Issued Patents All Time
Showing 1–25 of 122 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381180 | Multi-chip packages and methods of forming the same | Feng-Cheng Hsu, Han-Hsiang Huang, Hsien-Wen Liu, Shin-Puu Jeng, Hsiao-Wen Lee | 2025-08-05 |
| 12368142 | Double side integration semiconductor package and method of forming the same | Monsen Liu, Shang-Lun Tsai, Shin-Puu Jeng | 2025-07-22 |
| 12355001 | Semiconductor package structure and method for forming the same | Yen-Chu Tu, Shang-Lun Tsai, Monsen Liu, Shin-Puu Jeng | 2025-07-08 |
| 12354940 | Redistribution layer structure with support features and methods | Monsen Liu, Shang-Lun Tsai, Shin-Puu Jeng | 2025-07-08 |
| 12322742 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Mill-Jer Wang, Feng-Cheng Hsu, Chao-Hsiang Yang, Shin-Puu Jeng +4 more | 2025-06-03 |
| 12293974 | Photonics integrated circuit package | Feng-Wei Kuo, Chewn-Pu Jou | 2025-05-06 |
| 12293141 | Integrated circuit stack verification method and system for performing the same | Feng-Wei Kuo, Chin-Yuan Huang, Kai-Yun Lin, Ho-Hsiang Chen, Chewn-Pu Jou | 2025-05-06 |
| 12272629 | Semiconductor device having an integrated device positioned within a hybrid interposer that includes organic and non-organic materials | Monsen Liu, Po-Ying LAI, Shang-Lun Tsai, Shin-Puu Jeng | 2025-04-08 |
| 12243800 | Package structure with lid and method for forming the same | Shin-Puu Jeng, Po-Yao Lin, Feng-Cheng Hsu, Chin-Hua Wang | 2025-03-04 |
| 12224266 | Semiconductor packages including passive devices and methods of forming same | Shin-Puu Jeng, Po-Yao Chuang | 2025-02-11 |
| 12218080 | Package structure with reinforced element | Shin-Puu Jeng, Po-Yao Lin, Chia-Hsiang Lin | 2025-02-04 |
| 12218095 | Chip package structure having molding layer | Shin-Puu Jeng, Feng-Cheng Hsu | 2025-02-04 |
| 12205861 | Manufacturing method of semiconductor package including forming cavity in circuit substrate without exposing floor plate | Meng-Liang Lin, Po-Yao Chuang, Te-Chi Wong, Shin-Puu Jeng | 2025-01-21 |
| 12170274 | Semiconductor packages and methods of forming same | Shin-Puu Jeng, Techi Wong, Po-Yao Chuang, Meng-Wei Chou | 2024-12-17 |
| 12159791 | Info packages including thermal dissipation blocks | Ching-Yi Lin, Yu-Hao Chen, Fong-Yuan Chang, Po-Hsiang Huang, Jyh Chwen Frank Lee | 2024-12-03 |
| 12154888 | Semiconductor package and method of manufacturing the same | Chia-Kuei Hsu, Feng-Cheng Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2024-11-26 |
| 12125833 | Integrated circuit package and method forming same | Shin-Puu Jeng, Feng-Cheng Hsu | 2024-10-22 |
| 12125755 | Chip package structure with cavity in interposer | Shin-Puu Jeng, Feng-Cheng Hsu | 2024-10-22 |
| 12113025 | Semiconductor package with dual sides of metal routing | Shin-Puu Jeng, Hsien-Wen Liu, Po-Yao Chuang, Feng-Cheng Hsu, Po-Yao Lin | 2024-10-08 |
| 12094810 | Reinforcing package using reinforcing patches | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Feng-Cheng Hsu, Shin-Puu Jeng | 2024-09-17 |
| 12046548 | Chip package with redistribution structure having multiple chips | Shin-Puu Jeng, Po-Hao Tsai, Po-Yao Chuang, Feng-Cheng Hsu, Techi Wong | 2024-07-23 |
| 11948914 | Chip package structure with integrated device integrated beneath the semiconductor chip | Feng-Cheng Hsu, Shin-Puu Jeng | 2024-04-02 |
| 11942408 | Semiconductor structure and manufacturing method thereof | Feng-Cheng Hsu, Shin-Puu Jeng | 2024-03-26 |
| 11935837 | Photonics integrated circuit package | Feng-Wei Kuo, Chewn-Pu Jou | 2024-03-19 |
| 11915992 | Method for forming package structure with lid | Shin-Puu Jeng, Po-Yao Lin, Feng-Cheng Hsu, Chin-Hua Wang | 2024-02-27 |