Issued Patents All Time
Showing 25 most recent of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362250 | Protruding SN substrate features for epoxy flow control | Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho, Rahul Jain +5 more | 2025-07-15 |
| 12334453 | Soldered metallic reservoirs for enhanced transient and steady-state thermal performance | Nicholas Neal, Nicholas S. Haehn, Sergio Antonio Chan Arguedas, Jacob VEHONSKY, Steve Cho +4 more | 2025-06-17 |
| 12261150 | Mold shelf package design and process flow for advanced package architectures | Wei Li, Nicholas S. Haehn, Ram Viswanath, Nicholas Neal, Mitul Modi | 2025-03-25 |
| 12176268 | Open cavity bridge co-planar placement architectures and processes | Omkar G. Karhade, Digvijay A. Raorane, Sairam Agraharam, Nitin A. Deshpande, Mitul Modi +1 more | 2024-12-24 |
| 12087731 | No mold shelf package design and process flow for advanced package architectures | Wei Li, Nicholas S. Haehn, Ram Viswanath, Nicholas Neal, Mitul Modi | 2024-09-10 |
| 12068222 | Dummy die structures of a packaged integrated circuit device | Mitul Modi, Joseph Van Nausdle, Omkar G. Karhade, Nicholas S. Haehn, Vaibhav Agrawal +4 more | 2024-08-20 |
| 12009271 | Protruding SN substrate features for epoxy flow control | Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho, Rahul Jain +5 more | 2024-06-11 |
| 12002727 | Barrier structures for underfill containment | Ziyin Lin, Vipul V. Mehta, Wei Li, Xavier Francois Brun, Yang Guo +6 more | 2024-06-04 |
| 11942393 | Substrate with thermal insulation | Wei Li, Nicholas S. Haehn, Mitul Modi, Nicholas Neal | 2024-03-26 |
| 11935861 | Underfill flow management in electronic assemblies | Frederick Atadana, Taylor Gaines, Wei Li, Hsin-Yu Li, Tony Dambrauskas | 2024-03-19 |
| 11901333 | No mold shelf package design and process flow for advanced package architectures | Wei Li, Nicholas S. Haehn, Ram Viswanath, Nicholas Neal, Mitul Modi | 2024-02-13 |
| 11887962 | Microelectronic structures including bridges | Omkar G. Karhade, Nitin A. Deshpande, Mohit Bhatia, Sairam Agraharam, Anurag Tripathi +6 more | 2024-01-30 |
| 11854945 | Underfill material flow control for reduced die-to-die spacing in semiconductor packages | Omkar G. Karhade, Nitin A. Deshpande, Rajendra C. Dias, Lars D. Skoglund | 2023-12-26 |
| 11832419 | Full package vapor chamber with IHS | Nicholas Neal, Nicholas S. Haehn, Je-Young Chang, Kyle Arrington, Aaron McCann +4 more | 2023-11-28 |
| 11791274 | Multichip semiconductor package including a bridge die disposed in a cavity having non-planar interconnects | Manish Dubey, Omkar G. Karhade, Nitin A. Deshpande, Jinhe Liu, Sairam Agraharam +1 more | 2023-10-17 |
| 11776821 | Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap | Ziyin Lin, Vipul V. Mehta, Yuying Wei, Sushrutha Gujjula, Nisha Ananthakrishnan +1 more | 2023-10-03 |
| 11776864 | Corner guard for improved electroplated first level interconnect bump height range | Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho, Rahul Jain +4 more | 2023-10-03 |
| 11769753 | Thermally-optimized tunable stack in cavity package-on-package | George Vakanas, Aastha Uppal, Shereen ELHALAWATY, Aaron McCann, Tannaz Harirchian +1 more | 2023-09-26 |
| 11735495 | Active package cooling structures using molded substrate packaging technology | Omkar G. Karhade, Mitul Modi, Aastha Uppal | 2023-08-22 |
| 11646274 | Multi-package assemblies having foam structures for warpage control | Mufei Yu, Gang Duan, Baris Bicen, Rahul N. Manepalli | 2023-05-09 |
| 11574851 | Coupled cooling fins in ultra-small systems | Aastha Uppal, Omkar G. Karhade, Ram Viswanath, Je-Young Chang, Weihua Tang +6 more | 2023-02-07 |
| 11551994 | Liquid metal TIM with STIM-like performance with no BSM and BGA compatible | Kelly Lofgreen, Chia-Pin Chiu, Joseph Petrini, Betsegaw K. Gebrehiwot, Feras Eid | 2023-01-10 |
| 11545407 | Thermal management solutions for integrated circuit packages | Kumar Abhishek Singh, Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Aastha Uppal +8 more | 2023-01-03 |
| 11502008 | Dual strip backside metallization for improved alt-FLI plating, KOZ minimization, test enhancement and warpage control | Nicholas S. Haehn, Shankar Devasenathipathy | 2022-11-15 |
| 11464139 | Conformable heat sink interface with a high thermal conductivity | Kelly Lofgreen, Joseph B. Petrini, Todd Coons, Christopher Wade Ackerman, Yang Jiao +2 more | 2022-10-04 |