Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10964594 | Methods of packaging semiconductor devices including placing semiconductor devices into die caves | Jing-Cheng Lin, Jui-Pin Hung, Yi-Hang Lin | 2021-03-30 |
| 10163711 | Methods of packaging semiconductor devices including placing semiconductor devices into die caves | Jing-Cheng Lin, Jui-Pin Hung, Yi-Hang Lin | 2018-12-25 |
| 9673098 | Methods of packaging semiconductor devices and structures thereof | Jing-Cheng Lin, Jui-Pin Hung, Yi-Hang Lin | 2017-06-06 |
| 9406581 | Methods of packaging semiconductor devices and structures thereof | Jing-Cheng Lin, Jui-Pin Hung, Yi-Hang Lin | 2016-08-02 |
| 9312148 | Method of packaging a semiconductor device | Jing-Cheng Lin, Jui-Pin Hung, Nai-Wei Liu, Yi-Chao Mao, Wan-Ting Shih | 2016-04-12 |
| 9117682 | Methods of packaging semiconductor devices and structures thereof | Jing-Cheng Lin, Jui-Pin Hung, Yi-Hang Lin | 2015-08-25 |
| 9000584 | Packaged semiconductor device with a molding compound and a method of forming the same | Jing-Cheng Lin, Jui-Pin Hung, Nai-Wei Liu, Yi-Chao Mao, Wan-Ting Shih | 2015-04-07 |