Issued Patents All Time
Showing 25 most recent of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388026 | Electronic package with rotated semiconductor die | Yao-Chun Su, Chih-Jung Hsu, Yi-Jou Lin | 2025-08-12 |
| 12183723 | Semiconductor package with dummy MIM capacitor die | Yao-Chun Su, Chih-Ching Chen, Yi-Jou Lin | 2024-12-31 |
| 12142598 | Semiconductor package structure having an annular frame with truncated corners | Chia-Cheng Chang, Tzu-Hung Lin, Yi-Jou Lin | 2024-11-12 |
| 12021031 | Semiconductor package structure | Yi-Lin Tsai, Yi-Jou Lin, Wen-Sung Hsu | 2024-06-25 |
| 11948895 | Semiconductor package structure | Tzu-Hung Lin, Chia-Cheng Chang, Nai-Wei Liu | 2024-04-02 |
| 11862578 | Semiconductor package structure | Chia-Cheng Chang, Tzu-Hung Lin, Yi-Jou Lin | 2024-01-02 |
| 11854930 | Semiconductor chip package and fabrication method thereof | Yi-Lin Tsai, Yi-Jou Lin, Wen-Sung Hsu | 2023-12-26 |
| 11830820 | Electronic package with rotated semiconductor die | Yao-Chun Su, Chih-Jung Hsu, Yi-Jou Lin | 2023-11-28 |
| 11830851 | Semiconductor package structure | Yi-Lin Tsai, Wen-Sung Hsu, Yi-Jou Lin | 2023-11-28 |
| 11728292 | Semiconductor package assembly having a conductive electromagnetic shield layer | Tzu-Hung Lin, Nai-Wei Liu, Wei-Che Huang, Che-Ya Chou | 2023-08-15 |
| 11728232 | Semiconductor package having a stiffener ring | Chi-Wen Pan, Sheng-Liang Kuo, Yi-Jou Lin, Tai-Yu Chen | 2023-08-15 |
| 11688655 | Semiconductor package including lid structure with opening and recess | Chia-Cheng Chang, Tzu-Hung Lin, Nai-Wei Liu | 2023-06-27 |
| 11670596 | Semiconductor package structure | Yi-Lin Tsai, Wen-Sung Hsu, Yi-Jou Lin | 2023-06-06 |
| 11646295 | Semiconductor package structure having an annular frame with truncated corners | Chia-Cheng Chang, Tzu-Hung Lin, Yi-Jou Lin | 2023-05-09 |
| 11508707 | Semiconductor package with dummy MIM capacitor die | Yao-Chun Su, Chih-Ching Chen, Yi-Jou Lin | 2022-11-22 |
| 11469152 | Semiconductor chip package and fabrication method thereof | Yi-Lin Tsai, Yi-Jou Lin, Wen-Sung Hsu | 2022-10-11 |
| 11410936 | Semiconductor package structure | Tzu-Hung Lin, Chia-Cheng Chang, Nai-Wei Liu | 2022-08-09 |
| 11302592 | Semiconductor package having a stiffener ring | Chi-Wen Pan, Sheng-Liang Kuo, Yi-Jou Lin, Tai-Yu Chen | 2022-04-12 |
| 11264337 | Semiconductor package structure | Chia-Cheng Chang, Tzu-Hung Lin, Yi-Jou Lin | 2022-03-01 |
| 11222850 | Electronic package with rotated semiconductor die | Yao-Chun Su, Chih-Jung Hsu, Yi-Jou Lin | 2022-01-11 |
| 11171113 | Semiconductor package structure having an annular frame with truncated corners | Chia-Cheng Chang, Tzu-Hung Lin, Yi-Jou Lin | 2021-11-09 |
| 10957611 | Semiconductor package including lid structure with opening and recess | Chia-Cheng Chang, Tzu-Hung Lin, Nai-Wei Liu | 2021-03-23 |
| 10903198 | Semiconductor package assembly and method for forming the same | Chia-Cheng Chang, Tzu-Hung Lin | 2021-01-26 |
| 10784211 | Semiconductor package structure | Tzu-Hung Lin, Chia-Cheng Chang, Nai-Wei Liu | 2020-09-22 |
| 10692789 | Stacked fan-out package structure | Nai-Wei Liu, Tzu-Hung Lin, Ching-Wen Hsiao, Wei-Che Huang | 2020-06-23 |