Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368142 | Double side integration semiconductor package and method of forming the same | Monsen Liu, Shuo-Mao Chen, Shin-Puu Jeng | 2025-07-22 |
| 12354940 | Redistribution layer structure with support features and methods | Monsen Liu, Shuo-Mao Chen, Shin-Puu Jeng | 2025-07-08 |
| 12355001 | Semiconductor package structure and method for forming the same | Yen-Chu Tu, Monsen Liu, Shuo-Mao Chen, Shin-Puu Jeng | 2025-07-08 |
| 12272629 | Semiconductor device having an integrated device positioned within a hybrid interposer that includes organic and non-organic materials | Monsen Liu, Shuo-Mao Chen, Po-Ying LAI, Shin-Puu Jeng | 2025-04-08 |
| 11705420 | Multi-bump connection to interconnect structure and manufacturing method thereof | Tsung-Yen Lee, Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin | 2023-07-18 |
| 9910350 | Method for repairing a mask | Sheng-Chi Chin, Yuan-Chih Chu, Yueh-Hsun Li | 2018-03-06 |