Issued Patents All Time
Showing 1–25 of 137 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12238865 | Integrated circuit structure | Chen-Hua Yu, Kuo-Chung Yee | 2025-02-25 |
| 12057432 | Integrated fan-out package structures with recesses in molding compound | Po-Hao Tsai, Li-Hui Cheng, Jing-Cheng Lin | 2024-08-06 |
| 11742220 | Integrated passive device package and methods of forming same | Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng | 2023-08-29 |
| 11688728 | Integrated circuit structure and method for reducing polymer layer delamination | Jing-Cheng Lin, Hsien-Wen Liu, Min-Chen Lin | 2023-06-27 |
| 11557546 | Semiconductor structure | Chen-Hua Yu, Kuo-Chung Yee | 2023-01-17 |
| 11532569 | Method for manufacturing semiconductor package structure | Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng, De-Dui Liao | 2022-12-20 |
| 11362046 | Semiconductor package | Jing-Cheng Lin, Chin-Chuan Chang | 2022-06-14 |
| 11335658 | Multi-chip package and method of formation | Jing-Cheng Lin, Chen-Hua Yu, Der-Chyang Yeh | 2022-05-17 |
| 11329031 | Structure and formation method for chip package | Cheng-Lin Huang, Hsien-Wen Liu, Shin-Puu Jeng | 2022-05-10 |
| 11291116 | Integrated circuit structure | Chen-Hua Yu, Kuo-Chung Yee | 2022-03-29 |
| 11251054 | Integrated passive device package and methods of forming same | Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng | 2022-02-15 |
| 11205579 | Molding wafer chamber | Jing-Cheng Lin, Chin-Chuan Chang, Szu-Wei Lu, Shin-Puu Jeng, Chen-Hua Yu | 2021-12-21 |
| 11158587 | Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices | Po-Hao Tsai, Jing-Cheng Lin | 2021-10-26 |
| 11158588 | Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices | Po-Hao Tsai, Jing-Cheng Lin | 2021-10-26 |
| 11081475 | Integrated circuit structure and method for reducing polymer layer delamination | Jing-Cheng Lin, Hsien-Wen Liu, Min-Chen Lin | 2021-08-03 |
| 11069656 | Three-layer package-on-package structure and method forming same | Feng-Cheng Hsu, Shin-Puu Jeng | 2021-07-20 |
| 11063023 | Semiconductor package | Feng-Cheng Hsu, Shin-Puu Jeng | 2021-07-13 |
| 11037861 | Interconnect structure for package-on-package devices | Jing-Cheng Lin, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen, Chiung-Han Yeh +1 more | 2021-06-15 |
| 11018095 | Semiconductor structure | Chen-Hua Yu, Kuo-Chung Yee | 2021-05-25 |
| 10971483 | Semiconductor structure and manufacturing method thereof | Shin-Puu Jeng, Feng-Cheng Hsu | 2021-04-06 |
| 10964666 | Chip on package structure and method | Chen-Hua Yu, Der-Chyang Yeh, Kuo-Chung Yee | 2021-03-30 |
| 10964594 | Methods of packaging semiconductor devices including placing semiconductor devices into die caves | Jing-Cheng Lin, Yi-Hang Lin, Tsan-Hua Tung | 2021-03-30 |
| 10833039 | Multi-chip fan out package and methods of forming the same | Chen-Hua Yu, Jing-Cheng Lin | 2020-11-10 |
| 10770437 | Semiconductor package and manufacturing method of the same | Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng | 2020-09-08 |
| 10756064 | Manufacturing method of semiconductor package | Feng-Cheng Hsu, Shin-Puu Jeng | 2020-08-25 |