Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362258 | Thermal module for a semiconductor package and methods of forming the same | Po-Yao Lin, Sheng-Liang Kuo, Yu-Sheng Lin | 2025-07-15 |
| 8362627 | Reducing underfill keep out zone on substrate used in electronic device processing | Shripad Gokhale, Bijay S. Saha, Samir Pandey, Ngoc K. Dang, Munehiro Toyama | 2013-01-29 |
| 7875503 | Reducing underfill keep out zone on substrate used in electronic device processing | Shripad Gokhale, Bijay S. Saha, Samir Pandey, Ngoc K. Dang, Munehiro Toyama | 2011-01-25 |