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Semiconductor device |
Nan-Cheng Chen, Hsing-Chih Liu, Che-Hung Kuo |
2024-02-20 |
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Semiconductor package with layer structures, antenna layer and electronic component |
Wen-Sung Hsu, Tao Cheng, Nan-Cheng Chen, Wen-Chou Wu, Yen-Ju Lu +2 more |
2023-12-05 |
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Semiconductor package assembly having a conductive electromagnetic shield layer |
Tzu-Hung Lin, I-Hsuan Peng, Nai-Wei Liu, Wei-Che Huang |
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Semiconductor package having discrete antenna device |
Fu-Yi Han, Che-Hung Kuo, Wen-Chou Wu, Nan-Cheng Chen, Min-Chen Lin +1 more |
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Semiconductor package with layer structures, antenna layer and electronic component |
Wen-Sung Hsu, Tao Cheng, Nan-Cheng Chen, Wen-Chou Wu, Yen-Ju Lu +2 more |
2022-06-28 |
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Semiconductor package |
Ying-Chih Chen, Yen-Ju Lu, Hsing-Chih Liu |
2022-02-08 |
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Semiconductor package using flip-chip technology |
Wen-Sung Hsu, Nan-Cheng Chen |
2021-04-27 |
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| 10847869 |
Semiconductor package having discrete antenna device |
Fu-Yi Han, Che-Hung Kuo, Wen-Chou Wu, Nan-Cheng Chen, Min-Chen Lin +1 more |
2020-11-24 |
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Semiconductor package |
Wen-Sung Hsu, Tao Cheng, Nan-Cheng Chen, Wen-Chou Wu, Yen-Ju Lu +2 more |
2020-09-22 |
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Semiconductor package structure and method for forming the same |
Che-Hung Kuo |
2020-04-28 |
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Fan-out package structure having stacked carrier substrates and method for forming the same |
Shih-Yi Syu, Chia-Yu Jin, Wen-Sung Hsu, Nan-Cheng Chen |
2019-12-24 |
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| 10497678 |
Semiconductor package assembly with passive device |
Che-Hung Kuo, Ying-Chih Chen |
2019-12-03 |
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| 10468341 |
Semiconductor package assembly |
Nai-Wei Liu, Tzu-Hung Lin, I-Hsuan Peng, Che-Hung Kuo, Wei-Che Huang |
2019-11-05 |
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Semiconductor device and wafer level package including such semiconductor device |
Shih-Yi Syu, Tung-Hsien Hsieh |
2019-03-05 |
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| 10199318 |
Semiconductor package assembly |
Nai-Wei Liu, Tzu-Hung Lin, I-Hsuan Peng, Che-Hung Kuo, Wei-Che Huang |
2019-02-05 |
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| 10147674 |
Semiconductor package assembly |
Tung-Hsien Hsieh |
2018-12-04 |
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Fan-out package structure |
Min-Chen Lin, Nan-Cheng Chen |
2018-11-13 |
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Semiconductor package incorporating redistribution layer interposer |
Kun-Ting Hung, Chia-Hao Yang, Nan-Cheng Chen |
2018-10-16 |
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System-in-package and fabrication method thereof |
Hsing-Chih Liu |
2018-09-11 |
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Semiconductor package assembly with passive device |
Che-Hung Kuo, Ying-Chih Chen |
2017-11-14 |
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Semiconductor package assembly |
Tung-Hsien Hsieh |
2017-07-11 |
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Semiconductor device and wafer level package including such semiconductor device |
Shih-Yi Syu, Tung-Hsien Hsieh |
2017-07-11 |
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Enhanced flip chip structure using copper column interconnect |
Thomas Matthew Gregorich, Tzu-Hung Lin |
2016-09-06 |
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Fan-out semiconductor package with copper pillar bumps |
Nan-Cheng Chen |
2015-10-20 |
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Enhanced flip chip structure using copper column interconnect |
Thomas Matthew Gregorich, Tzu-Hung Lin |
2015-06-23 |
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