| 12456705 |
First layer interconnect first on carrier approach for EMIB patch |
Changhua Liu, Xia Guo, Aleksandar Aleksov, Leonel Arana, Robert A. May +1 more |
2025-10-28 |
|
| 12362250 |
Protruding SN substrate features for epoxy flow control |
Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Rahul Jain +5 more |
2025-07-15 |
|
| 12354992 |
First layer interconnect first on carrier approach for EMIB patch |
Changhua Liu, Xiaoying Guo, Aleksandar Aleksov, Leonel Arana, Robert Alan May +1 more |
2025-07-08 |
|
| 12341117 |
Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates |
Kyle McElhinny, Hongxia Feng, Xiaoying Guo, Jung Kyu Han, Changhua Liu +4 more |
2025-06-24 |
|
| 12334422 |
Methods and apparatus to reduce defects in interconnects between semicondcutor dies and package substrates |
Kyle McElhinny, Onur Ozkan, Ali Lehaf, Xiaoying Guo, Leonel Arana +4 more |
2025-06-17 |
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| 12334453 |
Soldered metallic reservoirs for enhanced transient and steady-state thermal performance |
Nicholas Neal, Nicholas S. Haehn, Sergio Antonio Chan Arguedas, Edvin Cetegen, Jacob VEHONSKY +4 more |
2025-06-17 |
|
| 12068172 |
Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB packages |
Tarek A. Ibrahim, Rahul N. Manepalli, Wei-Lun Kane Jen, Jason M. Gamba, Javier Soto Gonzalez |
2024-08-20 |
$20,163,000 |
| 12009271 |
Protruding SN substrate features for epoxy flow control |
Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Rahul Jain +5 more |
2024-06-11 |
$21,221,000 |
| 11935857 |
Surface finishes with low RBTV for fine and mixed bump pitch architectures |
Kristof Darmawaikarta, Robert Alan May, Sashi S. Kandanur, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram +7 more |
2024-03-19 |
$28,784,000 |
| 11776864 |
Corner guard for improved electroplated first level interconnect bump height range |
Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Rahul Jain, Tarek A. Ibrahim +4 more |
2023-10-03 |
$24,984,000 |
| 11735558 |
Microelectronic structures including bridges |
Omkar G. Karhade, Nitin A. Deshpande, Mohit Bhatia, Anurag Tripathi, Takeshi Nakazawa |
2023-08-22 |
$16,803,000 |
| 11699648 |
Electromigration resistant and profile consistent contact arrays |
Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Thomas HEATON, Hiroki Tanaka +3 more |
2023-07-11 |
|
| 11488918 |
Surface finishes with low rBTV for fine and mixed bump pitch architectures |
Kristof Darmawaikarta, Robert Alan May, Sashi S. Kandanur, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram +7 more |
2022-11-01 |
$18,130,000 |
| 11373972 |
Microelectronic structures including bridges |
Omkar G. Karhade, Nitin A. Deshpande, Mohit Bhatia, Anurag Tripathi, Takeshi Nakazawa |
2022-06-28 |
$15,065,000 |
| 11309239 |
Electromigration resistant and profile consistent contact arrays |
Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Thomas HEATON, Hiroki Tanaka +3 more |
2022-04-19 |
$22,207,000 |
| 11088103 |
First layer interconnect first on carrier approach for EMIB patch |
Changhua Liu, Xiaoying Guo, Aleksandar Aleksov, Leonel Arana, Robert Alan May +1 more |
2021-08-10 |
$36,027,000 |
| 10854541 |
Electromigration resistant and profile consistent contact arrays |
Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Thomas HEATON, Hiroki Tanaka +3 more |
2020-12-01 |
$25,476,000 |
| 10431537 |
Electromigration resistant and profile consistent contact arrays |
Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Thomas HEATON, Hiroki Tanaka +3 more |
2019-10-01 |
$22,201,000 |
| 10297563 |
Copper seed layer and nickel-tin microbump structures |
Rahul Jain, Kyu Oh Lee, Amanda E. Schuckman |
2019-05-21 |
$20,944,000 |
