Patents per Year
Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12362258 | Thermal module for a semiconductor package and methods of forming the same | Po-Yao Lin, Sheng-Liang Kuo, Yu-Sheng Lin | 2025-07-15 | |
| 8362627 | Reducing underfill keep out zone on substrate used in electronic device processing | Shripad Gokhale, Bijay S. Saha, Samir Pandey, Ngoc K. Dang, Munehiro Toyama | 2013-01-29 | $10,118,000 |
| 7875503 | Reducing underfill keep out zone on substrate used in electronic device processing | Shripad Gokhale, Bijay S. Saha, Samir Pandey, Ngoc K. Dang, Munehiro Toyama | 2011-01-25 | $27,856,000 |