Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362258 | Thermal module for a semiconductor package and methods of forming the same | Po-Yao Lin, Yu-Sheng Lin, Kathy Wei Yan | 2025-07-15 |
| 12300573 | Semiconductor device and manufacturing method thereof | Bo-Jiun Yang, Wen-Sung Hsu, Tai-Yu Chen, Chia-Hao Hsu | 2025-05-13 |
| 12087664 | Semiconductor package having liquid-cooling lid | Chia-Hao Hsu, Tai-Yu Chen, Bo-Jiun Yang | 2024-09-10 |
| 11728232 | Semiconductor package having a stiffener ring | Chi-Wen Pan, I-Hsuan Peng, Yi-Jou Lin, Tai-Yu Chen | 2023-08-15 |
| 11640930 | Semiconductor package having liquid-cooling lid | Chia-Hao Hsu, Tai-Yu Chen, Bo-Jiun Yang | 2023-05-02 |
| 11302592 | Semiconductor package having a stiffener ring | Chi-Wen Pan, I-Hsuan Peng, Yi-Jou Lin, Tai-Yu Chen | 2022-04-12 |
| 10942067 | Method and apparatus for surface and ambient temperature estimation for portable devices | Chi-Wen Pan, Pei-Yu Huang, Jih-Ming Hsu, Tai-Yu Chen, Yun-Ching Li +1 more | 2021-03-09 |
| 10739206 | Method and apparatus for surface and ambient temperature estimation for portable devices | Chi-Wen Pan, Pei-Yu Huang, Jih-Ming Hsu, Tai-Yu Chen, Yun-Ching Li +1 more | 2020-08-11 |
| 10573579 | Semiconductor package with improved heat dissipation | Tai-Yu Chen, Wen-Sung Hsu, Chi-Wen Pan, Jen-Chuan Chen | 2020-02-25 |