Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11908759 | Semiconductor device | Nan-Cheng Chen, Hsing-Chih Liu, Che-Hung Kuo | 2024-02-20 |
| 11837552 | Semiconductor package with layer structures, antenna layer and electronic component | Wen-Sung Hsu, Tao Cheng, Nan-Cheng Chen, Wen-Chou Wu, Yen-Ju Lu +2 more | 2023-12-05 |
| 11728292 | Semiconductor package assembly having a conductive electromagnetic shield layer | Tzu-Hung Lin, I-Hsuan Peng, Nai-Wei Liu, Wei-Che Huang | 2023-08-15 |
| 11721882 | Semiconductor package having discrete antenna device | Fu-Yi Han, Che-Hung Kuo, Wen-Chou Wu, Nan-Cheng Chen, Min-Chen Lin +1 more | 2023-08-08 |
| 11373957 | Semiconductor package with layer structures, antenna layer and electronic component | Wen-Sung Hsu, Tao Cheng, Nan-Cheng Chen, Wen-Chou Wu, Yen-Ju Lu +2 more | 2022-06-28 |
| 11244913 | Semiconductor package | Ying-Chih Chen, Yen-Ju Lu, Hsing-Chih Liu | 2022-02-08 |
| 10991669 | Semiconductor package using flip-chip technology | Wen-Sung Hsu, Nan-Cheng Chen | 2021-04-27 |
| 10847869 | Semiconductor package having discrete antenna device | Fu-Yi Han, Che-Hung Kuo, Wen-Chou Wu, Nan-Cheng Chen, Min-Chen Lin +1 more | 2020-11-24 |
| 10784206 | Semiconductor package | Wen-Sung Hsu, Tao Cheng, Nan-Cheng Chen, Wen-Chou Wu, Yen-Ju Lu +2 more | 2020-09-22 |
| 10636773 | Semiconductor package structure and method for forming the same | Che-Hung Kuo | 2020-04-28 |
| 10515887 | Fan-out package structure having stacked carrier substrates and method for forming the same | Shih-Yi Syu, Chia-Yu Jin, Wen-Sung Hsu, Nan-Cheng Chen | 2019-12-24 |
| 10497678 | Semiconductor package assembly with passive device | Che-Hung Kuo, Ying-Chih Chen | 2019-12-03 |
| 10468341 | Semiconductor package assembly | Nai-Wei Liu, Tzu-Hung Lin, I-Hsuan Peng, Che-Hung Kuo, Wei-Che Huang | 2019-11-05 |
| 10224287 | Semiconductor device and wafer level package including such semiconductor device | Shih-Yi Syu, Tung-Hsien Hsieh | 2019-03-05 |
| 10199318 | Semiconductor package assembly | Nai-Wei Liu, Tzu-Hung Lin, I-Hsuan Peng, Che-Hung Kuo, Wei-Che Huang | 2019-02-05 |
| 10147674 | Semiconductor package assembly | Tung-Hsien Hsieh | 2018-12-04 |
| 10128192 | Fan-out package structure | Min-Chen Lin, Nan-Cheng Chen | 2018-11-13 |
| 10103128 | Semiconductor package incorporating redistribution layer interposer | Kun-Ting Hung, Chia-Hao Yang, Nan-Cheng Chen | 2018-10-16 |
| 10074628 | System-in-package and fabrication method thereof | Hsing-Chih Liu | 2018-09-11 |
| 9818727 | Semiconductor package assembly with passive device | Che-Hung Kuo, Ying-Chih Chen | 2017-11-14 |
| 9704792 | Semiconductor package assembly | Tung-Hsien Hsieh | 2017-07-11 |
| 9704808 | Semiconductor device and wafer level package including such semiconductor device | Shih-Yi Syu, Tung-Hsien Hsieh | 2017-07-11 |
| 9437534 | Enhanced flip chip structure using copper column interconnect | Thomas Matthew Gregorich, Tzu-Hung Lin | 2016-09-06 |
| 9165877 | Fan-out semiconductor package with copper pillar bumps | Nan-Cheng Chen | 2015-10-20 |
| 9064757 | Enhanced flip chip structure using copper column interconnect | Thomas Matthew Gregorich, Tzu-Hung Lin | 2015-06-23 |