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USPTO Patent Rankings Data through Dec 31, 2025
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Tzu-Hung Lin — 99 Patents

MEMediatek: 93 patents #6 of 2,888Top 1%
NTNational Taipei University Of Technology: 4 patents #21 of 314Top 7%
MPMediatek Singapore Pte.: 1 patents #350 of 734Top 50%
NUNational Chiao Tung University: 1 patents #506 of 1,517Top 35%
Hsinchu, TW: #134 of 13,380 inventorsTop 2%
Overall (All Time): #14,805 of 4,157,543Top 1%
99 Patents All Time
Tzu-Hung Lin has been granted 99 US patents while listed as an inventor at Mediatek. The first was granted in 2013 and the most recent in September 2025. Tzu-Hung Lin ranks #14,805 of 4,157,543 US inventors in our database (top 0.36%). Patent records list Tzu-Hung Lin in Hsinchu, TW.

Issued Patents All Time

Showing 1–25 of 99 patents

Patent #TitleCo-InventorsDate
12424531 Semiconductor package structure Yuan Liu 2025-09-23
12142598 Semiconductor package structure having an annular frame with truncated corners Chia-Cheng Chang, I-Hsuan Peng, Yi-Jou Lin 2024-11-12
12002742 Semiconductor package structure Yuan Liu 2024-06-04
11948895 Semiconductor package structure Chia-Cheng Chang, I-Hsuan Peng, Nai-Wei Liu 2024-04-02
11942439 Semiconductor package structure Yung-Chang Lien 2024-03-26
11862578 Semiconductor package structure Chia-Cheng Chang, I-Hsuan Peng, Yi-Jou Lin 2024-01-02
11854784 Chip scale package structure and method of forming the same Yen-Yao Chi, Nai-Wei Liu, Ta-Jen Yu, Wen-Sung Hsu, Shih-Chin Lin 2023-12-26
11824020 Semiconductor package structure including antenna Yen-Yao Chi, Nai-Wei Liu 2023-11-21
11791266 Chip scale package structure and method of forming the same Yen-Yao Chi, Nai-Wei Liu, Ta-Jen Yu, Wen-Sung Hsu 2023-10-17
11742564 Fan-out package structure with integrated antenna Nai-Wei Liu, Yen-Yao Chi, Wen-Sung Hsu 2023-08-29
11728292 Semiconductor package assembly having a conductive electromagnetic shield layer I-Hsuan Peng, Nai-Wei Liu, Wei-Che Huang, Che-Ya Chou 2023-08-15
11688655 Semiconductor package including lid structure with opening and recess Chia-Cheng Chang, I-Hsuan Peng, Nai-Wei Liu 2023-06-27
11652273 Innovative air gap for antenna fan out package Nai-Wei Liu, Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Wen-Sung Hsu 2023-05-16
11646295 Semiconductor package structure having an annular frame with truncated corners Chia-Cheng Chang, I-Hsuan Peng, Yi-Jou Lin 2023-05-09
11574881 Semiconductor package structure with antenna Nai-Wei Liu, Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Wen-Sung Hsu 2023-02-07
11508678 Semiconductor package structure including antenna Yen-Yao Chi, Nai-Wei Liu 2022-11-22
11469201 Semiconductor package and method for fabricating base for semiconductor package Wen-Sung Hsu, Ta-Jen Yu, Andrew C. Chang 2022-10-11
11450606 Chip scale package structure and method of forming the same Yen-Yao Chi, Nai-Wei Liu, Ta-Jen Yu, Wen-Sung Hsu 2022-09-20
11410936 Semiconductor package structure Chia-Cheng Chang, I-Hsuan Peng, Nai-Wei Liu 2022-08-09
11387176 Semiconductor package structure Yuan Liu 2022-07-12
11362044 Semiconductor package structure Yung-Chang Lien 2022-06-14
11348900 Package structure Yu-Hua Huang, Wei-Che Huang, Ming-Tzong Yang 2022-05-31
11264337 Semiconductor package structure Chia-Cheng Chang, I-Hsuan Peng, Yi-Jou Lin 2022-03-01
11171113 Semiconductor package structure having an annular frame with truncated corners Chia-Cheng Chang, I-Hsuan Peng, Yi-Jou Lin 2021-11-09
11121108 Flip chip package utilizing trace bump trace interconnection Thomas Matthew Gregorich 2021-09-14

Nearby-Ranked Inventors

Alphan Sahin99
Kwang Jae Lim99
Wolfgang Schmidt99
Huan Tan99
Josef Haupt99
Mohamed Mahmoud99
John T. Uken99
Hirotaka Mori99
Tae Il Kim99