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Integrated circuit package lids with polymer features |
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| 11935861 |
Underfill flow management in electronic assemblies |
Frederick Atadana, Edvin Cetegen, Wei Li, Hsin-Yu Li, Tony Dambrauskas |
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| 11881440 |
Carbon based polymer thermal interface materials with polymer chain to carbon based fill particle bonds |
Marely E. Tejeda Ferrari, Elah Bozorg-Grayeli, James C. Matayabas, Jr. |
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| 11842944 |
IC assemblies including die perimeter frames suitable for containing thermal interface materials |
Kyle Arrington, Frederick Atadana, Minseok Ha |
2023-12-12 |
| 11710677 |
Ultraviolet (UV)-curable sealant in a microelectronic package |
Ken Hackenberg, Elah Bozorg-Grayeli |
2023-07-25 |
| 11710672 |
Microelectronic package with underfilled sealant |
Ken Hackenberg, Frederick Atadana, Elah Bozorg-Grayeli |
2023-07-25 |
| 11676876 |
Semiconductor die package with warpage management and process for forming such |
Ziyin Lin, Elizabeth Nofen, Vipul V. Mehta |
2023-06-13 |
| 11370887 |
Aliphatic polysulfones with improved mechanical integrity |
Kenneth B. Wagener, Michael H. Bell, Julia Grace Pribyl |
2022-06-28 |
| 11001673 |
Aliphatic polysulfones with improved mechanical integrity |
Kenneth B. Wagener, Michael H. Bell, Julia Grace Pribyl |
2021-05-11 |
| 10894864 |
Aliphatic polysulfones with improved mechanical integrity |
Kenneth B. Wagener, Michael H. Bell |
2021-01-19 |
| 9724686 |
Sulfonated polyethylene |
Kenneth B. Wagener |
2017-08-08 |
