Issued Patents All Time
Showing 1–25 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417970 | Method for forming chip package structure | Chin-Hua Wang, Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-09-16 |
| 12394752 | Multi-chip device and method of formation | Chin-Hua Wang, Shu-Shen Yeh, Tsung-Yen Lee, Po-Yao Lin, Shin-Puu Jeng | 2025-08-19 |
| 12374636 | Semiconductor device package with stress reduction design | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2025-07-29 |
| 12368080 | Chip package structure with ring structure | Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Kuang-Chun Lee, Che-Chia Yang +2 more | 2025-07-22 |
| 12368127 | Semiconductor chip package having underfill material surrounding a fan-out package and contacting a stress buffer structure sidewall | Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-07-22 |
| 12362256 | Method for forming semiconductor package structure | Ming-Chih Yew, Po-Yao Lin, Chin-Hua Wang, Shin-Puu Jeng | 2025-07-15 |
| 12341091 | Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape | Chia-Kuei Hsu, Ming-Chih Yew, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2025-06-24 |
| 12334451 | Semiconductor package including package substrate with dummy via and method of forming the same | Chin-Hua Wang, Chun-Wei Chen, Shin-Puu Jeng | 2025-06-17 |
| 12322666 | Package assembly lid and methods for forming the same | Yu-Sheng Lin, Shu-Shen Yeh, Chien-Shen Chen, Po-Yao Lin, Shin-Puu Jeng +3 more | 2025-06-03 |
| 12315768 | Package assembly including lid with additional stress mitigating feet and methods of making the same | Yu-Sheng Lin, Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng +3 more | 2025-05-27 |
| 12308346 | Semiconductor die with tapered sidewall in package | Chin-Hua Wang, Shin-Puu Jeng, Po-Yao Lin, Shu-Shen Yeh, Ming-Chih Yew +1 more | 2025-05-20 |
| 12266635 | Semiconductor device package having dummy dies | Che-Chia Yang, Shu-Shen Yeh, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2025-04-01 |
| 12261102 | Semiconductor package and method of forming the same | Li-Ling Liao, Ming-Chih Yew, Che-Chia Yang, Po-Yao Lin, Shin-Puu Jeng | 2025-03-25 |
| 12255156 | Semiconductor package with riveting structure between two rings and method for forming the same | Chien-Hung Chen, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-03-18 |
| 12255078 | Semiconductor devices and methods of manufacturing | Ming-Chih Yew, Po-Yao Lin, Chien-Sheng Chen, Shin-Puu Jeng | 2025-03-18 |
| 12237276 | Package structure | Chin-Hua Wang, Ming-Chih Yew, Che-Chia Yang, Shu-Shen Yeh, Po-Yao Lin +1 more | 2025-02-25 |
| 12176301 | Package structure and method for forming the same | Chin-Hua Wang, Ming-Chih Yew, Li-Ling Liao, Tsung-Yen Lee, Po-Yao Lin +1 more | 2024-12-24 |
| 12125822 | Method of manufacturing a semiconductor device package having dummy dies | Che-Chia Yang, Shu-Shen Yeh, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2024-10-22 |
| 12113033 | Chip package structure | Chin-Hua Wang, Ming-Chih Yew, Chia-Kuei Hsu, Li-Ling Liao, Po-Yao Lin +1 more | 2024-10-08 |
| 12087705 | Package structure with warpage-control element | Yu-Sheng Lin, Chien-Hung Chen, Po-Yao Lin, Shin-Puu Jeng | 2024-09-10 |
| 12057363 | Chip package structure with multiple gap-filling layers and fabricating method thereof | Ming-Chih Yew, Po-Yao Lin, Chin-Hua Wang, Shin-Puu Jeng | 2024-08-06 |
| 12040285 | Structure and formation method of chip package with reinforcing structures | Ming-Chih Yew, Po-Yao Lin, Yu-Sheng Lin, Shin-Puu Jeng | 2024-07-16 |
| 12035475 | Semiconductor package with stress reduction design and method for forming the same | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 12014969 | Package structure and method for forming the same | Ming-Chih Yew, Li-Ling Liao, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2024-06-18 |
| 11990418 | Chip package structure with buffer structure and method for forming the same | Chin-Hua Wang, Ping-Tai CHEN, Che-Chia Yang, Yu-Sheng Lin, Po-Yao Lin +1 more | 2024-05-21 |