Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431415 | Buffer block structures for C4 bonding and methods of using the same | Ming-Chih Yew, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2025-09-30 |
| 12347764 | Organic interposer including intra-die structural reinforcement structures and methods of forming the same | Ming-Chih Yew, Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-07-01 |
| 12261102 | Semiconductor package and method of forming the same | Ming-Chih Yew, Che-Chia Yang, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2025-03-25 |
| 12176301 | Package structure and method for forming the same | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Tsung-Yen Lee, Po-Yao Lin +1 more | 2024-12-24 |
| 12113033 | Chip package structure | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Chia-Kuei Hsu, Po-Yao Lin +1 more | 2024-10-08 |
| 12040267 | Organic interposer including intra-die structural reinforcement structures and methods of forming the same | Ming-Chih Yew, Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-07-16 |
| 12014969 | Package structure and method for forming the same | Po-Chen Lai, Ming-Chih Yew, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2024-06-18 |
| 11978722 | Structure and formation method of package containing chip structure with inclined sidewalls | Shu-Shen Yeh, Po-Chen Lai, Che-Chia Yang, Po-Yao Lin, Shin-Puu Jeng | 2024-05-07 |
| 11728284 | Chip package structure and method for forming the same | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Chia-Kuei Hsu, Po-Yao Lin +1 more | 2023-08-15 |
| 11705406 | Package structure and method for forming the same | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Tsung-Yen Lee, Po-Yao Lin +1 more | 2023-07-18 |
| 11610835 | Organic interposer including intra-die structural reinforcement structures and methods of forming the same | Ming-Chih Yew, Chia-Kuei Hsu, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-03-21 |
| 10288696 | Intelligent diagnosis system for power module and method thereof | Chih-Chung Chiu, Chih-Ming Tzeng, Yu-Lin Chao, Chih-Ming Shen, Ming-Kaan Liang +2 more | 2019-05-14 |
| 8664509 | Thermoelectric apparatus and method of fabricating the same | Chun-Kai Liu, Ming-Ji Dai, Suh-Yun Feng | 2014-03-04 |
| 8609454 | Self-assembly apparatus, device self-assembling method, and method of assembling thermoelectric devices | Ming-Ji Dai, Chun-Kai Liu, Heng-Chieh Chien, Ker-Win Wang, Yen-Lin Tzeng +1 more | 2013-12-17 |