Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424586 | Bridging-resistant microbump structures and methods of forming the same | Yen-Hao Chen, Chien-Sheng Chen, Shin-Puu Jeng | 2025-09-23 |
| 12381180 | Multi-chip packages and methods of forming the same | Shuo-Mao Chen, Feng-Cheng Hsu, Hsien-Wen Liu, Shin-Puu Jeng, Hsiao-Wen Lee | 2025-08-05 |
| 12362299 | Basin-shaped underbump plates and methods of forming the same | Yen-Hao Chen, Yu-Sheng Lin, Chien-Sheng Chen, Shin-Puu Jeng | 2025-07-15 |
| 12074101 | Package structure and method of fabricating the same | Yu-Sheng Lin, Chien-Sheng Chen, Shu-Shen Yeh, Shin-Puu Jeng | 2024-08-27 |
| 11835979 | Voltage regulator device | — | 2023-12-05 |
| 11823887 | Package structure and method of fabricating the same | Yu-Sheng Lin, Chien-Sheng Chen, Shu-Shen Yeh, Shin-Puu Jeng | 2023-11-21 |
| 11756928 | Multi-chip packages | Shuo-Mao Chen, Feng-Cheng Hsu, Hsien-Wen Liu, Shin-Puu Jeng, Hsiao-Wen Lee | 2023-09-12 |
| 11526189 | Voltage reduction circuit for bandgap reference voltage circuit | — | 2022-12-13 |
| 11342306 | Multi-chip wafer level packages | Shuo-Mao Chen, Feng-Cheng Hsu, Hsien-Wen Liu, Shin-Puu Jeng, Hsiao-Wen Lee | 2022-05-24 |
| 11216021 | Current generation circuit | — | 2022-01-04 |
| 11189596 | Methods of forming multi-chip wafer level packages | Shuo-Mao Chen, Feng-Cheng Hsu, Hsien-Wen Liu, Shin-Puu Jeng, Hsiao-Wen Lee | 2021-11-30 |
| 10763239 | Multi-chip wafer level packages and methods of forming the same | Shuo-Mao Chen, Feng-Cheng Hsu, Hsien-Wen Liu, Shin-Puu Jeng, Hsiao-Wen Lee | 2020-09-01 |
| 9263941 | Power factor-corrected resonant converter and parallel power factor-corrected resonant converter | Lon-Kou Chang, Yi-Wen Huang | 2016-02-16 |
| 8937463 | Common-core power factor correction resonant converter | Lon-Kou Chang, Yi-Wen Huang | 2015-01-20 |
| 8787051 | Method and apparatus for controlling the equivalent resistance of a converter | Lon-Kou Chang, Yi-Wen Huang | 2014-07-22 |
| 7557423 | Semiconductor structure with a discontinuous material density for reducing eddy currents | Kai-Ming Ching, Chen Chen-Shien, Chih-Hua Chen, Chen-Cheng Kuo | 2009-07-07 |
| 6229702 | Ball grid array semiconductor package having improved heat dissipation efficiency, overall electrical performance and enhanced bonding capability | Su Tao, Chin-Long Wu, Tai-Chun Huang, Shih-Kuang Chen, Shin-Hua Chao | 2001-05-08 |
| 6191360 | Thermally enhanced BGA package | Su Tao, Kun-Ching Chen, Chun-Chi Lee | 2001-02-20 |