Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848247 | Thermal dissipation through seal rings in 3DIC structure | Jing-Cheng Lin | 2023-12-19 |
| 11037854 | Thermal dissipation through seal rings in 3DIC structure | Jing-Cheng Lin | 2021-06-15 |
| 10535580 | Thermal dissipation through seal rings in 3DIC structure | Jing-Cheng Lin | 2020-01-14 |
| 10515887 | Fan-out package structure having stacked carrier substrates and method for forming the same | Chia-Yu Jin, Che-Ya Chou, Wen-Sung Hsu, Nan-Cheng Chen | 2019-12-24 |
| 10290559 | Thermal dissipation through seal rings in 3DIC structure | Jing-Cheng Lin | 2019-05-14 |
| 10224287 | Semiconductor device and wafer level package including such semiconductor device | Tung-Hsien Hsieh, Che-Ya Chou | 2019-03-05 |
| 9704808 | Semiconductor device and wafer level package including such semiconductor device | Tung-Hsien Hsieh, Che-Ya Chou | 2017-07-11 |
| 9490190 | Thermal dissipation through seal rings in 3DIC structure | Jing-Cheng Lin | 2016-11-08 |
| 8816495 | Structures and formation methods of packages with heat sinks | Chung Yu Wang, Jing-Cheng Lin | 2014-08-26 |
| 8629043 | Methods for de-bonding carriers | Chung Yu Wang, Jui-Pin Hung, Chih-Hao Chen, Chun-Hsing Su, Yi-Chao Mao +7 more | 2014-01-14 |