Issued Patents All Time
Showing 25 most recent of 77 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7605020 | Semiconductor chip package | Shih-Chang Lee | 2009-10-20 |
| 7473581 | Wafer stacking package method | — | 2009-01-06 |
| 7321168 | Semiconductor package and method for manufacturing the same | — | 2008-01-22 |
| 7291926 | Multi-chip package structure | Yu-Fang Tsai | 2007-11-06 |
| 7253529 | Multi-chip package structure | Yu-Fang Tsai | 2007-08-07 |
| 7168352 | Process for sawing substrate strip | Jau-Yuen Su, Tao-Yu Chen | 2007-01-30 |
| 7151308 | Semiconductor chip package | Shih-Chang Lee | 2006-12-19 |
| 7141867 | Quad flat non-leaded package | Chi-Wen Chang | 2006-11-28 |
| 7129583 | Multi-chip package structure | Yu-Fang Tsai | 2006-10-31 |
| 7102241 | Leadless semiconductor package | — | 2006-09-05 |
| 7064428 | Wafer-level package structure | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2006-06-20 |
| 7037759 | Semiconductor package and method for manufacturing the same | — | 2006-05-02 |
| 7023082 | Semiconductor package and manufacturing method thereof | — | 2006-04-04 |
| 7009302 | Micromachine package and method for manufacturing the same | — | 2006-03-07 |
| 7002805 | Thermal enhance MCM package and manufacturing method thereof | Shih-Chang Lee, Chian-Chi Lin | 2006-02-21 |
| 7002257 | Optical component package and packaging including an optical component horizontally attached to a substrate | Kuo-Chung Yee, Jen-Chieh Kao | 2006-02-21 |
| 6967153 | Bump fabrication process | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2005-11-22 |
| 6946729 | Wafer level package structure with a heat slug | Chun-Chi Lee | 2005-09-20 |
| 6939790 | Wafer bumping process with solder balls bonded to under bump metallurgy layer formed over active surface by forming flux on solder ball surfaces and reflowing the solder | Jau-Shoung Chen | 2005-09-06 |
| 6933605 | Semiconductor package | Chi-Tsung Chiu, Sung-Mao Wu | 2005-08-23 |
| 6927964 | Structure for preventing burnt fuse pad from further electrical connection | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2005-08-09 |
| 6908842 | Bumping process | Jau-Shoung Chen | 2005-06-21 |
| 6891274 | Under-bump-metallurgy layer for improving adhesion | William T. Chen, Ho-Ming Tong, Chun-Chi Lee, Jeng-Da Wu, Chih-Huang Chang +1 more | 2005-05-10 |
| 6877653 | Method of modifying tin to lead ratio in tin-lead bump | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2005-04-12 |
| 6864168 | Bump and fabricating process thereof | William T. Chen, Ho-Ming Tong, Chun-Chi Lee, Chih-Huang Chang, Jeng-Da Wu +2 more | 2005-03-08 |