Patents per Year
Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11935799 | Integrated circuit package lids with polymer features | Elah Bozorg-Grayeli, Taylor Gaines, Sergio Antonio Chan Arguedas, Robert F. Cheney | 2024-03-19 | $28,784,000 |
| 11935861 | Underfill flow management in electronic assemblies | Taylor Gaines, Edvin Cetegen, Wei Li, Hsin-Yu Li, Tony Dambrauskas | 2024-03-19 | $28,784,000 |
| 11842944 | IC assemblies including die perimeter frames suitable for containing thermal interface materials | Kyle Arrington, Taylor Gaines, Minseok Ha | 2023-12-12 | $45,136,000 |
| 11710672 | Microelectronic package with underfilled sealant | Taylor Gaines, Ken Hackenberg, Elah Bozorg-Grayeli | 2023-07-25 | $28,608,000 |
| 10258955 | Microscale-based chemical reactor | Goran Jovanovic | 2019-04-16 |