Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368080 | Chip package structure with ring structure | Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Po-Chen Lai, Kuang-Chun Lee +2 more | 2025-07-22 |
| 11728233 | Chip package structure with ring structure and method for forming the same | Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Po-Chen Lai, Kuang-Chun Lee +2 more | 2023-08-15 |
| 10964594 | Methods of packaging semiconductor devices including placing semiconductor devices into die caves | Jing-Cheng Lin, Jui-Pin Hung, Tsan-Hua Tung | 2021-03-30 |
| 10163711 | Methods of packaging semiconductor devices including placing semiconductor devices into die caves | Jing-Cheng Lin, Jui-Pin Hung, Tsan-Hua Tung | 2018-12-25 |
| 10163875 | Method for forming chip package structure with adhesive layer | Li-Hui Cheng, Po-Hao Tsai, Jing-Cheng Lin | 2018-12-25 |
| 9929128 | Chip package structure with adhesive layer | Li-Hui Cheng, Po-Hao Tsai, Jing-Cheng Lin | 2018-03-27 |
| 9673098 | Methods of packaging semiconductor devices and structures thereof | Jing-Cheng Lin, Jui-Pin Hung, Tsan-Hua Tung | 2017-06-06 |
| 9406581 | Methods of packaging semiconductor devices and structures thereof | Jing-Cheng Lin, Jui-Pin Hung, Tsan-Hua Tung | 2016-08-02 |
| 9196594 | Chip package and method for forming the same | Chao-Yen Lin | 2015-11-24 |
| 9117682 | Methods of packaging semiconductor devices and structures thereof | Jing-Cheng Lin, Jui-Pin Hung, Tsan-Hua Tung | 2015-08-25 |
| 9030011 | Chip package and method for forming the same | Chao-Yen Lin | 2015-05-12 |
| 8916972 | Adhesion between post-passivation interconnect structure and polymer | Jing-Cheng Lin, Jui-Pin Hung, Min-Chen Lin | 2014-12-23 |
| 8507321 | Chip package and method for forming the same | Chao-Yen Lin | 2013-08-13 |