Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417958 | Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone | Elizabeth Nofen, Nick Ross, Amram Eitan, Nisha Ananthakrishnan, Robert M. Nickerson +4 more | 2025-09-16 |
| 12394773 | Laser ablation-based surface property modification and contamination removal | Denis Myasishchev, Andrew V. Mazur, Purushotham Kaushik Muthur Srinath, Robert M. Nickerson | 2025-08-19 |
| 12362340 | Laser ablation-based surface property modification and contamination removal | Denis Myasishchev, Andrew V. Mazur, Purushotham Kaushik Muthur Srinath, Robert M. Nickerson | 2025-07-15 |
| 12347743 | Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone | Elizabeth Nofen, Nick Ross, Amram Eitan, Nisha Ananthakrishnan, Robert M. Nickerson +4 more | 2025-07-01 |
| 12315777 | Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone | Elizabeth Nofen, Nick Ross, Amram Eitan, Nisha Ananthakrishnan, Robert M. Nickerson +4 more | 2025-05-27 |
| 9508610 | Inline measurement of molding material thickness using terahertz reflectance | Shuhong Liu, Nilanjan Ghosh, Zhiyong Wang, Deepak Goyal, Jieping Zhang | 2016-11-29 |
| 8362627 | Reducing underfill keep out zone on substrate used in electronic device processing | Kathy Wei Yan, Bijay S. Saha, Samir Pandey, Ngoc K. Dang, Munehiro Toyama | 2013-01-29 |
| 7875503 | Reducing underfill keep out zone on substrate used in electronic device processing | Kathy Wei Yan, Bijay S. Saha, Samir Pandey, Ngoc K. Dang, Munehiro Toyama | 2011-01-25 |
| 7687890 | Controlling substrate surface properties via colloidal coatings | Gopalakrishnan Subramanian, Nirupama Chakrapani, Larry DeCesare, Jason Murphy, Jinlin Wang | 2010-03-30 |