Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417958 | Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone | Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more | 2025-09-16 |
| 12347743 | Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone | Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more | 2025-07-01 |
| 12315777 | Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone | Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more | 2025-05-27 |
| 11935861 | Underfill flow management in electronic assemblies | Frederick Atadana, Taylor Gaines, Edvin Cetegen, Wei Li, Tony Dambrauskas | 2024-03-19 |
| 9431274 | Method for reducing underfill filler settling in integrated circuit packages | Suriyakala Ramalingam, Manish Dubey, Michelle S. Phen, Hitesh Arora, Nisha Ananthakrishnan +3 more | 2016-08-30 |
| 9122677 | System and method for product identification | Brett Bracewell Bonner, Cameron Dee Dryden, Andris Jankevics, Justin E. Kolterman, Torsten Platz +2 more | 2015-09-01 |
| 8469261 | System and method for product identification | Brett Bracewell Bonner, Cameron Dee Dryden, Andris Jankevics, Justin E. Kolterman, Torsten Platz +2 more | 2013-06-25 |
| 5438439 | Non-destructive readout mechanism for volume holograms using two wavelengths | Fai Mok, Demetri Psaltis | 1995-08-01 |