Issued Patents All Time
Showing 25 most recent of 99 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424531 | Semiconductor package structure | Yuan Liu | 2025-09-23 |
| 12142598 | Semiconductor package structure having an annular frame with truncated corners | Chia-Cheng Chang, I-Hsuan Peng, Yi-Jou Lin | 2024-11-12 |
| 12002742 | Semiconductor package structure | Yuan Liu | 2024-06-04 |
| 11948895 | Semiconductor package structure | Chia-Cheng Chang, I-Hsuan Peng, Nai-Wei Liu | 2024-04-02 |
| 11942439 | Semiconductor package structure | Yung-Chang Lien | 2024-03-26 |
| 11862578 | Semiconductor package structure | Chia-Cheng Chang, I-Hsuan Peng, Yi-Jou Lin | 2024-01-02 |
| 11854784 | Chip scale package structure and method of forming the same | Yen-Yao Chi, Nai-Wei Liu, Ta-Jen Yu, Wen-Sung Hsu, Shih-Chin Lin | 2023-12-26 |
| 11824020 | Semiconductor package structure including antenna | Yen-Yao Chi, Nai-Wei Liu | 2023-11-21 |
| 11791266 | Chip scale package structure and method of forming the same | Yen-Yao Chi, Nai-Wei Liu, Ta-Jen Yu, Wen-Sung Hsu | 2023-10-17 |
| 11742564 | Fan-out package structure with integrated antenna | Nai-Wei Liu, Yen-Yao Chi, Wen-Sung Hsu | 2023-08-29 |
| 11728292 | Semiconductor package assembly having a conductive electromagnetic shield layer | I-Hsuan Peng, Nai-Wei Liu, Wei-Che Huang, Che-Ya Chou | 2023-08-15 |
| 11688655 | Semiconductor package including lid structure with opening and recess | Chia-Cheng Chang, I-Hsuan Peng, Nai-Wei Liu | 2023-06-27 |
| 11652273 | Innovative air gap for antenna fan out package | Nai-Wei Liu, Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Wen-Sung Hsu | 2023-05-16 |
| 11646295 | Semiconductor package structure having an annular frame with truncated corners | Chia-Cheng Chang, I-Hsuan Peng, Yi-Jou Lin | 2023-05-09 |
| 11574881 | Semiconductor package structure with antenna | Nai-Wei Liu, Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Wen-Sung Hsu | 2023-02-07 |
| 11508678 | Semiconductor package structure including antenna | Yen-Yao Chi, Nai-Wei Liu | 2022-11-22 |
| 11469201 | Semiconductor package and method for fabricating base for semiconductor package | Wen-Sung Hsu, Ta-Jen Yu, Andrew C. Chang | 2022-10-11 |
| 11450606 | Chip scale package structure and method of forming the same | Yen-Yao Chi, Nai-Wei Liu, Ta-Jen Yu, Wen-Sung Hsu | 2022-09-20 |
| 11410936 | Semiconductor package structure | Chia-Cheng Chang, I-Hsuan Peng, Nai-Wei Liu | 2022-08-09 |
| 11387176 | Semiconductor package structure | Yuan Liu | 2022-07-12 |
| 11362044 | Semiconductor package structure | Yung-Chang Lien | 2022-06-14 |
| 11348900 | Package structure | Yu-Hua Huang, Wei-Che Huang, Ming-Tzong Yang | 2022-05-31 |
| 11264337 | Semiconductor package structure | Chia-Cheng Chang, I-Hsuan Peng, Yi-Jou Lin | 2022-03-01 |
| 11171113 | Semiconductor package structure having an annular frame with truncated corners | Chia-Cheng Chang, I-Hsuan Peng, Yi-Jou Lin | 2021-11-09 |
| 11121108 | Flip chip package utilizing trace bump trace interconnection | Thomas Matthew Gregorich | 2021-09-14 |