| 12362250 |
Protruding SN substrate features for epoxy flow control |
Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho, Rahul Jain +5 more |
2025-07-15 |
|
| 12334453 |
Soldered metallic reservoirs for enhanced transient and steady-state thermal performance |
Nicholas Neal, Nicholas S. Haehn, Sergio Antonio Chan Arguedas, Jacob VEHONSKY, Steve Cho +4 more |
2025-06-17 |
|
| 12261150 |
Mold shelf package design and process flow for advanced package architectures |
Wei Li, Nicholas S. Haehn, Ram Viswanath, Nicholas Neal, Mitul Modi |
2025-03-25 |
|
| 12176268 |
Open cavity bridge co-planar placement architectures and processes |
Omkar G. Karhade, Digvijay A. Raorane, Sairam Agraharam, Nitin A. Deshpande, Mitul Modi +1 more |
2024-12-24 |
$17,261,000 |
| 12087731 |
No mold shelf package design and process flow for advanced package architectures |
Wei Li, Nicholas S. Haehn, Ram Viswanath, Nicholas Neal, Mitul Modi |
2024-09-10 |
$16,964,000 |
| 12068222 |
Dummy die structures of a packaged integrated circuit device |
Mitul Modi, Joseph Van Nausdle, Omkar G. Karhade, Nicholas S. Haehn, Vaibhav Agrawal +4 more |
2024-08-20 |
$20,163,000 |
| 12009271 |
Protruding SN substrate features for epoxy flow control |
Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho, Rahul Jain +5 more |
2024-06-11 |
$21,221,000 |
| 12002727 |
Barrier structures for underfill containment |
Ziyin Lin, Vipul V. Mehta, Wei Li, Xavier Francois Brun, Yang Guo +6 more |
2024-06-04 |
$24,500,000 |
| 11942393 |
Substrate with thermal insulation |
Wei Li, Nicholas S. Haehn, Mitul Modi, Nicholas Neal |
2024-03-26 |
$33,708,000 |
| 11935861 |
Underfill flow management in electronic assemblies |
Frederick Atadana, Taylor Gaines, Wei Li, Hsin-Yu Li, Tony Dambrauskas |
2024-03-19 |
$28,784,000 |
| 11901333 |
No mold shelf package design and process flow for advanced package architectures |
Wei Li, Nicholas S. Haehn, Ram Viswanath, Nicholas Neal, Mitul Modi |
2024-02-13 |
$18,546,000 |
| 11887962 |
Microelectronic structures including bridges |
Omkar G. Karhade, Nitin A. Deshpande, Mohit Bhatia, Sairam Agraharam, Anurag Tripathi +6 more |
2024-01-30 |
$30,721,000 |
| 11854945 |
Underfill material flow control for reduced die-to-die spacing in semiconductor packages |
Omkar G. Karhade, Nitin A. Deshpande, Rajendra C. Dias, Lars D. Skoglund |
2023-12-26 |
|
| 11832419 |
Full package vapor chamber with IHS |
Nicholas Neal, Nicholas S. Haehn, Je-Young Chang, Kyle Arrington, Aaron McCann +4 more |
2023-11-28 |
$31,872,000 |
| 11791274 |
Multichip semiconductor package including a bridge die disposed in a cavity having non-planar interconnects |
Manish Dubey, Omkar G. Karhade, Nitin A. Deshpande, Jinhe Liu, Sairam Agraharam +1 more |
2023-10-17 |
$15,641,000 |
| 11776821 |
Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap |
Ziyin Lin, Vipul V. Mehta, Yuying Wei, Sushrutha Gujjula, Nisha Ananthakrishnan +1 more |
2023-10-03 |
$24,984,000 |
| 11776864 |
Corner guard for improved electroplated first level interconnect bump height range |
Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho, Rahul Jain +4 more |
2023-10-03 |
$24,984,000 |
| 11769753 |
Thermally-optimized tunable stack in cavity package-on-package |
George Vakanas, Aastha Uppal, Shereen ELHALAWATY, Aaron McCann, Tannaz Harirchian +1 more |
2023-09-26 |
$20,953,000 |
| 11735495 |
Active package cooling structures using molded substrate packaging technology |
Omkar G. Karhade, Mitul Modi, Aastha Uppal |
2023-08-22 |
$16,803,000 |
| 11646274 |
Multi-package assemblies having foam structures for warpage control |
Mufei Yu, Gang Duan, Baris Bicen, Rahul N. Manepalli |
2023-05-09 |
$19,706,000 |
| 11574851 |
Coupled cooling fins in ultra-small systems |
Aastha Uppal, Omkar G. Karhade, Ram Viswanath, Je-Young Chang, Weihua Tang +6 more |
2023-02-07 |
$11,877,000 |
| 11551994 |
Liquid metal TIM with STIM-like performance with no BSM and BGA compatible |
Kelly Lofgreen, Chia-Pin Chiu, Joseph Petrini, Betsegaw K. Gebrehiwot, Feras Eid |
2023-01-10 |
$14,061,000 |
| 11545407 |
Thermal management solutions for integrated circuit packages |
Kumar Abhishek Singh, Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Aastha Uppal +8 more |
2023-01-03 |
$15,575,000 |
| 11502008 |
Dual strip backside metallization for improved alt-FLI plating, KOZ minimization, test enhancement and warpage control |
Nicholas S. Haehn, Shankar Devasenathipathy |
2022-11-15 |
$16,955,000 |
| 11464139 |
Conformable heat sink interface with a high thermal conductivity |
Kelly Lofgreen, Joseph B. Petrini, Todd Coons, Christopher Wade Ackerman, Yang Jiao +2 more |
2022-10-04 |
$13,460,000 |
