Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394752 | Multi-chip device and method of formation | Chin-Hua Wang, Po-Chen Lai, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-08-19 |
| 12354867 | Particle removal apparatus | Siao-Chian Huang, Po-Chung Cheng, Ching-Juinn Huang, Tzung-Chi Fu | 2025-07-08 |
| 12283553 | Semiconductor die with warpage release layer structure in package and fabricating method thereof | Chin-Hua Wang, Kuang-Chun Lee, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-04-22 |
| 12191272 | Package structure | Chin-Hua Wang, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2025-01-07 |
| 12176301 | Package structure and method for forming the same | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Li-Ling Liao, Po-Yao Lin +1 more | 2024-12-24 |
| 12124178 | Lithography system and method | Hao-Yu Lan, Po-Chung Cheng, Ching-Juinn Huang, Tzung-Chi Fu | 2024-10-22 |
| 11984314 | Particle removal method | Siao-Chian Huang, Po-Chung Cheng, Ching-Juinn Huang, Tzung-Chi Fu | 2024-05-14 |
| 11982944 | Method of lithography process and transferring a reticle | Hsiao-Lun Chang, Chueh-Chi Kuo, Tzung-Chi Fu, Li-Jui Chen, Po-Chung Cheng +1 more | 2024-05-14 |
| 11967582 | Multi-chip device and method of formation | Chin-Hua Wang, Po-Chen Lai, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2024-04-23 |
| 11756873 | Semiconductor package and manufacturing method thereof | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2023-09-12 |
| 11703763 | Method of lithography process using reticle container with discharging device | Hsiao-Lun Chang, Chueh-Chi Kuo, Tzung-Chi Fu, Li-Jui Chen, Po-Chung Cheng +1 more | 2023-07-18 |
| 11705406 | Package structure and method for forming the same | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Li-Ling Liao, Po-Yao Lin +1 more | 2023-07-18 |
| 11705420 | Multi-bump connection to interconnect structure and manufacturing method thereof | Chia-Kuei Hsu, Shang-Lun Tsai, Ming-Chih Yew, Po-Yao Lin | 2023-07-18 |
| 11694974 | Semiconductor die with warpage release layer structure in package and fabricating method thereof | Chin-Hua Wang, Kuang-Chun Lee, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-07-04 |
| 11675280 | Lithography system and method | Hao-Yu Lan, Po-Chung Cheng, Ching-Juinn Huang, Tzung-Chi Fu | 2023-06-13 |
| 11637087 | Multi-chip device and method of formation | Chin-Hua Wang, Po-Chen Lai, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2023-04-25 |
| 11557559 | Package structure | Chin-Hua Wang, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2023-01-17 |
| 11320733 | Reticle with conductive material structure | Hsiao-Lun Chang, Chueh-Chi Kuo, Tzung-Chi Fu, Li-Jui Chen, Po-Chung Cheng +1 more | 2022-05-03 |
| 11282756 | Organic interposer including stress-resistant bonding structures and methods of forming the same | Chin-Hua Wang, Ming-Chih Yew, Chia-Kuei Hsu, Po-Chen Lai, Po-Yao Lin +1 more | 2022-03-22 |
| 11121018 | Method and apparatus for lithography in semiconductor fabrication | Chueh-Chi Kuo, Chia-Hsin CHOU, Tzung-Chi Fu, Li-Jui Chen, Po-Chung Cheng +1 more | 2021-09-14 |
| 11106146 | Lithography system and method | Hao-Yu Lan, Po-Chung Cheng, Ching-Juinn Huang, Tzung-Chi Fu | 2021-08-31 |
| 11062898 | Particle removal apparatus, particle removal system and particle removal method | Siao-Chian Huang, Po-Chung Cheng, Ching-Juinn Huang, Tzung-Chi Fu | 2021-07-13 |
| 10802394 | Method for discharging static charges on reticle | Hsiao-Lun Chang, Chueh-Chi Kuo, Tzung-Chi Fu, Li-Jui Chen, Po-Chung Cheng +1 more | 2020-10-13 |
| 10714371 | Method and apparatus for lithography in semiconductor fabrication | Chueh-Chi Kuo, Chia-Hsin CHOU, Tzung-Chi Fu, Li-Jui Chen, Po-Chung Cheng +1 more | 2020-07-14 |
| 10684561 | Lithography method | Hao-Yu Lan, Po-Chung Cheng, Ching-Juinn Huang, Tzung-Chi Fu | 2020-06-16 |