Shripad Gokhale — 9 Patents at Intel

Shripad Gokhale has been granted 9 US patents while listed as an inventor at Intel. The first was granted in 2010 and the most recent in September 2025. Shripad Gokhale ranks #535,341 of 4,157,543 US inventors in our database (top 12.9%). Patent records list Shripad Gokhale in Gilbert, AZ, US.

Patents per Year

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Showing 1–9 of 9 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12417958	Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone	Elizabeth Nofen, Nick Ross, Amram Eitan, Nisha Ananthakrishnan, Robert M. Nickerson +4 more	2025-09-16
12394773	Laser ablation-based surface property modification and contamination removal	Denis Myasishchev, Andrew V. Mazur, Purushotham Kaushik Muthur Srinath, Robert M. Nickerson	2025-08-19
12362340	Laser ablation-based surface property modification and contamination removal	Denis Myasishchev, Andrew V. Mazur, Purushotham Kaushik Muthur Srinath, Robert M. Nickerson	2025-07-15
12347743	Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone	Elizabeth Nofen, Nick Ross, Amram Eitan, Nisha Ananthakrishnan, Robert M. Nickerson +4 more	2025-07-01
12315777	Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone	Elizabeth Nofen, Nick Ross, Amram Eitan, Nisha Ananthakrishnan, Robert M. Nickerson +4 more	2025-05-27
9508610	Inline measurement of molding material thickness using terahertz reflectance	Shuhong Liu, Nilanjan Ghosh, Zhiyong Wang, Deepak Goyal, Jieping Zhang	2016-11-29	$9,403,000
8362627	Reducing underfill keep out zone on substrate used in electronic device processing	Kathy Wei Yan, Bijay S. Saha, Samir Pandey, Ngoc K. Dang, Munehiro Toyama	2013-01-29	$10,118,000
7875503	Reducing underfill keep out zone on substrate used in electronic device processing	Kathy Wei Yan, Bijay S. Saha, Samir Pandey, Ngoc K. Dang, Munehiro Toyama	2011-01-25	$27,856,000
7687890	Controlling substrate surface properties via colloidal coatings	Gopalakrishnan Subramanian, Nirupama Chakrapani, Larry DeCesare, Jason Murphy, Jinlin Wang	2010-03-30	$14,203,000

Shripad Gokhale — 9 Patents

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