-Lun Kane Jen, Jason M. Gamba, Javier Soto Gonzalez | 2024-08-20 |
| 12009271 | Protruding SN substrate features for epoxy flow control | Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Rahul Jain +5 more | 2024-06-11 |
| 11935857 | Surface finishes with low RBTV for fine and mixed bump pitch architectures | Kristof Darmawaikarta, Robert Alan May, Sashi S. Kandanur, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram +7 more | 2024-03-19 |
| 11776864 | Corner guard for improved electroplated first level interconnect bump height range | Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Rahul Jain, Tarek A. Ibrahim +4 more | 2023-10-03 |
| 11735558 | Microelectronic structures including bridges | Omkar G. Karhade, Nitin A. Deshpande, Mohit Bhatia, Anurag Tripathi, Takeshi Nakazawa | 2023-08-22 |
| 11699648 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Thomas HEATON, Hiroki Tanaka +3 more | 2023-07-11 |
| 11488918 | Surface finishes with low rBTV for fine and mixed bump pitch architectures | Kristof Darmawaikarta, Robert Alan May, Sashi S. Kandanur, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram +7 more | 2022-11-01 |
| 11373972 | Microelectronic structures including bridges | Omkar G. Karhade, Nitin A. Deshpande, Mohit Bhatia, Anurag Tripathi, Takeshi Nakazawa | 2022-06-28 |
| 11309239 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Thomas HEATON, Hiroki Tanaka +3 more | 2022-04-19 |
| 11088103 | First layer interconnect first on carrier approach for EMIB patch | Changhua Liu, Xiaoying Guo, Aleksandar Aleksov, Leonel Arana, Robert Alan May +1 more | 2021-08-10 |
| 10854541 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Thomas HEATON, Hiroki Tanaka +3 more | 2020-12-01 |
| 10431537 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Thomas HEATON, Hiroki Tanaka +3 more | 2019-10-01 |
| 10297563 | Copper seed layer and nickel-tin microbump structures | Rahul Jain, Kyu Oh Lee, Amanda E. Schuckman | 2019-05-21 |